Nec Corporation

Showa Denko K.k.

Tomotaka Ishida

Sakae Kitajo

Mitsuru Yamamoto

Kazuo Taga

Kazuhiro Kumakura

Jun Sakai

Hideyuki Ono

Hikaru Kouta

Mikio Oda

Takashi Ohtsuka

Hisaya Takahashi

Arihide Noda

Yoshinori Katada

An electronic device cooling apparatus including a cooling device including a heat conductive plate formed with a flow path, a circulating pump, a liquid storage tank upper chamber and lower chamber provided on the upper and lower side of the heat conductive plate, and a bypass provided with the heat conductive plate so as to allow the cooling medium to pass through the liquid storage tank upper chamber and the liquid storage tank lower chamber.

Electronic device cooling apparatus

Provided is an optical interconnection device in which a volume required for cooling is reduced. In the optical interconnection device, a plurality of optical modules () are arranged on a periphery of an LSI () electrically connected to an electric wiring board (), and liquid cooling mechanisms () are respectively placed on the LSI () and the optical modules (). The plurality of optical modules () may be arranged only on a surface of the electric wiring board () where the LSI () is mounted, only on a surface opposite to the surface where the LSI () is mounted, or on both the same surface as and the opposite surface to the surface where the LSI () is mounted.

Optical interconnection device

A liquid-cooled heat radiatorincludes a heat radiation basehaving a cooling-liquid channel, and an expansion tankprovided on the heat radiation base. The expansion tankhas a tank bodyhaving an expanded portion, which expands upward and opens downward, and a bottom platejoined to the lower end of the tank bodyto thereby close a bottom opening of the expanded portion. A through-holeis formed in the top wall of the expanded portionof the tank bodyand serves as a communication section for establishing communication between the interior and the exterior of the cooling-liquid channel. A hydrogen-permeable memberis fixedly fitted into the through-holeso as to stop the through-hole. The hydrogen-permeable membersatisfies the relation B&#x2267;50 A, where A and B are water-vapor permeability and hydrogen permeability, respectively, of the hydrogen-permeable member. The hydrogen-permeable memberis formed from a single material selected from the group consisting of ethylene-propylene rubber, butyl rubber, fluorine-containing rubber, nitrile-butadiene rubber, and silicone rubber. The liquid-cooled heat radiatorcan be free from an increase in pressure in the cooling-liquid channel

Liquid-cooled heat radiator

An expansion tank devicecomprises a tank installation basehaving a cooling liquid channeland an expansion tankprovided on the upper surface of the installation base. The basehas a communication holefor holding space above the upper surface thereof in communication with the cooling liquid channel. The expansion tankhas a tank main bodyincluding an upwardly bulging portionhaving an opening at its lower end, and a bottom platejoined to the lower end of the tank main bodyfor closing the lower-end opening of the bulging portionand joined to the upper surface of the tank installation base. The bottom plateis provided at a portion thereof corresponding to the communication holewith a through holecommunicating with the communication hole. The bottom plateis provided with a baffle plateformed along the entire circumference of the inner peripheral edge thereof defining the through holeand slanting upwardly toward the center of the through hole. The expansion tank deviceremoves the air in the cooling liquid from the circulating system, precludes the system from breaking and prevents the decrease in the amount of cooling liquid within the circulating system.

Expansion tank device, process for fabricating expansion tank device, and liquid cooling radiator

Growing community of inventors

Tokyo, Japan

Tomotaka Ishida