Kabushiki Kaisha Nihon Micronics

Tomoya Sato

Takayuki Hayashizaki

Hideki Hirakawa

Toshinaga Takeya

Akira Souma

Masahisa Tazawa

Shoji Kamata

Yoshikazu Urushiyama

A contact for an electrical test comprises a first area to be bonded to a board, a second area extending in the right-left direction from the lower end portion of the first area, a third area projecting downward from the tip end portion of the second area, and a low light reflective film having lower light reflectance than that of the first area. The third area has a probe tip to be contacted an electrode of an electronic device. The low light reflective film is formed on a surface of at least the bonding part of the first area to the board and its proximity.

Contact for electrical test of electronic devices, probe assembly and method for manufacturing the same

A probe for current test is provided. The probe includes a probe body having a plate-like connection portion whose end face becomes a connection face to a probe board, a solder layer formed on at least one side face of said connection portion, and a guide portion formed on the connection portion. The guide portion penetrates the connection portion in its thickness direction from the one side face with the solder layer formed to the other side face. When the solder layer is melted, the guide portion guides a portion of the melted solder to the other side face.

Current test probe having a solder guide portion, and related probe assembly and production method

Growing community of inventors

Hirakawa, Japan

Tomoya Sato