Asahi Kasei Kabushiki Kaisha

Tomoko Kozono

Akio Inoue

Toru Yumoto

Provided are: a structure with a conductive pattern that can be obtained in a simple manufacturing process and that exhibits favorable interlayer adhesion; and a method for manufacturing same. An embodiment of the present invention provides a structure with a conductive pattern, the structure comprising a base material, and a copper-containing conductive layer arranged on the surface of the base material, wherein when a principal surface of the conductive layer on the side facing the base material is a first principal surface, and a principal surface of the conductive layer on the opposite side from the first principal surface is a second principal surface, the conductive layer: has a porosity of 0.01 to 50 volume percent in a first principal surface-side region that extends from the first principal surface to a depth of 100 nm in the thickness direction of the conductive layer.

Structure with conductive pattern and method for manufacturing same

An electrorheological fluid which comprises a dispersion medium containing fluorine atoms in an amount larger than 0 wt % but not larger than 50.0 wt % and particles for electrorheological fluid use that are contained in the dispersion medium in an amount of 10-50 vol % of the total volume of the dispersion medium and the particles, the particles comprising a sulfonic-acid-group-containing polymer having a sulfonic acid group content of 30-70 wt %.

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Tokyo, Japan

Tomoko Kozono