Nippon Shokubai Co., Ltd.

Seiko Epson Corporation

Kyoto University

Tomoya Arai

Takeo Kawase

Junichi Karasawa

Masahiro Murakami

Kazuki Kimura

Kenji Tada

Nobuya Tanaka

Keiichi Inoue

Yukihiro Kasano

Munehiro Hasegawa

Tsuyoshi Goya

Kazushi Omote

Kimiaki Nishimura

Yoichi Arimoto

Takuro Yasuda

Kazushi Horie

Keiko Ando

Yoshinobu Asako

Naoki Ishida

Mizuna Narumi

Masanori Aoki

It is an object to provide a water-absorbing resin that while maintaining water-absorbing resin physical properties such as water absorption performance, has a sufficiently reduced odor produced during swelling. The object is attained by causing the water-absorbing resin to be a water-absorbing resin which is a surface-crosslinked water-absorbing resin, the water-absorbing resin having a volatile component concentration of 3.5 ppm or less as measured when the water-absorbing resin is caused to stand still for 15 minutes under a condition that the water-absorbing resin has a swelling capacity of 1.0-fold.

Water-absorbing resin and manufacturing method for same

The present invention provides an organic semiconductor element which has a low hygroscopic property and whose property is hardly deteriorated with time and an electronic device and electronic equipment each provided with such an organic semiconductor element and having high reliability. The organic semiconductor element of the present invention includes: a source electrode; a drain electrode; a gate electrode; a gate insulating layer; an organic semiconductor layer; and a buffer layer (another insulating layer), wherein at least one of the gate insulating layerand the buffer layercontains an insulating polymer with a main chain having both end portions and including repeating units represented by the following general formula (1) or (2): 

Organic semiconductor element, method of manufacturing organic semiconductor element, electronic device, electronic equipment and insulating layer forming composition

The present invention provides novel boron compounds which are useful, depending on their characteristics, as light-emitting materials, electron-transport materials, electron-injection materials, hole-blocking materials, or organic semiconductor materials, and which have new molecular structures quite different from those of the heretofore known boron compounds; their production processes; and functional electronic devices using the same. The novel boron compounds are, for example, those of the following formula (1): These boron compounds can be produced by, for example, reacting boron compounds of the following formula (4): with compounds of the following formula (5): in the presence of a catalyst containing at least one metal element selected from the group consisting of palladium, platinum, and nickel. These boron compounds are used for the functional electronic devices.

Boron compounds, their production processes, and functional electronic devices using same

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Suita, Japan

Tomoya Arai