Jsr Corporation

Tomoo Koumura

Yutaka Kobayashi

Yoshinori Igarashi

Kou Hasegawa

Fujio Sakurai

A polishing pad having a polishing layer which has specific composition and a ratio of the storage elastic modulus at 30&#xb0; C. to the storage elastic modulus at 60&#xb0; C. of 2 to 15 and a ratio of the storage elastic modulus at 30&#xb0; C. to the storage elastic modulus at 90&#xb0; C. of 4 to 20 and is made of a polyurethane or polyurethane-urea. This polishing pad suppresses the scratching of the surface to be polished and planarizes the surface efficiently. A polishing pad having a polishing layer containing water-soluble particles can achieve a higher removal rate.

Polishing pad

It is an object of the invention to provide a composition for forming a polishing pad comprising substances having specific functional groups exhibiting excellent hydrophilic properties and the like, a crosslinked body for polishing pad as well as a polishing pad with excellent water resisting and durability which exhibits excellent polishing performance including a high removal rate and method for producing thereof. The composition for forming a polishing pad comprises a crosslinkable elastomer having no carboxyl, amino, hydroxyl, epoxy, sulfonic acid and phosphoric acid groups, and a water-insoluble substance having at least one functional group selected from the group consisting of carboxyl, amino, hydroxyl, epoxy, sulfonic acid and phosphoric acid groups. And a water-soluble substance such as cyclodextrin may be contained. A polishing pad can be manufactured using the composition above or the crosslinked body for polishing pad, and porous polishing pads may also be obtained.

Growing community of inventors

Chuo-ku, Japan

Tomoo Koumura