Jx Nippon Mining Metals Corporation

Axis Patent International

Tomota Nagaura

Terumasa Moriyama

Michiya Kohiki

Kazuhiko Sakaguchi

Masafumi Ishii

Copper sulfate which includes a Fe with a concentration of 0.08 ppm by mass or less.

Copper sulfate, copper sulfate solution, plating solution, method for producing copper sulfate, method for producing semiconductor circuit board, and method for producing electronic apparatus

A carrier-attached copper foil having good circuit formability is provided. The carrier-attached copper foil has a carrier, an intermediate layer and an ultra-thin copper layer in this order, the average grain size of crystal grains that form the ultra-thin copper layer is 1.05 to 6.5 &#x3bc;m, and a ten point average roughness Rz of a surface on a side of the ultra-thin copper layer is 0.1 to 2.0 &#x3bc;m.

Carrier-attached copper foil, laminate, method for manufacturing printed-wiring board and method for manufacturing electronic device

A carrier-attached copper foil having satisfactory circuit formability on the ultra-thin copper layer surface is provided. The carrier-attached copper foil has a carrier, an intermediate layer and an ultra-thin copper layer in this order. The ultra-thin copper layer surface has an absorbance of light at a wavelength of 400 nm is 85% or more.

Carrier-attached copper foil, laminate, printed-wiring board and method for manufacturing the printed wiring board

Provided is a copper foil provided with a carrier which enables to form an extremely fine circuit and to suppress the disconnection of a circuit well. A copper foil provided with a carrier having, in order, an intermediate layer and an ultrathin copper layer on one side or both sides of the carrier, wherein the ultrathin copper layer is an electrolytic copper layer; and the thickness of the ultrathin copper layer measured by using a gravimetric method is 1.5 &#x3bc;m or less and the number of pinholes in the ultrathin copper layer is 0 pinholes/mor more and 5 pinholes/mor less.

Copper foil provided with carrier, laminate, printed wiring board, electronic device, and method for fabricating printed wiring board

A carrier-attached copper foil having good circuit formability is provided. The carrier-attached copper foil has a carrier, an intermediate layer and an ultra-thin copper layer in this order, the number of crystal grains per unit cross-sectional area of the ultra-thin copper layer in the through-thickness direction is 0.1 to 5 grains/&#x3bc;m, and a ten point average roughness Rz of a surface on a side of the ultra-thin copper layer is 0.1 to 2.0 &#x3bc;m.

The present invention provides a carrier-attached copper foil, wherein an ultrathin copper foil is not peeled from the carrier prior to the lamination to an insulating substrate, but can be peeled from the carrier after the lamination to the insulating substrate. A carrier-attached copper foil comprising a copper foil carrier, an intermediate layer laminated on the copper foil carrier, and an ultrathin copper layer laminated on the intermediate layer, wherein the intermediate foil is configured with a Ni layer in contact with an interface of the copper foil carrier and a Cr layer in contact with an interface of the ultrathin copper layer, said Ni layer containing 1,000-40,000 &#x3bc;g/dmof Ni and said Cr layer containing 10-100 &#x3bc;g/dmof Cr is provided.

Carrier-attached copper foil

Provided is a copper foil for a printed wiring board including a roughened layer on at least one surface thereof. In the roughened layer, the average diameter Dat the particle bottom being apart from the bottom of each particle by 10% of the particle length is 0.2 to 1.0 &#x3bc;m, and the ratio L/Dof the particle length Lto the average diameter Dat the particle bottom is 15 or less. In the copper foil for printed wiring board, when a copper foil for printed wiring having a roughened layer is laminated to a resin and then the copper layer is removed by etching, the sum of areas of holes accounting for the resin roughened surface having unevenness is 20% or more. The present invention involves the development of a copper foil for a semiconductor package substrate that can avoid circuit erosion without causing deterioration in other properties of the copper foil. In particular, an object of the present invention is to provide a copper foil for a printed wiring board and a method of producing the copper foil, in which the adhesion strength between the copper foil and the resin can be enhanced by improvement of the roughened layer of the copper foil.

Growing community of inventors

Ibaraki, Japan

Tomota Nagaura