Sumco Corporation

Asahi Kasei Fibers Corporation

Alcare Co., Ltd.

Plibrico Japan Company Ltd.

Asahi Kasei Kabushiki Kaisha

Tomoya Tanaka

Ryota Watanabe

Kazufumi Kato

Shigeru Okuuchi

Rumina Obi

Takabumi Kubo

Chie Okamura

Katsumi Nonaka

Shinya Yamamuro

Mitsuhiro Endou

Keisuke Gozu

Junki Saito

Yasushi Isono

The present invention provides a foam having a surface which solates or gelates after absorption of water and appropriately absorbs the water. The foam is prepared by a foam reaction of a mixture comprising at least one polyol, a compound having at least one isocyanate group, and a hydrophilic polymer.

Foam and composition for foam

An object of the present invention is to provide a noise absorbing fabric in which electromagnetic waves are not susceptible to being reflected and which has superior noise absorbing ability, a noise absorbing fabric having noise absorbing ability across a wide band, a noise absorbing fabric that is soft, highly flexible, thin, and can be incorporated in intricate portions of electronic components or housings and the like by being bent or folded and the like, and a noise absorbing fabric that can be easily and stably produced without using an expensive soft magnetic material, is inexpensive and demonstrates high performance. In the noise absorbing fabric, a metal is subjected to metal processing on at least one side of a fabric, and the common logarithmic value of the surface resistivity of the surface subjected to metal processing is within the range of 0 to 4.

Noise absorbing fabric

A silicon wafer cleaning method, comprising a first cleaning process, in which, after completion of mirror polishing of the surface, the silicon wafer is immersed in a non-ionic surfactant aqueous solution; a second cleaning process, in which the wafer, after completion of the first cleaning process, is immersed in a dissolved-ozone aqueous solution; and, a third cleaning process, in which the wafer, after completion of the second cleaning process, is immersed in an aqueous solution containing ammonia and hydrogen peroxide; and in which the processes are performed in succession.

Silicon wafer cleaning method

There are provided a shaft adapted for introduction into a tubular member made of refractory material and an expander provided on a leading edge of the shaft. The expander has both ends provided with a repairing material container and a seat plate. With the repairing material container having monolithic refractory material loaded therein confronted to a damaged portion in an inner wall of the tubular member, the expander is expanded by a driving motor to push the repairing material container toward the damaged portion while pushing the seat plate in contact with a wall surface opposite to the damaged portion in behind. Thus, the monolithic refractory material is filled and deposited in the damaged portion under remote control.

Apparatus and method for repairing a damaged portion in a tubular member made of refractory material

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Tokyo, Japan

Tomoya Tanaka