Hitachi Chemical Company, Ltd.

Showa Denko Materials Co., Ltd.

Resonac Corporation

Tomoo Nishiyama

Kazuya Kiguchi

Yoshitaka Takezawa

Atsushi Kuwano

Hideyuki Katagi

Naoki Hara

Kazumasa Fukuda

Toshiaki Shirasaka

Norihiko Sakamoto

Yasuhiko Awano

Daisuke Fujimoto

Shigemitsu Yoshie

Yasuo Miyazaki

Kensuke Yoshihara

An epoxy resin has a mesogenic structure and a siloxane structure. An epoxy resin composition includes the epoxy resin having the mesogenic structure and the siloxane structure, and a curing agent.

Epoxy resin, epoxy resin composition, resin sheet, B-stage sheet, C-stage sheet, cured product, metal foil with resin, metal substrate, and power semiconductor device

A resin sheet includes an epoxy resin including an epoxy resin oligomer and an epoxy resin monomer; a curing agent; and an inorganic filler, wherein a content of the inorganic filler is more than 30% by volume but less than 80% by volume.

Resin sheet and cured product of resin sheet

Provided is a resin composition for forming a resin layer of a laminate by coating, the resin composition having a thixotropic index at 25&#xb0; C. of from 3 to 10, and the laminate includes a pair of members and the resin layer arranged between the pair of members.

Resin composition and method of producing laminate

A resin composition including an epoxy resin monomer, a novolac resin including a compound having a structural unit represented by Formula (I), and a filler; in which the filler has at least 4 peaks in a particle size distribution measured by laser diffractometry, in which four of the peaks are present respectively in ranges of not less than 0.01 &#x3bc;m and less than 1 &#x3bc;m, not less than 1 &#x3bc;m and less than 10 &#x3bc;m, from 10 &#x3bc;m to 50 &#x3bc;m, and from 20 &#x3bc;m to 100 &#x3bc;m, and in which a peak present in a range of from 10 &#x3bc;m to 50 &#x3bc;m includes an aluminum oxide particle, and a peak present in a range of from 20 &#x3bc;m to 100 &#x3bc;m includes a boron nitride particle. In Formula (I) each of R, Rand Rindependently represents a hydrogen atom, an alkyl group, or the like. m represents 0 to 2, and n represents 1 to 7. 

Resin composition, resin sheet, cured resin sheet, resin sheet structure, cured resin sheet structure, method for producing cured resin sheet structure, semiconductor device, and LED device

The present invention provides a resin composition including an epoxy resin monomer, a novolac resin containing a compound having a structural unit represented by the following general Formula (I), and a filler, in which a particle size distribution of the filler, measured using laser diffractometry, has peaks in the respective ranges of from 0.01 &#x3bc;m to less than 1 &#x3bc;m, from 1 &#x3bc;m to less than 10 &#x3bc;m, and from 10 &#x3bc;m to 100 &#x3bc;m, and the filler contains boron nitride particles having particle sizes of from 10 &#x3bc;m to 100 &#x3bc;m. In the general Formula (I), Rrepresents an alkyl group, an aryl group, or an aralkyl group. Each of Rand Rindependently represents a hydrogen atom, an alkyl group, aryl group, or an aralkyl group. m represents a number from 0 to 2; and n represents a number from 1 to 7. 

Resin composition, resin sheet, cured resin sheet, resin sheet laminate, cured resin sheet laminate and method for producing same, semiconductor device and LED device

Growing community of inventors

Tokyo, Japan

Tomoo Nishiyama