Cemedine Co., Ltd.

Tomonori Saito

Atsushi Saito

Naomi Okamura

Atsushi Ikeda

Hideharu Hashimukai

Naoko Ishihara

Provided is a curable composition which forms a cured product that has excellent fireproof performance, while having excellent shape retainability even in cases where the expansion ratio of the cured product after firing is set to a high value. This curable composition includes a shape retention agent, while having fluidity when applied; and if a cured product that is obtained by curing this curable composition is fired in 600&#xb0; C. air atmosphere for 30 minutes, the cured product after firing has shape retainability.

Curable composition for fireproofing

Provided is a one-part water-based adhesive composition which suffers no yellowing and is excellent in adhesiveness and durability. The one-part water-based adhesive composition includes (A) an aqueous dispersion of a polyurethane resin and (B) a silane compound obtained by reacting a specific epoxysilane compound with an aminosilane compound represented by the following Formula (2), the amount of the epoxysilane compound being in the range of 1.5 to 10 mol per 1 mol of the aminosilane compound, at a reaction temperature of 40 to 100&#xb0; C.  (In Formula (2), Rto Rare each a hydrogen atom or an alkyl group, Ris a monovalent hydrocarbon group, Ris an alkyl group, and b is 0 or 1.)

One-part water-based adhesive composition

Disclosed herein is a curable composition excellent in workability, adhesion properties, rubber-like properties, storage stability, and quick curability. The curable composition comprises (A) a crosslinkable silyl group-containing organic polymer and (B) a (meth)acrylic polymer obtained by polymerizing a (meth)acrylic monomer having a polymerizable unsaturated bond in the presence of a metallocene compound and a crosslinkable silyl group-containing thiol compound, at least one end of the (meth)acrylic polymer being bonded to a residue, &#x2014;S&#x2014;R(where Rrepresents a group having a crosslinkable silyl group) obtained by removing a hydrogen atom from the crosslinkable silyl group-containing thiol compound.

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Tokyo, Japan

Tomonori Saito