Murata Manufacturing Co., Ltd.

Tomoya Bando

Ken Tonegawa

Harufumi Mandai

Norihiro Shimada

Teruhisa Tsuru

Mitsuhiro Matsumoto

Yoshihiro Yoshimoto

Ryo Tatsumi

Jun Sasaki

Makoto Tochigi

Kiyoshi Yamaguchi

Yasunori Nabetani

A high-frequency module enabling sufficient attenuation over a wide frequency range outside of a passband includes a triplexer including a combination of an LPF, a BPF, and HPFs arranged to demultiplex a signal input from a common terminal into a first communication signal, a second communication signal, and a third communication signal in different frequency bands, and to output the first, second, and third communication signals from individual terminals. The individual terminals of the triplexer are connected to respective baluns. The baluns are configured such that the respective passbands of the baluns overlap the respective frequency bands of the communication signals and the respective passbands of the triplexer, and the attenuation of the baluns at the attenuation poles of the triplexer is &#x2212;3 dB or greater. This configuration provides high attenuation in the rebound bands of the attenuation poles.

High-frequency signal balancing multiplexer

A mixer, which is a single balanced mixer, includes an LO port for inputting an LO signal, an RF port for inputting an RF signal, an IF port for outputting an IF signal, a balun for converting an unbalanced signal into a balanced signal, and a pair of mixer diodes connected in series. The mixer further includes a high-pass filter for blocking LO and IF signals and passing an RF signal and a low-pass filter for blocking LO and RF signals and passing an IF signal.

Mixer and converter using same

A multilayer ceramic substrate with a cavity includes a multilayer composite member including a plurality of ceramic layers disposed one on another. A cavity is formed in the multilayer composite member such that an opening of the cavity is located in one principal surface of the multilayer composite member. A bottom-surface conductive film is disposed on the bottom surface of the cavity. A capacitor conductive film is disposed in the multilayer composite member such that the capacitor conductive film faces the bottom-surface conductive film via one of the ceramic layers, thereby forming a capacitor.

Multilayer ceramic substrate with a cavity

A power distributing and synthesizing device which comprises first to third signal terminals, first and second transmission lines and a resistor. The first signal terminal is provided at the connection portion between one end of the first transmission line and one end of the second transmission line; the second signal terminal is provided at the other end of the first transmission line; and the third signal terminal is provided at the other end of the second transmission line. The resistor is connected between the second signal terminal and the third signal terminal. LC serial resonators each comprising an inductor and a capacitor are respectively connected between the first to third signal terminals and a ground.

Power distributing and synthesizing device and mobile communication equipment using same

A receiving module and a TDMA-system receiver are adapted to broadening of bands of received signals and low frequencies of intermediate frequency signals. These apparatuses can be made compact and contribute to cost reduction. The receiving module is constituted of a low-noise amplifier, a high frequency LC filter, a Gilbert-cell type mixer, and baluns. A signal received by an antenna is amplified by the low-noise amplifier and is passed through the LC filter. After that, the signal is mixed with a local oscillation signal by the Gilbert-cell type mixer to be converted into an intermediate frequency signal.

Receiving module and receiver

A high-frequency composite component can achieve reduction in size and weight, while providing high performance. A portable wireless device incorporates the high-frequency composite component, including a multi-layer substrate, with a low noise amplifier LNA and a band pass filter BPF constituting parts of a high-frequency circuit, with an input terminal, an output terminal, and control terminals on the substrate. The low noise amplifier LNA is constituted of transistors, an inductor, capacitors, and resistors. The band pass filter BPF is constituted of strip lines, an inductor, and capacitors. The low noise amplifier LNA and the band pass filter BPF are connected with each other within the substrate via a matching capacitor. The amplifier ground and filter ground are separated within the substrate and connected respectively to separate ground terminals on the substrate. In another embodiment, the high-frequency composite component may include a mixer and a high-pass filter integrated with a multi-layer substrate.

High-frequency composite component and portable wireless device incorporating the component

A high-frequency filter serving as a bandpass filter has three transmission lines SL to SL side-coupled in three stages. The transmission lines SL to SL are respectively connected in parallel to capacitors C to C . One end of the input transmission line SL is connected to an input terminal Pi through an input capacitor C . One end of the output transmission line SL is connected to an output terminal Po through an output capacitor C . The other ends of the transmission lines SL and SL are connected and the connection point is connected to the ground through an inductor Lg for forming a pole. One end of the transmission line SL is connected to the ground.

High-frequency filter, complex electronic component using the same, and portable radio apparatus using the same

The invention provides a complex electronic component, comprising; a multilayer substrate formed by laminating a plurality of dielectric layers; a first concave part being provided at least at the bottom surface of said multilayer substrate; a filter comprising at least one first passive element disposed within said multilayer substrate; an external terminal provided on at least one of the flat portion of the bottom surface and the side face of said multilayer substrate; either one of an active element or a second passive element mounted on the top surface of said multilayer substrate, a surface acoustic wave element mounted inside of said first concave portion of said multilayer substrate; and a flat cap provided at the opening of said first concave portion of said multilayer substrate so as to cover said opening said first concave portion. The size of the above complex electronic component is compact.

Complex electronic component with a first multilayer filter having a cavity in which a second filter is mounted

Complex electronic component

A high-frequency filter 10 serving as a bandpass filter has three transmission lines SL11 to SL13 side-coupled in three stages. The transmission lines SL11 to SL13 are respectively connected in parallel to capacitors C11 to C13. One end of the input transmission line SL11 is connected to an input terminal Pi through an input capacitor C14. One end of the output transmission line SL13 is connected to an output terminal Po through an output capacitor C15. The other ends of the transmission lines SL11 and SL13 are connected and the connection point is connected to the ground through an inductor Lg for forming a pole in the transmission characteristic of the high-frequency filter. One end of the transmission line SL12 is connected to the ground.

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Omihachiman, Japan

Tomoya Bando