Dow Corning Toray Company, Ltd.

Dow Corning Toray Silicone Company Limited

Dow Corning Corporation

Dow Toray Co., Ltd.

Tomoko Kato

Yoshitsugu Morita

Hiroji Enami

Minoru Isshiki

Kazumi Nakayoshi

Hiroshi Ueki

Masayuki Onishi

Harumi Kodama

Masayoshi Terada

Makoto Yoshitake

Kimio Yamakawa

Hiroki Ishikawa

Toyohiko Fujisawa

Junji Nakanishi

Shinichi Yamamoto

Ryoto Shima

Katsutoshi Mine

Toshio Saruyama

Brian Harkness

Ann Walstrom Norris

Michelle R Cummings

Masashi Murakami

Tammy Cheng

Atsushi Togashi

Malinda Howell

Osamu Tanaka

Minuro Isshiki

Narumasa Domae

A single-fluid curable thermally conductive silicone grease composition having long-term storage stability at room temperature is provided. The single-fluid curable thermally conductive silicone grease comprises: an organopolysiloxane, having an aliphatic unsaturated hydrocarbon group per single molecule, with a viscosity at 25&#xb0; C. between 50 and 100,000 mPa&#xb7;s; an organohydrogen siloxane that includes hydrogen atoms bonded to at least two silicon atoms per single molecule; a thermally conductive filler that includes particle diameters with an average particle diameter between 0.01 and 200 &#x3bc;m; a microparticle catalyst, with an average particle diameter of between 0.01 and 10 &#x3bc;m, comprising a thermoplastic resin with a softening point between 40&#xb0; C. and 200&#xb0; C., wherein a platinum-based catalyst is included at no less than 0.01 mass %, as platinum metal atoms; and a curing control agent. The complex modulus of elasticity after curing of the composition is between 0.01 MPa and 20 MPa at 25&#xb0; C.

Thermally conductive silicone compound

Provided are a thermally conductive silicone composition excelling in heat resistance and thermal conductivity, in which thickening in an uncured state is suppressed, and which has excellent handling ease; and an electrical/electronic apparatus in which the thermally conductive silicone composition is used as a member. The thermally conductive silicone composition comprises (A) 100 parts by mass of either i) (a1) an organopolysiloxane having, in each molecule thereof, at least one alkoxysilyl-containing group bonded to a silicon atom and expressed by the general formula: and as generally described herein, or ii) a mixture of component (a1) and (a2) an organopolysiloxane having in each molecule thereof, at least two alkenyl groups but not the alkoxysilyl-containing group. In the mixture, the content of component (a1) is 10 to less than 100 mass %. The thermally conductive silicone composition further comprises (B) 400 to 3,500 parts by mass of a thermally conductive filler.

Thermally conductive silicone composition and electrical/electronic apparatus

A curable organopolysiloxane composition that can achieve excellent initial adhesion improvement effects towards various types of substrates, and a protective agent or adhesive composition for electric and electronic components, are provided. The curable organopolysiloxane composition comprises (A) either i) (a1) an organopolysiloxane having a specific alkoxysilyl-containing group and at least an average of 0.5 alkenyl groups, or ii) a mixture of (a1) and (a2) an organopolysiloxane that has at least two alkenyl groups in a molecule, and that does not have the aforementioned group having an alkoxysilyl group. In the mixture, the amount of component (a1) is 10 to less than 100 mass %. The curable organopolysiloxane composition further comprises (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in each molecule, (C) a catalyst for a hydrosilylation reaction, and (D) a catalyst for a condensation reaction.

Curable organopolysiloxane composition, and protective-agent or adhesive-agent composition for electrical/electronic components

A thermally conductive silicone grease composition comprising at least the following components: (A) an organopolysiloxane which is liquid at 25&#xb0; C. and is represented by the following average compositional formula: RSiO, where, Ris a monovalent hydrocarbon group; and 'a' is a number ranging from 1.8 to 2.2; (B) a thermally conductive filler composed of constituents (B) to (B) given below, wherein: constituent (B) is spherical aluminum oxide powder with an average particle diameter ranging from 15 to 55 &#x3bc;m; constituent (B) is spherical aluminum oxide powder with an average particle diameter ranging from 2 to 10 &#x3bc;m; constituent (B) is aluminum oxide powder with an average particle size not exceeding 1 &#x3bc;m; and (C) an alkoxysilyl-containing organopolysiloxane. The composition, along with high thermal conductivity, possesses excellent handleability and low coefficient of friction.

Thermally conductive silicone grease composition

A method of manufacturing a semiconductor device sealed in a cured silicone body by placing an unsealed semiconductor device into a mold and subjecting a curable silicone composition which is fed into the space between the mold and the unsealed semiconductor device to compression molding, the method being characterized by the fact that the aforementioned curable silicone composition comprises at least the following components: (A) an epoxy-containing silicone and (B) a curing agent for an epoxy resin; can reduce warping of the semiconductor chips and circuit board, and improve surface resistance to scratching.

Method of manufacturing a semiconductor device and a semiconductor device produced thereby

A thermally conductive silicone grease composition comprising at least the following components: an organopolysiloxane (A) represented by the following general formula: [wherein Rdesignates identical or different univalent hydrocarbon groups; X designates identical or different univalent hydrocarbon groups or alkoxysilyl-containing groups of the following general formula: &#x2014;R&#x2014;SiRa(OR)(wherein Rdesignates the previously mentioned groups; Rdesignates oxygen atoms or alkylene groups; Rdesignates alkyl groups; and 'a' is an integer ranging from 0 to 2); and 'm' and &#x2018;n&#x2019; are integers equal to or greater than 0, respectively]; a thermally conductive filler (B); and an organopolysiloxane (C) having silicon-bonded hydrogen atoms on both molecular terminals and in the molecular chains; is characterized by excellent resistance to heat and reduced oil bleeding. 

A thermally conductive silicone composition of the invention comprises: (A) an organopolysiloxane having a viscosity of at least 500 mPa&#xb7;s at 25&#xb0; C.; (B) a thermally conductive filler; (C) a fine silica powder; (D) an organopolysiloxane having a hydrolyzable group and having a viscosity of less than 500 mPa&#xb7;s at 25&#xb0; C.; and (E) a silane compound containing a hydrolyzable group. The composition possesses excellent handleability and workability at low viscosity and which, after application onto surfaces, is not subject to slipping-off when this surface assumes a vertically position, even under harsh temperature conditions.

Thermally conductive silicone composition and electronic device

A curable organopolysiloxane composition and an optical semiconductor element sealant, each comprising (A) a diorganopolysiloxane that has at least 2 alkenyl groups wherein at least 70 mole % of all the siloxane units are methylphenylsiloxane units and the total content of 1,3,5-trimethyl-1,3,5-triphenylcyclotrisiloxane and 1,3,5,7-tetramethyl-1,3,5,7-tetraphenylcyclotetrasiloxane is no more than 5 weight %, (B) an organopolysiloxane that has at least 2 silicon-bonded hydrogen atoms wherein at least 15 mole % of the silicon-bonded organic groups are phenyl groups, and (C) a hydrosilylation reaction catalyst. An optical semiconductor device in which an optical semiconductor element within a housing is sealed with the cured product from the aforementioned composition.

Curable organopolysiloxane composition, optical semiconductor element sealant, and optical semiconductor device

A curable silicone composition comprising: (A) an organopolysiloxane that is represented by a specific average unit formula and that has at least two of the aforementioned epoxy-functional monovalent organic groups in each molecule; (B) a diorganosiloxane represented by the general formula: A-R&#x2014;(RSiO)RSi&#x2014;R-A, wherein Ris substituted or unsubstituted mono-valent hydrocarbon group that does not contain an aliphatically unsaturated bond, Ris a divalent organic group, A is a siloxane residue with a specific average unit formula, and m is an integer with a value of at least 1; and (C) a curing agent for epoxy resin, exhibits excellent handling and curing characteristics and that cures to give a cured product that exhibits excellent flexibility and adhesiveness.

Curable silicone composition and electronic components

A curable silicone composition comprising at least the following components: (A) an epoxy-containing organopolysiloxane; (B) a curing agent for an epoxy resin; (C) a thermally conductive metal powder; and (D) a thermally conductive nonmetal powder; exhibits low viscosity, excellent handleability and curability and, when cured, forms a cured body of flexibility, low specific gravity, and excellent thermal conductivity. An electronic component sealed or adhesively bonded with use of a cured body obtained by curing the aforementioned composition provides high reliability.

Curable silicone composition and electronic component

A composition includes: (I) an alkenyl functional, phenyl-containing polyorganosiloxane, an Si&#x2014;H functional phenyl-containing polyorganosiloxane, or a combination thereof; (II) a hydrogendiorganosiloxy terminated oligodiphenylsiloxane having specific molecular weight, an alkenyl-functional, diorganosiloxy-terminated oligodiphenylsiloxane having specific molecular weight, or a combination thereof; and (III) a hydrosilylation catalyst. A light emitting device is made by applying the composition onto a light source followed by curing. The composition provides a cured material with mechanical properties suited for use as an encapsulant for a light emitting device.

Light emitting device encapsulated with silicones and curable silicone compositions for preparing the silicones

A curable organopolysiloxane composition comprising at least the following components: (A) a linear diorganopolysiloxane with a mass average molecular weight of at least 3,000, (B) a branched organopolysiloxane, (C) an organopolysiloxane having, on average, at least two silicon-bonded aryl groups and, on average, at least two silicon-bonded hydrogen atoms in one molecule, and (D) a hydrosilylation reaction catalyst; has excellent curability and, when cured, forms a flexible cured product of high refractive index, optical transmissivity, excellent adherence to various substrates, high hardness and slight surface tack.

Curable organopolysiloxane composition and semiconductor device

A method of manufacturing a layered silicone composite material comprising the steps of: applying a second addition-curable organopolysiloxane composition that contains a second adhesion promoter onto a first silicone layer that is formed by curing a first addition-curable organopolysiloxane composition containing a first adhesion promoter and where the first silicone layer has a hardness of less than JIS A 50; and forming a second silicone layer that has hardness of JIS A 50 or more by curing said second addition-curable organopolysiloxane composition.

Method of manufacturing a layered silicone composite material

A curable silicone composition comprising at least the following components: (A) an organopolysiloxane that contains epoxy groups and, preferably, has a branched molecular structure; (B) a phenolic-type curing agent such as an organosiloxane having in one molecule at least two phenolic hydroxyl groups; and (C) an acidic-anhydride type curing agent such as a methylhexahydrophthalic anhydride, as well as an arbitrary components such as (D) a curing accelerator, (E) a filler, or (F) an organic epoxy compound; is characterized by excellent handleability and reduced oil-bleeding during curing, and, when cured, forms a cured body of excellent flexibility and adhesion.

Curable silicone composition

A curable organopolysiloxane composition comprising an organopolysiloxane containing alkenyl groups and phenyl groups, an organohydrogenpolysiloxane, a copolymer of a vinyl monomer and a vinyl monomer with hydrosilyl groups, and a platinum catalyst; a curing process that consists of two or more stages of thermal curing; an optical semiconductor device that has a light-transmitting portion made from a cured body of the aforementioned composition; and an adhesion promoter that consists of a copolymer of a vinyl monomer and a vinyl monomer with hydrosilyl groups.

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Ichihara, Japan

Tomoko Kato