Kabushiki Kaisha Toshiba

Toshiba Memory Corporation

Kioxia Corporation

Tomonori Kurosawa

Takahiko Sasaki

Mizuki Kaneko

Takayuki Tsukamoto

Hiroshi Kanno

Yoichi Minemura

Takafumi Shimotori

Hiroshi Maejima

Koji Hosono

Dai Nakamura

Rieko Funatsuki

Koji Kato

Hidehiro Shiga

Kazushige Kanda

Tsukasa Kobayashi

Takeshi Nakano

Tomoki Higashi

Kazuaki Kawaguchi

Go Shikata

Shuichi Toriyama

Yuya Suzuki

Kazuhiko Satou

Osamu Kobayashi

Katsuaki Sakurai

According to an embodiment, a semiconductor memory device includes a memory cell, a first word line coupled between a control end of the memory cell and a first node, a resistance element coupled between the first node and a second node, a control circuit configured to output a voltage to the second node, a first switch coupled between the first node and a third node, a second switch coupled between the second node and the third node, and a comparator including an input end that receives a signal corresponding to a voltage of the third node.

Semiconductor memory device

A power source circuit includes: a plurality of power supply circuits which are electrically connected to different positions in a power supply wiring through which power is supplied to a plurality of processing circuits, wherein each of the power supply circuits is configured to generate a power supply voltage with reference to an input reference voltage, and supply the power supply voltage to the power supply wiring; and a reference voltage supply circuit generate a plurality of reference voltages with different voltages and to each of the plurality of power supply circuits, supply one of the different reference voltages as the input reference voltage thereof.

Power source circuit, input and output circuit, semiconductor storage device, and power supply control method

In one embodiment, a semiconductor device includes a reference voltage supply circuit configured to supply a first reference voltage and a second reference voltage. The device further includes a power source voltage supply circuit including a first power source voltage generator supplied with the first reference voltage and configured to generate a first power source voltage, and a second power source voltage generator supplied with the second reference voltage and configured to generate a second power source voltage, the power source voltage supply circuit being configured to supply the first power source voltage and the second power source voltage to a power source voltage line. The device further includes a voltage control circuit connected to the power source voltage line, and configured to control a value of the first reference voltage and a value the second reference voltage.

Semiconductor device having plural power source voltage generators, and voltage supplying method

According to one embodiment, a semiconductor memory device includes a plurality of memory cells; a first circuit configured to convert first data into second data relating to an order of thresholds of the memory cells; and a second circuit configured to perform a write operation on the memory cells based on the second data.

According to one embodiment, a memory device includes a memory cell, a word line connected to the memory cell, a word line driver which generates a selection signal for the word line, a first transistor including a gate to which the selection signal generated by the word line driver is input, and a drain which supplies a signal based on the selection signal to the word line, and a detection circuit which detects a value based on a current flowing through the first transistor during a verification period after writing data to the memory cell.

Memory device having memory cell and current detection circuit

According to one embodiment, a semiconductor memory device includes first and second memory cells, a word line, first and second bit lines, a sense amplifier and a driver. The first and second memory cells have first and second threshold voltages, respectively. The word line is electrically connected to the first and second memory cells. The first and second bit lines are electrically connected to the first and second memory cells, respectively. The driver increases gradually the voltage of the word line. When the voltage of the word line is increased gradually by the driver, the sense amplifier senses the first and second threshold voltages in ascending order.

Semiconductor memory device configured to sense memory cell threshold voltages in ascending order

According to one embodiment, a memory device includes a first memory cell; a second memory cell; a first bit line connected to the first memory cell; a second bit line connected to the second memory cell; a first word line connected to the first memory cell and the second memory cell; a first circuit configured to control a connection between the first bit line and a first node; and a second circuit configured to control a connection between the second bit line and the first node.

Method of operation of non-volatile memory device

A nonvolatile semiconductor memory device according to one embodiment includes: a first wiring extending in a first direction as a longitudinal direction thereof; a second wiring extending in a second direction as a longitudinal direction thereof, the second direction intersecting with the first direction; a memory cell disposed at an intersection portion of the first wiring and the second wiring, the memory cell including a variable resistive element; a select transistor having one end connected to the second wiring; and a third wiring connected to the other end of the select transistor. A semiconductor layer included in the select transistor has a first impurity concentration at the second end. An impurity concentration of the semiconductor layer decrease to a second impurity concentration from the first impurity concentration as approaching to the first end from the second end.

Resistive memory with varying dopant concentration in select transistor channel

A semiconductor memory device includes a first block including a first memory string that includes a first memory cell and a first select transistor, a second block including a second memory string that includes a second memory cell and a second select transistor, a source line that is connected to the first memory string and the second memory string, and a controller that applies a source line voltage to the source line and a first voltage to a gate of the second select transistor during a program operation in which data is written to the first memory cell, the first voltage being greater than ground voltage and less than or equal to the source line voltage.

A memory device includes a plurality of memory blocks, and a row decoder including a plurality of decoders including a first decoder and a second decoder, the first decoder being configured to output a first block selection signal for selecting one of the memory blocks and a control signal for causing the second decoder to output a second block selection signal for selecting another one of the memory blocks.

Memory device including memory blocks and decoders to output memory block selection signals

According to one embodiment, a semiconductor memory device includes a plurality of cell array blocks and a control circuit. The control circuit sets a selected bit line to have 0 volt, applies a first electric potential which is higher than 0 volt to a selected word line, applies a second electric potential which is higher than 0 volt and lower than the first electric potential to non-selected word lines other than the selected word line, applies a third electric potential which is 0 volt or more and lower than the second electric potential to a non-selected bit line adjacent to the selected bit line in an adjacent cell array block, applies the second electric potential to non-selected bit lines other than the non-selected bit line to which the third electric potential is applied, and changes a resistance status of the resistance variable film of the selected memory cell.

A semiconductor storage device includes a memory cell array, and a control circuit. The memory cell array has memory cells including variable resistive elements disposed at intersections of a plurality of first lines and a plurality of second lines. The control circuit performs a set pulse applying operation, and a cure pulse applying operation. The set pulse applying operation applies a set pulse to a variable resistive element so as to cause the variable resistive element to transition from a high resistance state to a low resistance state. The cure pulse applying operation applies a cure pulse to the variable resistive element. The cure pulse has a polarity that is opposite of a polarity of the set pulse, and is larger than the set pulse.

Semiconductor storage device and method of controlling data thereof

In a memory cell array, memory cells each including a variable resistance element are arranged at crossing portions between a plurality of first wiring and a plurality of second wirings. A control circuit executes a set operation, a reset operation, and a training operation. In the set operation, a set pulse is applied to the variable resistance element to change the variable resistance element from a high resistance state to a low resistance state. In the reset operation, a reset pulse having an opposite polarity to the polarity of the set pulse is applied to the variable resistance element to change the variable resistance element from the low resistance state to the high resistance state. In the training operation, the set pulse and the reset pulse are continuously applied to the variable resistance element.

Semiconductor storage device and data control method thereof

According to one embodiment, a semiconductor memory device includes a semiconductor substrate, a plurality of memory cells, a plurality of wires, and a control circuit. The control circuit allows a first current to change a state to flow on a selected cell by applying a first potential difference between a pair of wires that sandwich the selected cell selected from the plurality of memory cells with respect to the semiconductor substrate vertically, and allows a second current lower than the first current to flow on an non-selected cell in the same direction as the direction of the first current by applying a second potential difference between a pair of wires that sandwich the non-selected cell connected to a wire shared with the selected cell on a different layer from the selected cell.

Growing community of inventors

Zama, Japan

Tomonori Kurosawa