Tdk Corporation

Tomonaga Nishikawa

Tomokazu Ito

Makoto Yoshida

Takeshi Okumura

Hiroshi Kamiyama

Kouji Kawamura

Masanori Suzuki

Naoaki Fujii

Hidenori Tsutsui

Manabu Yamatani

Nobuya Takahashi

Masaki Endo

Kazuhiko Maejima

Tadashi Watanabe

Yuuichi Kawaguchi

Takuya Takeuchi

Sho Nakagomi

Ikuya Kokubo

Masaki Yoneyama

Hiraku Hirabayashi

Kenji Tanaka

Takashi Nakagawa

Toshio Tomonari

Masahiro Nakajima

Fumio Watanabe

Makoto Endo

Hajime Kuwajima

Hironori Sato

Takashi Ohtsuka

Yuichiro Okuyama

Tsuneo Kuwahara

Mitsuyoshi Kawai

Takeshi Oohashi

Hitoshi Ozawa

Tsutomu Chikamatsu

Osamu Nakada

Yosuke Mizutani

Tatsuya Karakame

Liyi Chen

Ryota Naito

Mitsuhiko Endo

Azuma Satoh

Hiroshi Sagawa

Mitsuo Natori

Kenichi Hirenzaki

Disclosed herein is a coil component that includes a first conductor layer having first and third planar spiral coils and second conductor layer having second planar spiral coil. The first planar spiral coil is positioned on an outer peripheral side of the third planar spiral coil. The first planar spiral coil has a pattern width larger than that of the third planar spiral coil. The second planar spiral coil is offset to the third planar spiral coil side in a plan view.

Coil component

Disclosed herein is a coil component that includes a a coil area in which first to third coil patterns are disposed and a terminal area positioned outside the coil area. The outer peripheral end of the first coil pattern is connected to the first terminal electrode. The inner peripheral end of the first coil pattern is connected to an inner peripheral end of the second coil pattern. The outer peripheral end of the second coil pattern is connected to an outer peripheral end of the third coil pattern. A via conductor connecting the outer peripheral ends of the second and third coil patterns is disposed at a position overlapping the terminal area.

Disclosed herein is a surface-mount electronic component that includes a main body part having a mounting surface, a first terminal electrode provided on one end side of the mounting surface in a long side direction thereof, and a second terminal electrode provided on other end side of the mounting surface in the long side direction thereof. Each of the first and second terminal electrode includes a main area extending in a short side direction of the mounting surface and a protruding part provided at a center portion in the short side direction so as to protrude from the main area to an end portion of the mounting surface in the long side direction.

Surface-mount electronic component and circuit board having the same

A coil component includes spiral conductor patterns Sand Sand insulating resin layers that cover the spiral conductor patterns Sand S, respectively. An outermost turn of the spiral conductor pattern Shas a widened part. As a result, an outer wall surface part constituting the outer wall surface of the outermost turn in the radial direction and an outer wall surface part constituting the outer wall surface of the outermost turn of the spiral conductor pattern Sin the radial direction differ in radial position from each other. Overlap of the insulating resin layers in the lamination direction is reduced to suppress thermal expansion or contraction of the insulating resin layers in the lamination direction at the overlap. This can relieve a stress applied to the interface between the spiral conductor pattern and the insulating resin layer.

Coil component and its manufacturing method

Disclosed herein is a coil component that includes an element body having first and second magnetic layers and a coil part positioned therebetween, and first and second external terminals formed on the element body. The first external terminal is formed on the mounting surface and the first side surface. The second external terminal is formed on the mounting surface and the second side surface. The first and second external terminals formed on the first and second side surfaces, respectively, have a meander shape.

Disclosed herein is a coil component that includes: a magnetic element body containing magnetic powder, the magnetic element body having first and second surfaces; a coil conductor embedded in the magnetic element body; and an external terminal connected to the coil conductor and exposed on the first surface of the magnetic element body. The second surface of the magnetic element body is free from the external terminal. The first surface is greater in surface roughness than the second surface.

Coil component and method of manufacturing the same

A coil component is provided with a coil part in which a plurality of conductor layers and a plurality of interlayer insulating layers are alternately laminated; and a sealing resin layer that covers the coil part. The conductor layers each include a spiral pattern. The interlayer insulating layers each cover an upper surface and a side surface of the spiral pattern. The recessed part is formed in the side wall surface of the interlayer insulating layer. A part of the sealing resin layer is embedded in the recessed part.

Coil component and manufacturing method therefor

A coil component includes: a first magnetic resin layer in a lower area; a second magnetic resin layer in an inner diameter area surrounded by a coil pattern, an outer peripheral area that surrounds the coil pattern, and an upper area; and an insulating gap layer between the first and second magnetic resin layers. A part of the insulating gap layer positioned between the first magnetic resin layer and a part of the second magnetic resin layer positioned in the inner diameter area is curved in the axial direction. A magnetic substrate need not be used. The insulating gap layer is provided, allowing the insulating gap layer to function as a magnetic gap. The insulating gap layer is curved in the axial direction, so that a contact area between the insulating gap layer and the first and second magnetic resin layers are increased to enhance adhesion therebetween.

Disclosed herein is an electronic component that includes: a base having a main surface; a passive element part formed on the main surface of the base; a magnetic resin layer formed on the main surface of the base so as to embed the passive element part therein, the magnetic resin layer having a surface extending substantially parallel to the main surface of the base; an insulating coat layer formed on a first area of the surface of the magnetic resin layer, the insulating coat layer having higher smoothness than the surface of the magnetic resin layer; and a terminal electrode formed on a second area of the surface of the magnetic resin layer and electrically connected to the passive element part.

Electronic component and manufacturing method thereof

A coil component includes a plurality of conductor layers constituted of a first conductor layer to a fourth conductor layer that includes a function layer and a coil layer wound around an axis center; and a covering portion that is formed of an insulative resin, integrally covers the plurality of conductor layers, and is interposed between conductor layers adjacent to each other. The coil layer and the function layer of the plurality of conductor layers have substantially the same shape in a plan view. The fourth conductor layer has a connection conductor layer connecting the coil layer and the function layer to each other. A conductor layer having no connection conductor layer among the plurality of conductor layers has a protrusion portion corresponding to the connection conductor layer at a position overlapping the connection conductor layer in a plan view.

Disclosed herein is a coil component that includes: a coil part in which a plurality of conductor layers and a plurality of interlayer insulting layers are alternately laminated, the coil part having a mounting surface substantially parallel to the lamination direction and an upper surface substantially parallel to the lamination direction and positioned on an opposite side to the mounting surface; and a direction mark comprising a conductive material that covers a part of the conductor layers exposed on the upper surface.

Coil component and manufacturing methods thereof

Disclosed herein is a coil component that includes a coil part in which a plurality of conductor layers and a plurality of interlayer insulting layers are alternately laminated, and an external terminal. Each of the conductor layers has a coil conductor pattern and an electrode pattern exposed from the coil part. The electrode patterns are connected to each other through a plurality of via conductors penetrating the interlayer insulating layers. At least one of the interlayer insulating layers is exposed from the coil part positioned between the plurality of electrode patterns. The external terminal is formed on the electrode patterns exposed from the coil part so as to avoid an exposed part of the interlayer insulating layer.

Disclosed herein is a coil component that includes a first planar spiral conductor; a second planar spiral conductor laminated on the first planar spiral conductor and wound in an opposite direction to the first planar spiral conductor; a first external terminal electrically connected to an outer peripheral end of the first planar spiral conductor; a second external terminal electrically connected to an outer peripheral end of the second planar spiral conductor; and a third external terminal electrically connected in common to inner peripheral ends of the first and second planar spiral conductors.

Coil component and circuit board in which coil component are embedded

Disclosed herein is a coil component that includes a spiral conductor, a magnetic material layer covering the spiral conductor and having a through hole exposing an end of the spiral conductor, a through-hole conductor embedded in the through hole and has first region and second regions that are exposed from the magnetic material layer, a first conductor layer formed on an upper surface of the magnetic material layer and covering the first region of the through-hole conductor without covering the second region, and a second conductor layer covering the first conductor layer and the second region of the through-hole conductor, wherein the second conductor layer has a lower resistance than the first conductor layer.

Disclosed herein is a multilayer wiring structure that includes a first metal layer; an interlayer insulating film formed on the first metal layer, the interlayer insulating film having an opening that exposes a first area of the first metal layer; a second metal layer formed on an inner wall of the opening; and a third metal layer filling the opening via the second metal layer. The first and third metal layers are direct contact with each other at a bottom of the opening.

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Tokyo, Japan

Tomonaga Nishikawa