Omron Corporation

Thhink Wireless Technologies Japan Ltd.

Tomonori Seki

Minoru Sakata

Takuya Nakajima

Takahiro Masuda

Teruhiko Fujiwara

Yutaka Hattori

Naoki Yoshitake

Yoshiyuki Komura

Toshiaki Okuno

Shobu Sato

Takeshi Fujiwara

Keisuke Uno

Masatoshi Oba

Yutaka Uno

Koji Sano

Katsuyuki Inoue

Mitsuru Fujii

Masao Jojima

Tomonari Kogure

Masashi Takeuchi

Akira Akiba

A power generation device converts vibrational energy into electric power using a vibrational power generation element in which an electret is provided on one substrate of substrates configured to be relatively movable while maintaining a mutually facing state, and supplies the electric power. A vibrational power generation element has the same configuration as the vibrational power generation element and converts vibrational energy into electric power. The vibrational power generation element is connected to a light-emitting diode via a bridge-type full wave rectifier circuit constituted by diodes, a smoothing circuit constituted by a capacitor, and a light-emitting diode drive circuit. A power generation state of the power generation device using the vibrational power generation element and the like is displayed by blinking of the light-emitting diode.

Power generation device

A wafer level package has a first wafer having a plurality of chips mounted or formed thereon in a plane, and a second wafer that is opposed to the first wafer. The first wafer and the second wafer are joined while a seal frame that seals a periphery of each chip is interposed therebetween. A gap is formed between the seal frames of the chips adjacent to each other. A partial connect part that partially connects the seal frames to each other is provided in the gap formed between the seal frames of the chips adjacent to each other.

Wafer level package, chip size package device and method of manufacturing wafer level package

A micro electromechanical relay opens and closes an electrical circuit by contact/separation between a fixed contact disposed on a base and a movable contact disposed on an actuator by driving of a movable electrode by electrostatic attraction by application of voltage between a fixed electrode disposed on the base and a movable electrode of the actuator. The actuator comprises a supporting portion disposed on the base, a beam portion extending in a cantilevered manner from the supporting portion, and a movable electrode and a movable contact elastically supported by the beam portion. The beam portion elastically supports, in order from the supporting portion end, the movable electrode and the movable contact. A slit is formed from the side of the supporting portion in the portion of the actuator connecting the beam portion and the movable electrode.

Micro electromechanical switch and method of manufacturing the same

A fixed voltage and a movable electrode are placed face to face with each other, and an insulating film is formed on the surface of the fixed electrode. The insulating film is made of a nitride film (SiN) as a main material, with oxide films (SiO) being formed on the front and rear surfaces of the nitride film. Moreover, a plurality of protrusions are formed on an area facing the movable electrode of the upper face of the insulating film. The charge quantity in the insulating film is mainly determined by a film thickness of the oxide film, and the nitride film is used for maintaining a sufficient film thickness required for the voltage proof characteristic. Thereby, it is possible to suppress variations in operational voltage characteristics such as on-voltage and off-voltage in an electrostatic actuator so as to prevent phenomena in which the electrostatic actuator fails to turn on even when a rated voltage is applied to the electrostatic actuator and in which the electrostatic actuator fails to turn off even when the driving voltage is turned off.

Antistatic mechanism of an electrostatic actuator

A plurality of fixed contacts and signal lines are provided on a fixed substrate. A movable contact which is closed or opened with the fixed contacts is provided on a movable substrate opposed to the fixed substrate. A film thickness of the fixed contacts is made to be smaller than that of the signal lines so that the movable contact is set in a concave portion constituted by the fixed contacts when the fixed contacts, and the movable contact are closed and the signal lines are linearly connected.

Contact switch for high frequency application

Fixed contacts ( A, A) are provided on the upper surface of a silicon substrate ( ). Signal lines ( ) electrically continuous with the fixed contacts ( A, A) are provided so as to pass through a silicon substrate ( ) from the obverse surface to the reverse surface thereof. Bumps ( ) electrically continuous with the signal lines ( ) are provided on the reverse surface of the silicon substrate ( ). A fixed electrode ( ) is provided on both sides of the fixed contacts ( A, A). Wiring conductors ( ) electrically continuous with the fixed electrode ( ) are provided so as to pass through the silicon substrate ( ) from the obverse surface to the reverse surface thereof. Bumps ( ) electrically continuous with the wiring conductors ( ) are provided on the reverse surface of the silicon substrate ( ). Through holes ( ) of the silicon substrate ( ) through which the signal lines ( ) are passed and through holes ( ) of the silicon substrate ( ) through which the wiring conductors ( ) are passed are hermetically sealed by a movable substrate ( ) or a cap ( ).

Static relay and communication device using static relay

In one embodiment, a semiconductor device having single or multi-layer intermediate layers that easily adhere to a glass frit and lead lines of respective interconnections is disclosed. In general, the single or multi-layer intermediate layers are formed on at least the top surfaces of portions of the respective lead lines on which the glass frit is placed.

Semiconductor device and microrelay

A thin plate-shaped substrate comprised of a monocrystal is provided with a piezoelectric element , and both ends of a movable piece whose one surface is provided with a movable contact are fixed and supported to a base . Then, by curving the movable piece via the piezoelectric element , the movable contact is brought in and out of contact with a pair of fixed contacts and that face the movable contact. With this arrangement, a subminiature micro-relay having a mechanical contact mechanism that has a small resistance in turning on the contact and the desired vibration resistance, frequency characteristic and insulating property can be obtained.

Micro-relay and method for manufacturing the same

An electrostatic microrelay is disclosed. The electrostatic microrelay includes a fixed substrate having a fixed electrode and a fixed terminal on its upper surface and a moveable substrate having a moveable electrode and a moveable terminal on its lower surface. The moveable substrate is elastically supported by a support member that is disposed between the fixed substrate and the moveable substrate in a manner that the lower surface of the moveable substrate faces the upper surface of the fixed substrate at a certain distance. A protrusion is provided on the upper surface of the fixed substrate or the lower surface of the moveable substrate. The protrusion has a certain height. Upon applying voltage between the moveable electrode and the fixed electrode, the moveable electrode is attracted to the fixed electrode such that the protrusion provided on the upper surface of the fixed substrate or the lower surface of the moveable substrate contacts the other substrate and the moveable terminal elastically contacts the fixed terminal to close the microrelay in this order. Also, upon releasing the voltage from the electrode, the moveable terminal becomes reliably separated from the fixed terminal by a repulsive elastic force caused by the contact between the protrusion and the other substrate.

Electrostatic microrelay

A thin plate-shaped substrate comprised of a monocrystal is provided with a piezoelectric element and both ends of a movable piece whose one surface is provided with a movable contact are fixed and supported to a base Then, by curving the movable piece via the piezoelectric element the movable contact is brought in and out of contact with a pair of fixed contacts and that face the movable contact. With this arrangement, a subminiature micro-relay having a mechanical contact mechanism that has a small resistance in turning on the contact and the desired vibration resistance, frequency characteristic and insulating property can be obtained.

A movable substrate is supported on a base via first beam portions . A movable contact is supported on the movable substrate via a second beam portion which has an elasticity larger than the first beam portions

Growing community of inventors

Kyoto, Japan

Tomonori Seki