Nec Corporation

Nec Access Technica, Ltd.

Tomoo Murakami

Akinobu Shibuya

Koichi Takemura

Akira Ouchi

Takanori Tsunoda

Shinji Watanabe

Nobuyuki Sato

Katsuhiko Suzuki

Takao Yamazaki

Ryo Maniwa

Hidebumi Ohnuki

Shizuaki Masuda

Yuuki Fujimura

Akira Ohuchi

Ryoji Osu

Kikuo Wada

A substrate and a semiconductor chip are connected by means of flip-chip interconnection. Around connecting pads of the substrate and input/output terminals of the semiconductor chip, an underfill material is injected. The underfill material is a composite material of filler and resin. Also, a first main surface of the substrate, which is not covered with the underfill material, and the side surfaces of the semiconductor chip are encapsulated with a molding material. The molding material is a composite material of filler and resin. An integrated body of the substrate and the semiconductor chip, which are covered with the molding material, is thinned from above and below.

Semiconductor device and method for manufacturing the same

A substrate () and a semiconductor chip () are connected by means of flip-chip interconnection. Around connecting pads () of the substrate () and input/output terminals () of the semiconductor chip (), an underfill material () is injected. The underfill material () is a composite material of filler and resin in which the maximum particle diameter of the filler is 5 &#x3bc;m or below and whose filler content is 40 to 60 wt %. Also, a first main surface of the substrate (), which is not covered with the underfill material (), and the side surfaces of the semiconductor chip () are encapsulated with a molding material (). The molding material () is a composite material of filler and resin whose filler content is over 75 wt % and in which the glass transition temperature of the resin is over 180&#xb0; C. An integrated body of the substrate () and the semiconductor chip (), which are covered with the molding material (), is thinned from above and below.

A device having electronic components mounted therein has a first electronic component having an external terminal on a first surface and a heat spreader on a second surface, at least one second electronic component that is placed in the direction of a second surface of the first electronic component, a flexible circuit board that is electrically connected to the first electronic component and at least one second electronic component, and at least the part to which at least one second electronic component is connected is located on the second surface side of the first electronic component, and a spacer that is located between at least part of the flexible circuit board and the second surface of the first electronic component. The spacer can prevent heat from the first electronic component from being directly transferred to the second electronic component.

Device having electronic components mounted therein and method for manufacturing such device

Electrode pads () and a solder resist () are disposed on the upper surface of a wiring board (), and apertures () are formed in the solder resist () so as to expose the electrode pads (). Electrodes () are disposed on the lower surface of a semiconductor element (). Electrodes () are connected to the electrode pads () by way of bumps (). An underfill resin () is disposed in the area that excludes the solder resist () and the bumps () in the space between the wiring board () and the semiconductor element (). Between the wiring board () and the semiconductor element (), the thickness (B) of the solder resist () is equal to or greater than the thickness (A) of the underfill resin () on the solder resist (). The volume (Vb) of the bumps () is less than the volume (Vs) of the apertures ().

Semiconductor device and manufacturing method thereof

A flip chip is mounted on a printed circuit board, and bump electrodes and pads are established in electrical connection, wherein sealing resin between the flip chip and the printed circuit board is thermally cured for pressing the bump electrodes against the pads and, thereafter, the bump electrodes are alloyed with the pads so that not only the force but also the alloyed portion keep the electrical connection low in contact resistance without disconnection.

Method for mounting flip chip on circuit board through reliable electrical connections at low contact resistance

This invention mounts a semiconductor device having a plurality of electrodes to a substrate. A bump electrode having a pointed tail is formed on the electrode. The concave mounting pad is formed on the substrate. A sealing resin covers the substrate. And the tail of the bump electrode is buried into the sealing resin by putting the semiconductor device close to the substrate. Further, the semiconductor device is pressed to the substrate. And the sealing resin is hardened by heating.

Method of mounting a semiconductor device to a substrate

A flip chip mounting method and the apparatus have high reliability in electrical connection between a semiconductor and a circuit board so as to avoid void in a via formed in a circuit board or in a recessed portion of a solder resist formed in a circumference of a mounding pad. The flip chip mounting method for connecting a semiconductor element and a circuit board includes steps supplying a thermosetting type resin to a mounting portion on the circuit board, mounting an electrode of the semiconductor element on an electrode of the circuit board under a condition where the semiconductor element is heated by a heating tool, applying a high frequency vibration on the heating tool or the circuit board in the condition where the electrode of the semiconductor element is mounted on the electrode of the circuit board, and heating and pressurizing the thermosetting type resin by the heating tool.

Flip chip mounting method and apparatus therefor

A method of mounting a semiconductor element on a substrate and a semiconductor device formed therewith, includes forming mounting pads on the substrate, roughening a surface of at least one of the pads, positioning a resin between a semiconductor element having electrodes formed thereon and the substrate, and connecting roughened surfaces of the pads to the electrodes, respectively.

Semiconductor element mounting method

The object of this invention is to provide a method whereby, during flip-chip connection using a thermosetting resin, it is possible to prevent the development of voids in the resin when the resin is hardened by pulse heating. The object is fulfilled by providing a method comprising heating a chip 4 to thereby harden a thermosetting resin 3 while applying a pressure to the chip 4 towards a substrate 1 to put a bump electrode 6 into contact with a wiring 2, wherein heating temperatures are adjusted appropriately according to:

Method for producing a semiconductor device

A wiring pattern is selectively formed on a base member by permanent resist. Furthermore, the thickness of a non-electrolytic copper plating layer is made thinner than that of a permanent resist layer on the base member, so that a concave shape is formed in combination with the permanent resist layer. A solder resist layer is formed on the non-electrolytic copper plating layer and the permanent resist layer except for a pad portion formed by the non-electrolytic copper plating layer, and a peripheral portion of the pad portion is surrounded by a wall formed by the permanent resist layer and the solder resist layer. Solder is supplied onto the pad portion surrounded by the wall by way of either the MICROPRESS method or the MICROBALL method.

Method for manufacturing wiring pattern board

A semiconductor device comprises a plurality of bump electrodes at least to one surface. A circuit substrate is formed with a laminate structure having an inner layer circuit and a mounting pad is formed on the substrate. The mounting pad has a concave portion and the bottom of the concave portion is in contact with the inner layer circuit. Further, an sealing resin is provided on the substrate. The bump electrode and the concave portion of the mounting pad are opposed, and the bump electrode is pressed to the bottom of the concave portion of the mounting pad, thereby deforming the pointed shape portion at the top end of the bump electrode. By the deformation the pointed shape portion, the contact portion between the bump electrode and the mounting pad is gradually enlarged from a point to a plane. After deforming the bump electrode by a predetermined amount, the sealing resin is hardened and the semiconductor device is mounted on a substrate.

Method of mounting a semiconductor device to a substrate and a mounted

The method for manufacturing a printed circuit board having an electrode on an end surface of a substrate has the steps of forming a hole at a predetermined position of a laminate board whose two surfaces are copper plated, filling in the hole with copper paste, forming a circuit pattern such that a copper foil portion remains only in one half of the hole, and etching an exposed region of the substrate. No mechanical process is used in the formation of the end face through-hole so that it is free from the development of burrs in or peeling off of a conductive layer.

Method for manufacturing a printed circuit board having electrodes on

A printed circuit board is manufactured by steps of forming on a laminate a plurality of penetrating holes, a plurality of semi-circular grooves, and a plurality of semi-circular through-holes. The plurality of penetrating holes are formed at predetermined locations along a straight line on the laminate board whose two surfaces are copper plated. The plurality of semi-circular grooves are formed from the penetrating holes which are cut into halves by a slit forming process. The plurality of semi-circular through-holes are formed using a jig member inserted into said slit and forming a copper plated layer on a surface of each of said semi-circular grooves. Highly reliable semi-circular through-holes can be formed because no peeling or burrs develop in the copper plated layer.

Method for manufacturing printed circuit board with through-hole

An apparatus for plating a printed circuit board including a non-through hole for connecting between a surface conductive layer and an interlayer wiring layer has a jig, a vessel, a supporting body carrying the jig for causing it to vibrate and swing in a plating liquid contained in the vessel, and a vacuum pump connected to the vessel for exhausting the air in the vessel thereby enhancing removal of bubbles in the non-through hole. A method of plating a printed circuit board includes the step of reducing the pressure inside the vessel simultaneously with the printed circuit board being subjected to the vibration and swinging actions thereby to remove a bubble existing inside the non-through hole. The removal of the bubble makes it possible to have a uniform plating film formed in an inner wall of the non-through hole and ensures the reliable electric connection to be established through the non-through hole between a surface conductive layer and interlayer conductive layers.

Method of and apparatus for plating printed circuit board

A fabrication method of a printed wiring board in which the halation effect of light irradiated to a solder resist film is utilized in a process of selectively removing the solder resist film. After a conductive layer is patterned to a given circuit pattern including soldering pads, the solder resist film is formed on the base material to cover the patterned conductive layer. The solder resist film is selectively exposed to light utilizing reflection of the irradiated light from the insulating base material and developed so that the solder resist film is selectively left in areas adjacent to the respective soldering pads. Then, an etching resist film is formed to cover the patterned conductive layer except for the soldering pads, and surface areas of the respective soldering pads are selectively etched using the etching resist film as a mask to produce solder resist dams made of the solder resist film left on the base material. Solder films are formed on the respective soldering pads thus selectively etched. Electronic components can be soldered on the soldering pads with satisfactory reliability even if the soldering pads have narrow pitches such as 500 .mu.m or less.

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Tokyo, Japan

Tomoo Murakami