Nok Corporation

Nippon Mektron Limited

Tomoko Nakano

Keiichi Miyajima

Naohiro Fujisawa

Kenji Minoshima

Takashi Sasaki

Provided is an IC tag favorably applicable even to linen products. An IC tagusing a magnetic field type tag unitin which an IC chip and a coil antenna to be electrically connected to the IC chip are embedded inside a hard resin material. The IC tag includes: a flexible film made of resin (a base film, a cover film, and a protective film); and an auxiliary antennaformed on the film, wherein the magnetic field type tag unitis fixed to the film by an adhesivewith elasticity at a position that enables communication by electromagnetic coupling between the coil antenna and the auxiliary antenna

Flexible IC tag

Integrated circuit tag

There is provided an IC tag that is simple in structure and in which concentration of stress in a portion near the connection of an IC chip and an antenna part can be reduced. The IC tagincludes a film member, an antenna partprovided on the film member, an IC chipmounted on the film memberin such a way as to be connected with the antenna part. A slitis provided at a position away from the antenna partin the region on the film membernear the site at which the IC chipis mounted, and a coveringmade of an elastic material is provided to cover at least the entire area of the IC chipand a portion of connection of the IC chipand the antenna part

IC tag

The disclosure prevents, with improved reliability, an IC tag from being broken, while ensuring overall flexibility of the IC tag. The IC tagis provided with a coveringmade of an elastic material, which covers at least the side of the IC tagon which an IC chipis mounted and has a thickness that is larger in its portionthat covers a region about the IC chipthan in its portionthat covers a region outside the region about the IC chip. The coveringis configured in such a way that at least a part of a boundary of the portionof the covering that covers the region about the IC chipand the portionof the covering that covers the region outside the region about the IC chiphas a curved shape.

In order to enhance a shape retaining property of a gasket consisting only of a rubber, prevent damage to a casing for an electronic equipment due to high reactive force of the gasket, and make assembling of the casing easy, a seal structure comprises a gasket installed in a non-adhesion manner between a case and a lid to be interposed in a compressed state when the case and the lid are assembled, and a resin film integrated with the gasket to enhance the shape retaining property of the gasket, the gasket has a portion compressed between the case and the lid when they are assembled, and a portion not compressed between them when assembled and the resin film is integrated with the portion which is not compressed.

Growing community of inventors

Fujisawa, Japan

Tomoko Nakano