Kabushiki Kaisha Toshiba

Tomomi Ino

Yukihiro Ushiku

Akira Ogawa

Akira Soga

Yoshiaki Akama

Junji Sugamoto

Hidenori Kakinuma

Giichi Inoue

Tsutomu Miki

Yoshinori Ookawauchi

According to one embodiment, a manufacturing process monitoring system for monitoring anomaly in a manufacturing process for products, the system includes an information storage section, a selection information section, a reference space formation section and a monitoring section. The information storage section is configured to store previously collected data. The selection information section is configured to create information used in classifying the data stored in the information storage section. The reference space formation section is configured to form a reference space based on data subjected to anomaly monitoring acquired in the manufacturing process and the data classified by the information from the data stored in the information storage section. The monitoring section is configured to monitor anomaly of the data subjected to anomaly monitoring based on the reference space.

Manufacturing process monitoring system and manufacturing process monitoring method

A quality control system has: a QC value storage unit, a data acquisition device, a device internal information storage unit, a recipe storage unit, a QC value prediction unit, a wafer determination unit, a recipe selection unit, and a measurement device.

Quality control system, quality control method, and method of lot-to-lot wafer processing

A process-state management system encompasses: a plurality of production machines; a control server configured to collectively control at least part of the production machines; a management server including a data-linking module configured to link operation-management data of the production machines with corresponding management information transmitted from the control server, respectively, the management server analyze the operation-management data linked with the management information with a common analysis application; and a management database configured to store the operation-management data linked with the management information.

Process-state management system, management server and control server adapted for the system, method for managing process-states, method for manufacturing a product, and computer program product for the management server

A temperature measuring apparatus, comprises a light splitting section for splitting the light radiated from a substrate into plural light components having wavelengths over a predetermined wavelength region, a detection section for detecting the intensities of the light components obtained by the light splitting section, an integrated value calculating section for calculating an integrated value of radiation intensity by cumulatively adding the intensities of the light components detected by the detecting section, and a surface temperature calculating section for calculating the surface temperature of the substrate from the integrated value, on the basis of reference data representing the relation between the temperature and the integrated value.

Temperature measuring method and apparatus, measuring method for the thickness of the formed film, measuring apparatus for the thickness of the formed film thermometer for wafers

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Kanagawa-ken, Japan

Tomomi Ino