Hitachi, Ltd.

Hitachi Plant Technologies, Ltd.

Hitachi Rail Limited

Tomoo Hayashi

Tadakatsu Nakajima

Yoshihiro Kondo

Hitoshi Matsushima

Osamu Suzuki

Takeshi Kato

Tatsuya Saito

Takeshi Yamaguchi

Tohru Watanabe

Akio Idei

Kenji Ogiro

Takeshi Watanabe

Atsuo Nishihara

Ryo Kawasaki

Hiroyuki Toyoda

Shigeyasu Tsubaki

Keisuke Horiuchi

Takayuki Atarashi

Sunao Funakoshi

Yosuke Tanabe

Yasushi Takano

Kento Mochizuki

Yosuke Yasuda

Takeo Takagi

Yasuhiro Kashirajima

Akitoshi Matsui

Takumi Sugiura

Shuichi Terakado

Kiyoshi Morita

Kenta Konishi

Takahisa Yamamoto

Akinori Kawasaki

Yukinobu Abe

Hideshi Ohba

Yoshinori Shimada

Masayuki Wada

Daisuke Akimaru

Tomoaki Taguchi

Ryota Fukuhara

Misaki Kon

Yasuhiro Yamaoka

Yuta Oura

Kazuto Koreishi

Fumio Fujinaga

Toshihiko Mochida

Kaname Nakayama

Kaoru Oda

Motohiro Fujii

To provide a railroad vehiclecapable of controlling a private room temperature and a guest room temperature with a simple configuration without increasing the number of manufacturing steps and without requiring complicated control while using a common air conditioner in view of the fact that the number of passengers of a private room and the number of passengers of a general guest room are largely different from each other in many cases, which causes a change in indoor temperature. A railroad vehicleincludes a private room, a guest room, an air conditioner, and a main ductfor supplying conditioned air conditioned by the air conditionerto the guest room, a branch ductfor connecting the main ductto the private roomis provided in order to supply the conditioned air, and the branch ductincludes an introduced air portfor introducing the air of the guest roomto the branch ductin accordance with a difference between the pressure in the guest roomand the pressure in the branch ductor the private room

Railroad car

A cooling system for an onboard electrical power converter in which a heat dissipation surface extends parallel to a flow of cooling air draft includes: a coolant tank containing coolant that includes a bottom surface being in thermal contact with the heat dissipation surface; a first conduit provided connecting to an upper surface of the coolant tank, the coolant flowing into the first conduit; a heat exchanger that comprises second conduits arranged with opposing the upper surface, and conducts the coolant to upstream; and a return unit that returns the coolant to the coolant tank; wherein the heat exchanger comprises heat dissipation fins through which the cooling air draft passes from a first to a second side, the heat dissipation fins being provided on surfaces of the second conduits, the first side not facing the coolant tank and the second side facing the coolant tank.

Cooling system for onboard electrical power converter, and electrical power converter for railway vehicle

An electronic apparatus, such as a blade server or the like, has a cooling system for efficiently cooling a plurality of heat generating semiconductor devices, such as a CPU, mounted on blades which is freely put on and taken off. The cooling system includes a thermosiphon which transfers heat from devices having relatively high heat generation, such as CPU or the like, to the outside of the apparatus, heat pipes which transfer heat of devices having relatively low heat generation to the thermosiphon, a thermal highway which is thermally coupled to the thermosiphon by the mounting of blades into a housing and collects and transfers the heat from the thermosiphon and the heat pipes, and a condenser which transfers the heat collected and transferred by the thermal highway outside a housing.

Electronic apparatus

A server system with a cooling ability that can cope with an increase in the amount of heat generated by a CPU of a server module detachably mounted on a blade server. The server module includes an enclosure accommodating therein a motherboard on which a CPU, memory, and the like are mounted, and part of a boil cooling device for cooling heat generated by the CPU. A fan accommodated in a fan module is adapted to blow air into the server module through an opening of the server module enclosure. The boil cooling device includes a first heat transmission member disposed in the server module enclosure, a second heat transmission member disposed outside the server module enclosure, and a plurality of pipes connecting them. The first heat transmission member is a box body with an internal space for hermetically sealing a refrigerant therein, one external planar face of which is thermally connected to the CPU and the other external planar face of which is provided with a heat sink. The second heat transmission member is disposed in the fan module unit, and a heat radiation member provided for the pipes forms an airflow passage together with the motherboard.

Blade server

A blade server including a cooling structure to be loaded with a CPU of high performance is provided. In order to enhance draining performance of a condensed working fluid which stays between fins, a vapor condensing pipe is used, in which grooves are formed in a direction substantially parallel direction with a pipe axis direction on the above described pipe inner surface, a section of a row of the above described fins is exposed on a side surface of the above described groove, the above described groove is disposed at a lower side in the vertical direction from the center line in the pipe axis direction of the vapor condensing pipe when the above described groove is installed in the above described vapor condensing pipe, and a wick with a wire space smaller than the fin space of the above described fin row is filled inside the above described groove.

Cooling device and electronic equipment including cooling device

An electronic device comprises: a housing; blades each of which is detachable from the housing and on each of which at least CPU and a memory are mounted; first cooling devices each of that takes out heat generated in the blade outside the blade, each of said first cooling device having a heat release part in the form of an elongate column to be fixed to the blade; second cooling devices fixed to the housing to discharge heat transported from the first cooling devices outside the housing, each of said second cooling devices having a heat absorbing part, which is capable of containing the heat release part of the first cooling device; medium reservoirs each of which is put in fluid communication with a clearance, which is formed between the heat release part and the heat absorbing part when the heat release part is inserted into the heat absorbing part; a heat conducting medium stored in each of the medium reservoirs; pressurizing devices for pressurizing the heat conducting medium to supply the heat conducting medium to the clearance, and a detachable connecting part formed between the heat release part and the heat absorbing part.

Electronic device and a thermal connector used therein

It is an object to provide a cooling device for optimally cooling a semiconductor device on a CPU blade which is detachable with respect to an electronic apparatus using the cooling device with compact structure for reducing power consumption. A cooling device for cooling a semiconductor device disposed on an electronic circuit substrate in a casing of an electronic apparatus, comprising a first cooling unit comprising a first heat absorbing portion and a first heat releasing portion, and a second cooling unit comprising a second heat absorbing portion and a second heat releasing portion, wherein the first heat absorbing portion is disposed in contact with the semiconductor device, the second heat absorbing portion is detachably disposed in contact with the first heat releasing portion, a phase-change refrigerant is contained in the first cooling unit, and the second heat releasing portion is disposed outside the casing.

Cooling device and electronic apparatus using the same

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Hitachinaka, Japan

Tomoo Hayashi