Panasonic Corporation

Panasonic Intellectual Property Management Co., Ltd.

Tomonori Itoh

Hiroki Ikeuchi

Takeshi Kawabata

Masaru Nonomura

Kaori Toyoda

Kentaro Nishiwaki

A manufacturing method of white-light emitting elements that is one example of the present invention is a manufacturing method of a white-light emitting element with the light emitting diode chip covered with the fluorescent-body-containing resin member that has been formed with the fluorescent-body-containing resin material containing a resin and fluorescent bodies, and includes: an irradiating step of irradiating the fluorescent-body-containing resin material with the blue laser beam; a measuring step of measuring the fluorescence strength of the fluorescence light emission from the fluorescent bodies that have been excited by the blue laser beam with which the irradiation has been carried out; and an applying step of applying, to the light emitting diode chip, a quantity of the fluorescent-body-containing resin material, the quantity being based on the fluorescence strength that has been measured.

Manufacturing method of light emitting elements, and manufacturing apparatus of light emitting elements

When bump electrodesof a semiconductor light-emitting elementand electrode portionsof a mounting boardare joined to each other, power is supplied to the electrode portionsof the mounting boardto allow the semiconductor light-emitting elementto emit light, the optical properties of the semiconductor light-emitting elementhaving emitted light are detected, and the detected value of optical properties is processed to obtain the joining state of the bump electrodesof the semiconductor light-emitting elementand the electrode portionsof the mounting board, so that the completion of joining is determined. Thus, the semiconductor light-emitting element can be satisfactorily joined to the electrode portions on the mounting board via the metal electrodes formed on the semiconductor light-emitting element.

Apparatus and method for mounting semiconductor light-emitting element

A device for resin coating is used for producing an LED package including an LED element covered with resin containing phosphor. In a state in which a trial coating materialis located by a clamp unit, a trial coating of resin applied to the trial coating materialis irradiated with excitation light and light emitted from the phosphor contained in the resin is measured by an emission characteristic measuring unit. A deviation of the measurement result of the emission characteristic measuring unit from a prescribed emission characteristic is determined, and then a proper amount of resin to be applied to the LED element is derived for actual production based on the deviation.

Growing community of inventors

Kyoto, Japan

Tomonori Itoh