Nihon Dempa Kogyo Co., Ltd.

Tomotaka Kuroda

Makoto Hatano

Toshimasa Tsuda

Manabu Ito

Hiroyuki Sasaki

Takeshi Uchida

Daisuke Nishiyama

Kenichi Kikuchi

Hiroya Ishikawa

Shigeharu Monoe

A piezoelectric device includes a base, a piezoelectric vibrating piece, and a cover. The base has a depressed portion and a bank portion. The piezoelectric vibrating piece is housed within the depressed portion. The cover is bonded on a top surface of the bank portion of the base with a sealing metal. The top surface of the base has an inclined surface that inclines down toward an inside of the base in a direction along a width direction of the bank portion or an inclined surface that inclines down toward an outside of the base in the direction along the width direction of the bank portion.

Piezoelectric device and base

A solder material includes an alloy of at least five elements including Sn, Cu, Sb, and In, and 20 mass % or less of Ag. The solidus temperature of the solder material is higher than 290&#xb0; C., the liquidus temperature of the solder material is 379&#xb0; C. or less and is higher than the solidus temperature, and the temperature difference between the liquidus temperature and the solidus temperature is 70&#xb0; C. or less.

Solder material and electronic component

A method for fabricating a crystal unit, including a preparing step, a bonding step, and a separating step, is provided. The preparing step prepares a quartz plate and a supporting substrate with a recess that is larger than the vibrating region on a surface of the supporting substrate. The recess corresponds to a vibrating region in the crystal unit. The bonding step bonds the quartz plate to the surface of the supporting substrate such that the quartz plate is separated from the supporting substrate in the recess. The separating step separates the quartz plate into the vibrating region and the framing portion by performing dry etching on the quartz plate such that the quartz plate has a shape that connects the vibrating region to the framing portion via a supporting beam. The framing portion surrounds the vibrating region.

Crystal unit and method for fabricating the same

Electronic devices are disclosed that allow for surface-mounting using solder while preventing solder from overflowing between external terminals of the electronic device, or between pads on a circuit board to which the external terminals are soldered. An exemplary electronic device has a base board made of an insulating material and having an outer surface comprising at least one external terminal for surface mounting of the device to the circuit board. A groove is defined at least part way around the external terminal on the outer surface. The groove accommodates overflowed solder and thus prevents unintended spread flow of the solder to locations that otherwise could cause short circuits and the like. The electronic device can include a resin board containing a thermoset resin, wherein the groove is formed by thermal or mechanical processing.

Electronic devices for surface mount

To provide high reliable surface mounting oscillator that solder does not leak out by heat from the oscillator. The base print board with a terminal on the first surface and a concave on the second surface which is the opposite side of the first surface, the metal strut fixed to the concave, the sub print board has piezoelectric vibrator supported by the metal strut, the base print board, the cover which covers the metal strut and the sub print board.

Surface mounting piezoelectric oscillator

The present invention relates to a two-level mounting board in which a second substrate is supported horizontally by a metal pin above a first substrate having a mounting electrode on an outer base surface, the free, lower end of the metal pin is inserted in a hole provided in the surface of the first substrate, and the metal pin is affixed by solder to an annular electrode land provided on the surface of the first substrate to form an outer periphery of the hole, wherein part of the ring of the annular electrode land is cut away to open the same. This provides a two-level mounting board in which metal pins can be connected reliably to the first substrate to support the second substrate horizontally, and a crystal oscillator using the same.

Growing community of inventors

Saitama, Japan

Tomotaka Kuroda