Showa Denko K.k.

Kabushiki Kaisha Toyota Jidoshokki

Tomoya Hirano

Shogo Mori

Kazuhiko Minami

Yoshitaka Iwata

Takashi Okamoto

A heat exchanger comprises a first plate and a second plate. A coolant flow passage is formed by brazing the first plate and the second plate by use of a first brazing filler metal. A pipe is brazed between a first groove portion provided in the first plate and a second groove portion provided in the second plate by use of a second brazing filler metal. A pair of first flanges provided contiguously with the first groove portion. Each of the first flanges includes an inner surface. A pair of second flanges provided contiguously with the second groove portion. Each of the second flanges includes an inner surface. At least one of the inner surfaces of the first flanges and the inner surfaces of the second flanges is covered with the second brazing filler metal. The first and second flanges are held by jigs upon brazing of the pipe.

Heat exchanger and method of joining heat exchanger pipe

A back metal layer () has a plurality of stress relaxation spaces (). Each stress relaxation space () is formed to open at least at one of the front surface and the back surface of the back metal layer (). A region in the back metal layer () that is directly below a semiconductor device () is defined as a directly-below region (A), and a region outside the directly-below region (A) that corresponds to and has the same dimensions as the directly-below region (A) is defined as a comparison region (A). The volume of the stress relaxation spaces () in the range of the directly-below region (A) is less than the volume of the stress relaxation spaces () formed in the range of the comparison region (A).

Growing community of inventors

Oyama, Japan

Tomoya Hirano