Sintai Optical (shenzhen) Co., Ltd.

Asia Optical Co., Ltd.

Asia Optical International Ltd.

Tomoya Takahashi

Takayuki Karasawa

Naofumi Imai

Gui-Feng Li

Yasuhiko Nakayama

Xian-Bang Xie

Masahiro Koike

Haruhiko Nishizawa

A headphone device includes a housing, a sound generator and a tube. The housing includes a main body and a cover plate. The cover plate includes a first surface and a second surface. The first surface is disposed towards the main body and connected to the main body to form an internal space. The second surface is disposed opposite to the first surface. The sound generator is disposed in the internal space. The tube includes a tubular body, a first end and a second end. The tubular body is disposed between the first end and the second end. The tubular body has a cross section which is in a closed shape. The second surface of the cover plate is disposed towards the tubular body. The tubular body and the second surface are disposed in parallel or have an included angle less than twenty degrees.

Headphone device

An earpiece device includes a housing, a sound generator and a first blocker. The sound generator includes a first loudspeaker which includes a vibrating board. The vibrating board includes a first sound generating surface and a second sound generating surface. The first sound generating surface is disposed towards the exterior of the housing. The second sound generating surface is disposed opposite to the first sound generating surface. The first blocker includes a first portion, a second portion, a first side surface and a second side surface. The first side surface is disposed towards the first sound generating surface. The second side surface is disposed opposite to the first side surface. The first portion is disposed between the first side surface and the second side surface and is fixed to the cover plate. The second portion is disposed opposite to the first portion and is distant from the cover plate.

Earpiece device

Headphone

A headphone is provided. The headphone includes a housing and an speaker. The housing includes a first layer structure, a first receiving space, a first output path, a first trench and a sound output side. The speaker is located in the first receiving space, wherein the speaker includes a first speaker orientation, and the first speaker orientation corresponds to the first output path. The first output path includes the first trench, which is located at the first layer structure, extends around the speaker, and is connected to the sound output side.

A headphone is provided. The headphone includes a housing, a first speaker and a second speaker. The housing includes a sound output side, a first layer structure, a first output path, a first trench, a first recess, and a second recess. The first speaker is disposed in the first recess, wherein the first speaker includes a first speaker orientation, and the first speaker orientation corresponds to the first output path. The second speaker is disposed in the second recess. The first output path includes the first trench, which is located at the first layer structure, that extends around the first speaker, and is connected to the sound output side.

A headphone device includes a container and a first electrical connector. The container includes a first loudspeaker disposed in the container, a second loudspeaker disposed in the container, and a first cross-feed loudspeaker disposed in the container. The first electrical connector is disposed on the container, and is electrically connected to the first loudspeaker, the second loudspeaker and the first cross-feed loudspeaker.

Growing community of inventors

Taichung, Taiwan

Tomoya Takahashi