Dowa Metaltech Co., Ltd.

Dowa Holdings Co., Ltd.

The Goodsystem Corporation

Thegoodsystem Corp.

Tomotsugu Aoyama

Hiroto Narieda

Akira Sugawara

Takanobu Sugimoto

Kuniaki Miyagi

Hideki Endo

Takashi Suga

Tsuyoshi Ito

Young-suk Kim

Hisashi Suda

Kazuki Yoshida

Weilin Gao

Meoung-whan Cho

Akifumi Onodera

Il-ho Kim

Seog-woo Lee

Naota Higami

Meoung Whan Cho

Ilho Kim

There are provided an inexpensive copper alloy plate having excellent bending workability, excellent stress corrosion cracking resistance and excellent stress relaxation resistance while maintaining the high strength thereof, and a method for producing the same. The copper alloy plate has a chemical composition which contains 17 to 32% by weight of zinc, 0.1 to 4.5% by weight of tin, 0.5 to 2.5% by weight of silicon, 0.01 to 0.3% by weight of phosphorus and the balance being copper and unavoidable impurities, the total of the content of silicon and six times as much as the content of phosphorus being 1% by weight or more, the copper alloy plate having a crystal orientation wherein I{220}/I{420} in the range of from 2.5 to 8.0 assuming that the X-ray diffraction intensity on {220} crystal plane on the plate surface of the copper alloy plate is I{220} and that the X-ray diffraction intensity on {420} crystal plane thereon is I{420}.

Copper alloy plate and method for producing same

There are provided a clad material and a method for producing the same, the clad material being capable of preventing cracks from being formed and preventing the separation of layers thereof from being caused, even if it is punched by press-working (even if a high shearing force is applied thereto by thermal shock. After each of Mo—Cu layers, which has a metal filmof a metal selected from the group consisting of Co, Ti, Pd, Pt and Ni on at least one side thereof is arranged on a corresponding one of both sides of a Cu-graphite layer, which is obtained by sintering a graphite powder having a Cu film on the surface thereof, so as to allow the metal filmto contact the Cu-graphite layer, the layers are heated while a pressure is applied between the Cu-graphite layerand the Mo—Cu layers

Clad material and method for producing same

An inexpensive sheet material of a copper alloy has excellent bending workability and excellent stress corrosion cracking resistance while maintaining high strength. The sheet material is produced by a method including melting and casting raw materials of a copper alloy which has a chemical composition having 17 to 32 wt. % of zinc, 0.1 to 4.5 wt. % of tin, 0.01 to 2.0 wt. % of silicon, 0.01 to 5.0 wt. % of nickel, and the balance being copper and unavoidable impurities; hot-rolling the cast copper alloy at 900&#xb0; C. to 400&#xb0; C.; cooling the hot-rolled copper alloy at 1 to 15&#xb0; C./min. from 400&#xb0; C. to 300&#xb0; C.; cold-rolling the cooled copper alloy; recrystallization-annealing the cold-rolled copper alloy at 300 to 800&#xb0; C.; and then, ageing-annealing the recrystallization-annealed copper alloy at 300 to 600&#xb0; C.

Sheet matertal of copper alloy and method for producing same

A heat sink plate includes a first layer made of copper (Cu) or a copper (Cu) alloy, a second layer formed on the first layer and made of molybdenum (Mo) or an alloy that includes copper (Cu) and one or more components selected from molybdenum (Mo), tungsten (W), carbon (C), chromium (Cr), titanium (Ti), and beryllium (Be), a third layer formed on the second layer and made of copper (Cu) or a copper (Cu) alloy, a fourth layer formed on the third layer and made of molybdenum (Mo) or an alloy that includes copper (Cu) and one or more components selected from molybdenum (Mo), tungsten (W), carbon (C), chromium (Cr), titanium (Ti), and beryllium (Be), and a fifth layer formed on the fourth layer and made of copper (Cu) or a copper (Cu) alloy.

Heat sink plate

A copper alloy sheet material contains, in mass %, Fe: 0.05 to 2.50%, Mg: 0.03 to 1.00%, and P: 0.01 to 0.20%, and the contents of these elements satisfy the relation Mg-1.18(P&#x2014;Fe/3.6)0.03. The Mg solid-solution ratio determined by the amount of dissolved Mg (mass %)/the Mg content of the alloy (mass %) ' 100 is 50% or more. The density of an Fe&#x2014;P-based compound having a particle size of 50 nm or more is 10.00 particles/10 mmor less, and the density of an Mg&#x2014;P-based compound having a particle size of 100 nm or more is 10.00 particles/10 mmor less. The Cu&#x2014;Fe&#x2014;P&#x2014;Mg-based copper alloy sheet material is excellent in terms of electrical conductivity, strength, bending workability, and stress relaxation resistance in the case where load stress is applied in a direction perpendicular to both a rolling direction and a sheet thickness direction.

Copper alloy sheet material and current-carrying component

A copper alloy sheet material has a copper alloy component system that has a high conductivity of 75.0% IACS or more and has both high strength and good stress relaxation resistance characteristics. A copper alloy sheet material has a composition containing, by mass %, from 0.01 to 0.50% of Zr, from 0.01 to 0.50% of Sn, a total content of from 0 to 0.50% of Mg, Al, Si, P, Ti, Cr, Mn, Co, Ni, Zn, Fe, Ag, Ca, and B, with the balance Cu, and unavoidable impurities, and a metal structure having a number density NOf fine second phase particles having a particle diameter of approximately from 5 to 50 nm of 10.0 per 0.12 mmor more and a ratio N/Nof a number density N(per 0.012 mm) of coarse second phase particles having a particle diameter exceeding approximately 0.2 mm and the Nof 0.50 or less.

Copper alloy sheet material

A method for producing a heat radiating plate, the method containing the steps of: finish cold-rolling an annealed material to obtain a strip; causing the strip to wind in the shape of a coil to prepare a coil stock; unwinding the coil stock by means of an uncoiler to obtain a strip; causing the strip to pass through a gap between the rolls of a leveler to correct the shape thereof; progressively feeding the corrected strip to a progressive die via a feeder to progressively press-working the strip to produce a heat radiating plate.

Heat radiating plate and method for producing same

A copper alloy sheet has a chemical composition containing 0.7 to 4.0 wt % of Ni, 0.2 to 1.5 wt % of Si, and the balance being copper and unavoidable impurities, the copper alloy sheet having a crystal orientation which satisfies I{200}/I{200}&#x2265;1.0, assuming that the intensity of X-ray diffraction on the {200} crystal plane on the surface of the copper alloy sheet is I{200} and that the intensity of X-ray diffraction on the {200} crystal plane of the standard powder of pure copper is I{200}, and which satisfies I{200}/I{422}&#x2265;15, assuming that the intensity of X-ray diffraction on the {422} crystal plane on the surface of the copper alloy sheet is I{422}.

Copper alloy sheet and method for producing same

A copper alloy sheet has a chemical composition containing 0.1 to 5 wt % of nickel, 0.1 to 5 wt % of tin, 0.01 to 0.5 wt % of phosphorus and the balance being copper and unavoidable impurities, and has a crystal orientation satisfying 2.9&#x2266;(f+f+f)/(0.27&#xb7;f+0.49&#xb7;f+0.49&#xb7;f) 4.0, assuming that the degree of orientation of a {hkl} crystal plane measured by the powder X-ray diffraction method on the rolled surface of the copper alloy sheet is f.

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Tokyo, Japan

Tomotsugu Aoyama