Murata Manufacturing Co., Ltd.

Tomomi Yasuda

Takanori Uejima

Yukiya Yamaguchi

Syunsuke Kido

Masanori Kato

Hiroshi Nishikawa

Yuuki Fukuda

Masanari Miura

Takuma Kuroyanagi

Naru Morito

Yutaka Shuto

A hybrid filter includes a module substrate having a major surface and a major surface that are opposite to each other, acoustic wave resonator elements disposed at the module substrate, inductors disposed at the module substrate, and a capacitor disposed at the module substrate. The pass band of the hybrid filter is wider than the resonance band width of the acoustic wave resonator elements. One of the acoustic wave resonator elements, the inductors, and the capacitor is a first circuit element, and the first circuit element is disposed at the major surface. Another of the acoustic wave resonator elements, the inductors, and the capacitor is a second circuit element, and the second circuit element is disposed at the major surface.

Hybrid filter, multiplexer, radio-frequency module, and communication device

A radio-frequency module includes a mounting board, a first electronic component, and a second electronic component. The second electronic component is lower in height than the first electronic component. The mounting board includes dielectric layers, conductive layers, and via-conductors. In the mounting board, the dielectric layers and the conductive layers are stacked in the thickness direction of the mounting board. The mounting board has a first region and a second region. The first region overlaps the first electronic component and extends from a first major surface to a second major surface. The second region overlaps the second electronic component and extends from the first major surface to the second major surface. In the mounting board, the conductive layers in the first region are fewer than the conductive layers in the second region. In the mounting board, the first region is thinner than the second region.

Radio-frequency module and communication device

A high-frequency module () includes a substrate (), a first electronic component () and a second electronic component () mounted on a main surface () of the substrate (). The substrate () has a protruding portion () projecting from the main surface (), the first electronic component () is mounted in a region of the main surface () different from a region in which the protruding portion () is provided, and the second electronic component () is mounted on the protruding portion ().

High-frequency module

Growing community of inventors

Kyoto, Japan

Tomomi Yasuda