Mitsubishi Chemical Corporation

Mitsubishi Rayon Company, Limited

Tomoko Ishimoto

Manabu Kaneko

Kenichi Watanabe

Yasuhiro Fukuhara

Sanae Kita

Tetsuya Atsumi

Provided are an epoxy resin composition which contains an epoxy resin and a curing agent, and satisfies the following (1), (2), and (3):

Epoxy resin composition, and film, prepreg, and fiber-reinforced plastic using same

An epoxy-resin composition of the components (A), (B), (D) and (E), where component (A) is an epoxy resin having an oxazolidone-ring structure, (B) is a bisphenol bifunctional epoxy resin with a number-average molecular weight of at least 600 but no more than 1300, which does not have an oxazolidone-ring structure, (D) is a triblock copolymer, and (E) is a curing agent. A film made of the epoxy-resin composition, a prepreg and a fiber-reinforced plastic is also disclosed. The epoxy resin composition is capable of achieving both a processability of a prepreg at room temperature and a suppression of voids in the molded product. A fiber-reinforced plastic having excellent mechanical properties, especially excellent fracture toughness and heat tolerance, is also obtained by using the epoxy-resin composition.

Epoxy-resin composition and film, prepreg, and fiber-reinforced plastic using same

The present invention relates to an epoxy-resin composition comprising the following components (A), (B), (C) and (D), a film made of the epoxy resin composition, a prepreg and a fiber-reinforced plastic. The present invention can provide an epoxy-resin composition that cures at a low temperature in a short period of time. Also, the present invention can provide a fiber-reinforced plastic having excellent mechanical characteristics, especially excellent fracture toughness and heat tolerance, is made from the epoxy-resin composition. 

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Toyohashi, Japan

Tomoko Ishimoto