Kabushiki Kaisha Toshiba

Toshiba Memory Corporation

Tomoko Ojima

Masafumi Asano

Kazuhiro Takahata

Yoko Takekawa

Yingkang Zhang

A method of manufacturing a semiconductor device according to an embodiment includes forming a first interlayer film on a first layer, the first interlayer film containing a first molecule and a second molecule, and the first molecule and the second molecule being chemically bonded with each other. The method of manufacturing a semiconductor device includes phase-separating the first interlayer film. The method of manufacturing a semiconductor device includes forming a second layer on the phase-separated first interlayer film. The first molecule has a first affinity with the first layer and a second affinity with the second layer, the first affinity being larger than the second affinity. The second molecule has a third affinity with the second layer and a fourth affinity with the first layer, the third affinity being larger than the fourth affinity.

Method of manufacturing semiconductor device

According to one embodiment, a mask pattern creation method includes extracting an area, in which a DSA material is directed self-assembled to form a DSA pattern, from a design pattern area based on a design pattern and information on the DSA material. The method also includes creating a guide pattern that causes the DSA pattern to be formed in the area based on the design pattern, the information on the DSA material, the area, and a design constraint when forming the guide pattern. The method further includes creating a mask pattern of the guide pattern using the guide pattern.

Mask pattern creation method, recording medium, and semiconductor device manufacturing method

According to one embodiment, a pattern formation method includes, before forming a circuit pattern on a substrate using imprinting, a wall pattern with a predetermined height is formed to surround the periphery of an area serving as imprint shots on the substrate in each imprint shot and to allow the imprint shots to be separated from one another. The circuit pattern is formed in the imprint shots surrounded by the wall pattern through imprinting.

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Tokyo, Japan

Tomoko Ojima