Mitsubishi Denki Kabushiki Kaisha

Mitsubishi Electric Engineering Industrial Co., Ltd.

Tomomi Morii

Shigeo Onoda

Makoto Omori

Jun Ohbuchi

Kiyotaka Nishino

Yasuhiro Murasawa

Takeshi Uenaka

Jun Obuchi

There is provided an IC card and manufacturing method thereof assuring a highly reliable fixed portion in fixing upper and lower panel members to a frame made of resin as well as an advantage in terms of manufacturing cost. In the IC card in which a pair of upper and lower panel members covering card planar portions are respectively fixed to the upper and the lower surfaces of a resin frame which supports a peripheral portion of an electric circuit board and a connector attached to an end portion of the electric circuit board, the panel members have their peripheral edge portions which are provided with a bent portion extending along the peripherial edge portions and are formed by bending the panel material at a specified angle, and a welding use resin layer is formed on the surface of the bent portion and the periphery of the planar portion of the panel member. On the other hand, the frame is provided with a groove portion for receiving therein the bent portion, and the welding use resin layer is melted in a pressurized state while making the welding use resin layer abut against the frame with the bent portion fitted in to the groove portion, thereby fixing the panel members to the frame.

IC card and manufacturing method thereof

In an IC card, a frame for connecting a board for mounting electronics components is covered by upper and lower panels. A main connector for connecting the IC card to a computer is provided at one end of the frame. Further, one or more subconnectors to be connected to external systems are provided on the board and the pins of the subconnectors extend towards openings in the upper panel. The subconnectors are supported between the board and the upper panel. Thus, various kinds of subconnectors for various functions can be used with the IC card. In a modified example, a subconnector is provided opposite the main connector on the upper panel, and the pins thereof extend in a direction parallel to the board.

IC card

There is provided an IC card where a pair of, upper and lower metal panels are respectively fixed to the frame; edge portions of the metal panel are provided with bend portions; grooves each of which comprises a pair of uneven vertical walls having a plurality of depressions and projections extending in the direction of the width of the frame are provided on the top and bottom surfaces of the frame; the distance between the projections on both the uneven vertical walls in the direction of the width of the frame is set so as to be smaller than the thickness of the bend portions by a given amount; and the metal panel is fixed to the frame with the bend portions press-fitted into the grooves along the projections. The IC card is advantageous in the manufacturing cost and is capable of stably providing a fixing force sufficient to withstand a long-term use, with regard to the fixation of upper and lower panel members to a frame.

A semiconductor device card receiving a circuit substrate (1) which has electronic component parts (2) assembled therein, comprises a pair of metal sheets (10, 10) forming a front and a back surfaces of the card and a pair of opposed resin-made frames (11, 12) surrounding peripheries of the respective metal sheets to be connected by embedding bent portions 100 of the peripheries of the metal sheets (10, 10) into the resin-made frames (11, 12), and the paired opposed frames are provided at their contact end portions with fusible projections (13) and grooves (14) adapted to engage with the projections (13) and are connected to each other by fusing at least a leading end of the projection (13) within the groove (14). A plurality of projecting portions (10a) are projected downward from the bent portions (100) of one of the paired metal sheets 10 and engaging portions (10b) adapted to engage with the projecting portions (10a) are formed in the bent portions (100) of the opposite metal sheet (10), so that the paired sheet metals can be electrically conducted to each other by the engagement between the projecting portions (10a) and the engaging portions (10b) and the connection of the opposed side frames can be reinforced. The connecting strength can be improved by employing an ultrasonic bonding. While the number of the components parts can be decreased, the connecting strength can be further improved.

Semiconductor device card

An IC card with an on-board hard disk unit comprising a frame; a circuit board inside the frame; and a hard disk unit mounted on the circuit board. The IC card also has a metal front panel supported by the frame, and covering the entire IC card, including the hard disk unit. Thus, the outer surface of the IC card is made stronger, and the hard disk is protected from static electricity. The metal front panel includes a first portion where the IC card is relatively thin and a second, bulging portion where the IC card is relatively thick. The bulging portion accommodates the hard disk unit. The front panel may include a vent or mesh.

IC card with on-board hard disk and circuit board with on-board hard

An IC memory card has a connector that cannot warp during the manufacturing process even if the connector is long, such as a connector at one longer side of the IC memory card with an increased number of poles. The IC memory card has grooves in the surfaces of a flange portion of the connector body opposing a surface with which the connection with an external unit is established, the grooves being adjacent the connector body and extending lengthwise along all of the longer side of the IC memory card for preventing warping.

Growing community of inventors

Tokyo, Japan

Tomomi Morii