Shinko Electric Industries Co., Ltd.

Tomotake Minemura

Michio Horiuchi

Kiyoshi Oi

Shigeaki Suganuma

Masaya Tsuno

A ceramic substrate includes a substrate main body, and a conductor layer provided inside of the substrate main body. The substrate main body includes an insulator layer that is ceramics composed of aluminum oxide, and a composite oxide layer of aluminum and silicon, the composite oxide layer being formed between the insulator layer and the conductor layer.

Ceramic substrate and electrostatic chuck

A composite green sheet includes a green sheet, and a bulk metal film provided on the green sheet. Examples of the metal forming the metal film may include aluminum, aluminum alloys, copper, copper alloy, or the like.

Composite green sheet and ceramic member

A ceramic mixture paste includes oxide ceramic particles, burn-off particles, and a firing aid. The burn-off particles are burned off at a temperature lower than the firing temperature of the oxide ceramic particles. The firing aid melts at a temperature lower than the firing temperature. The ratio of the volume of the burn-off particles to the volume of the oxide ceramic particles is more than 0% and less than or equal to 20%.

Ceramic mixture paste, porous body, electrostatic chuck, and substrate fixing device

A ceramic structure includes a base body, and a thermoelectric device having a part in directly contact with the base body. The base body is a ceramic consisting of aluminum oxide. The thermoelectric device comprises a conductor part that is a sintered body having an alloy of tungsten and rhenium, as a main component, and including nickel oxide, aluminum oxide and silicon dioxide.

Ceramic structure, electrostatic chuck and substrate fixing device

A ceramics substrate includes: a substrate body; an electric conductor layer that is built in the substrate body; and a via that is built in the substrate body to be electrically connected to the electric conductor layer. The substrate body is made of ceramics containing aluminum oxide. The via is made of a fired body of an electric conductor paste. The electric conductor paste contains molybdenum as a main component and further contains nickel oxide, aluminum oxide, and silicon dioxide.

Ceramics substrate, method of manufacturing the same, electrostatic chuck, substrate fixing device, and semiconductor device package

A ceramic member includes: a ceramic sintered body; and a conductive member of aluminum or an aluminum alloy provided in the sintered body.

Ceramic member

A ceramics substrate includes: a substrate body; and an electric conductor patient that is provided in the substrate body. The substrate body is made of ceramics containing aluminum oxide. The electric conductor pattern is a sintered body that contains tungsten as a main component and further contains nickel oxide, aluminum oxide and silicon dioxide.

Ceramic substrate containing aluminum oxide and electrostatic chuck having electrode containing tungsten with oxides

An electrostatic chuck includes a base having a support surface configured to retain a retaining target by electrostatic retention, and a thermocouple configured to detect a temperature of the base. The thermocouple includes first and second metal parts provided inside the base and having ends connected to each other to form a measuring junction, a first wire part having one end connected to the other end of the first metal part inside the base, and another end extending outside the base, and a second wire part having one end connected to the other end of the second metal part inside the base, and another end extending outside the base. The first metal part and the first wire part are formed from a first material, and the second metal part and the second wire part are formed from a second material different from the first material.

Electrostatic chuck and substrate fixing apparatus

An electrostatic chuck includes: an insulating plate consisting of alumina, and YAG (Yttrium Aluminum Garnet) added with cerium, and configured to mount a substrate thereon; and an electrode which is embedded in the insulating plate and configured to generate electrostatic force for adsorbing the substrate.

Electrostatic chuck and substrate fixing device

A wiring substrate includes a first connection terminal and a protective insulation layer. The first connection terminal is electrically connected to a wiring layer by a via wiring and projects upward from an upper surface of an insulation layer. The protective insulation layer is located on the upper surface of the insulation layer to contact and cover a portion of a side surface of the first connection terminal. The first connection terminal includes a lower portion that is continuous with the via wiring and an upper portion that is continuous with the lower portion. The lower portion is smaller in crystal grain size than the upper portion. The lower portion and the upper portion are formed from the same metal material. The side surface of the lower portion has a higher roughness degree than the side surface of the upper portion.

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Nagano, Japan

Tomotake Minemura