Panasonic Corporation

Matsushita Electric Industrial Co., Ltd.

Tomotaka Nishimoto

Shinjiro Tsuji

Masayuki Ida

Hiroyuki Kondo

Ryouichirou Katano

Yasuhiro Okada

Takahiko Murata

Shinji Kanayama

Akira Yamada

Masanori Ikeda

Masahiro Taniguchi

Kazuo Kido

Kenichi Nishino

Ikuo Yoshida

Nobuhisa Watanabe

Takanori Yoshitake

Chihiro Igarashi

Kouichi Yabuki

A mounting-line power control device () includes: a target value obtaining unit () which obtains, for each mounting line, a target value for demand power for a first period; a priority obtaining unit () which obtains a first priority level of each mounting line; a target value changing unit () which decreases the target value for the demand power of a second mounting line in the first period when the demand power of a first mounting line in the first period exceeds its target value, the second mounting line having the lower first priority level than the first mounting line; and a power usage changing unit () which reduces power used in the first period by the component-mounted board production apparatus included in the second mounting line, such that the demand power of the second mounting line in the first period does not exceed the decreased target value.

Mounting-line power control device and mounting-line power control method

A power supply control method of a production system including a first unit and a second unit includes: starting power supply for operation of the second unit in accordance with a signal acquired according to an operation status of the first unit (S); starting the operation by the second unit after the start of the power supply (S); acquiring stop time information indicating time from when the operation ends to when a next operation of the second unit starts (S); determining, based on the acquired stop time information, whether or not to stop the power supply after the started operation ends (S); and stopping the power supply when it is determined to stop the power supply (S).

Production system power supply control method, and production system

A component crimping apparatus control method which enables a measuring tool to directly measure a temperature of a part pressed by a pressing head. The component crimping apparatus control method is applied to a component crimping apparatus which crimps a component onto a plate-shaped workpiece, and causes a measuring tool shaped identically as the workpiece to measure a temperature or a pressure of a pressed part in a pressing process of pressing a component onto the workpiece using a heated pressing head. The method includes acquiring information indicating whether or not the measuring tool is held in the component crimping apparatus, and, in the case where the information indicating that the measuring tool is held is acquired, positioning the measuring tool identically as the workpiece, and executing the pressing process on the component to be attached to the measuring tool after the positioning.

Component crimping apparatus control method, component crimping apparatus, and measuring tool

An adhesive tape applying apparatus includes a stage on which a terminal end portion of a first tape member and a leading end portion of a second tape member are placed so as to be superimposed on each other, an ultrasonic tool in which a plurality of protruding portions are provided on its contact surface that is to be put into contact with the leading end portion or terminal end portion of the superposed tape members, an ultrasonic vibration generator for applying ultrasonic vibrations in a tape's thicknesswise direction to the ultrasonic tool, and a pressing device for making a stage-directed pressing force act on the ultrasonic tool. As a result, the terminal end portion of the in-use first tape member and the leading end portion of the second tape member rolled out from a new reel can be spliced together with a simple, low-cost construction while the possibility of occurrence of trouble in tape feed is eliminated.

Adhesive tape applying apparatus and tape splicing method

An adhesive sheet attaching device is provided with: a stage (); a feeder () for feeding adhesive sheet () onto the stage (); a cutter (); a pressurizer () for attaching the adhesive sheet () to a target object mounted on the stage (); a detector () for detecting a connecting portion (); and a controller. When the detector () detects the connecting portion (), the controller stops the operation of the feeder () after adhesive sheet () of an attachable length up to the connecting portion () has been attached. This makes it possible to reliably prevent adhesive sheet () containing a connecting portion () from being attached to a target object, and to effectively use the adhesive sheet up to the connecting portion (), thus making it possible to suppress resource loss.

Adhesive sheet stamping device, adhesive sheet stamping method

Component mounting equipment mounts an FPC board onto an LCD board. The LCD board has a first electrode section on one side edge and a second electrode section on another side edge. The FPC board has a first section on one side edge and a second section on another side edge. A first mounting apparatus mounts the first section on the first electrode section. A second mounting apparatus mounts the second section on the second electrode section. In the second component mounting apparatus, the second section is separated from the second electrode section at an ACF supply section and released at a pre-press bonding section.

Electronic component, component mounting equipment, and component mounting method

Transfer of liquid crystal panels to subsequent processes is performed with the panels placed on transfer arms and held by suction pads. A small suction force can be sufficient, and a suction irregularity is prevented. The transfer arms are arranged at a lower side of the liquid crystal panels, thus not obstructing the liquid crystal panels. In arranging the liquid crystal panels at an image pickup device, a panel holding device is controlled to be driven so as to position panel marks to a bonding height position while negating a deflection amount of the liquid crystal panels, and furthermore a component holding device is controlled to be driven so as to position component marks to the bonding height position and to mount electronic components to the liquid crystal panels at the bonding height position.

Component mounting apparatus and component mounting method, and recognition apparatus for a component mount panel, component mounting apparatus for a liquid crystal panel, and component mounting method for a liquid crystal panel

Growing community of inventors

Osaka, Japan

Tomotaka Nishimoto