The Furukawa Electric Co., Ltd.

Nippon Steel Sumitomo Metal Corporation

Nippon Steel Corporation

Tomoya Kato

Yoshito Isei

Masahiro Osugi

Toshio Kimura

Takeo Shimizu

Yutaka Oki

Toshiaki Amano

Hideyuki Takahashi

Hisaki Sakamoto

Masahiro Sugimoto

Kenzo Kobayashi

Masayuki Minamino

Hideki Ii

Daisuke Asami

Kota Katayama

Yoshihiro Onuma

Yasuhiro Aihara

Sadayoshi Kanamaru

The present invention provides a surface following nozzle, an observation device for a moving object surface, and an observation method for the moving object surface that can remove water in the vicinity of the nozzle while following changes in the shape and changes in the distance of a moving object. A surface following nozzle includes a nozzle that injects gas from a tip end thereof, a separating part that closes a base end of the nozzle, and an extending and contracting part that is provided at a rear side of the nozzle via the separating part, and extends and contracts along an axial direction of the nozzle. The extending and contracting part includes an elastic body that applies a forward force with respect to the nozzle.

Surface following nozzle, observation device for moving object surface, and observation method for moving object surface

A method for measuring flatness of a sheet includes acquiring a pattern image by projecting a light and dark pattern composed of light portions and dark portions onto a surface of the sheet, which is traveling between adjacent rolling stands, from a projection unit situated between the rolling stands, and capturing an image of the light and dark pattern with an image capture unit situated between the rolling stands, and measuring the flatness by analyzing the acquired pattern image. Arrangement parameters L, &#x3b1;, &#x3b2;, hc and hp satisfy the following mathematical expression (1). 

Method for measuring flatness of sheet, device for measuring flatness of sheet, and production method for steel sheet

A method for measuring flatness of a sheet material in which a light and dark pattern composed by a light portion and a dark portion is projected onto a surface of the sheet material running in a longitudinal direction, a pattern image is acquired by photographing the light and dark pattern by an image pickup device having an image pickup visual field larger than a width of the sheet material, and the flatness of the sheet material is measured by analyzing the acquired pattern image. A staggered pattern is used for the projecting step and for light to be specularly reflected for receipt by the image pickup device. Calculating the flatness also includes steps of setting a shape measurement line, averaging picture element concentrations, calculating a distribution of the concentrations, and calculating the flatness based on surface shape using the distribution.

Method for measuring sheet material flatness and method for producing steel sheet using said measuring method

Measuring sheet material flatness includes projecting a bright and dark pattern made up of bright parts and dark parts onto a sheet material surface travelling in a lengthwise direction, picking up an image of pattern with image pickup device to acquire a pattern image, with the pickup device having a field of view larger than a sheet material width. The acquired pattern image is analyzed, wherein a pattern in which a bright part is disposed at a predetermined set pitch respectively in longitudinal and lateral directions is formed by an LED light at a predetermined pitch respectively in the longitudinal and lateral directions. The pattern is projected onto the surface such that the longitudinal direction of the pattern lies along a lengthwise direction of the sheet material, and the lateral direction of the pattern lies along a width direction of the sheet material.

Method for measuring flatness of sheet material and method for manufacturing steel sheet using the same

A semiconductor laser module according to the present invention has a semiconductor laser element for outputting a laser beam and a package hermitically containing and sealing the semiconductor laser element. The package has a vent for introducing and/or exhausting a low heat conduction type gas into or from the package. The vent is hermetically sealed by swaging and welding the external end thereof after the low heat conduction type gas has been introduced into or exhausted form the package.

Semiconductor laser module and method of making the same

A semiconductor laser module having a package containing a semiconductor laser device and lead pins provided on both the side surfaces of the package . Since a base end portion of the lead pin is fixed to the side surface at a position higher than the bottom surface of the package , the lead pin can be laterally bent at a position higher than the bottom surface. Therefore, the semiconductor laser module can be mounted on the surface of the wiring board while the bottom surface of the package is in close contact with the wiring board . Thus, since a heat radiation path from the bottom surface of the package to the wiring board is secured, it is possible to reduce the instability in the operating characteristic of the semiconductor laser device due to the thermal effect.

Optical module

In a semiconductor pumping light source module according to the present invention, a fiber grating (FBG) is disposed, outside a ferrule, in an optical fiber that is inside a protective tube to define a cavity between the FBG and the semiconductor laser device. The FBG is disposed, outside the ferrule, in the optical fiber that is inside the protective tube inside a protective boot. The FBG is disposed on the optical fiber at a portion where no adhesive exists inside the protective tube. The semiconductor pumping light source module is used as a pumping light source of the optical amplifier. The semiconductor pumping light source is also used as the pumping light source of a Raman amplifier.

Semiconductor laser module and amplifier using the module

An insulating sheet having through holes formed therein at positions where circuit patterns formed on its both surfaces are electrically connected is prepared. A sheet for forming a hole bottom is attached to one surface of the insulating sheet. Subsequently, a first-layer circuit pattern is printed on the other surface of the insulating sheet to which the hole-bottom sheet is not attached, and a conductive paste is filled into the holes. Thereafter, the hole-bottom sheet is removed. Then, a second-layer circuit pattern is printed on the surface of the insulating sheet, from which the hole-bottom sheet is removed. With this process, a two-layer printed circuit sheet is manufactured.

Growing community of inventors

Tokyo, Japan

Tomoya Kato