Showa Denko Materials Co., Ltd.

Hitachi Chemical Company, Ltd.

Resonac Corporation

Tomoko Higashiuchi

Naoki Maruyama

Kazumasa Fukuda

Yoshitaka Takezawa

Yuka Yoshida

Hideyuki Katagi

Yuki Nakamura

Hiroshi Yokota

Nobuaki Takane

Maki Inada

Masashi Yamaura

Masaru Watanabe

Yasushi Gotoh

Shingo Tanaka

Michio Butsugan

Keiichiro Nishimura

Fumihiko Kawauchi

Ryoichi Nakanishi

Kazuyuki Kamo

Fusao Hojo

Lin Tian

(1) An epoxy resin, which is configured to form, in a cured product of the epoxy resin, a phase-separated structure that is formed from at least two phases, wherein at least one phase of the at least two phases includes a liquid crystal structure and (2) An epoxy resin, which is configured to form a phase-separated structure in a cured product, the cured product being obtained by curing the epoxy resin by increasing a temperature of the epoxy resin from an ambient temperature to a curing temperature at a rate of not greater than 20° C./minute.

Epoxy resin, epoxy resin composition, epoxy resin cured product and method of producing epoxy resin cured product, composite material, insulating member, electronic appliance, structural material, and vehicle

An epoxy resin includes an epoxy compound having a mesogenic structure, a cured product of the epoxy resin having a flexural modulus of 3.0 GPa or more at 23° C., a fracture toughness of 1.0 MPa·mor more, and a glass transition temperature of 150° C. or higher.

Epoxy resin, epoxy resin composition, epoxy resin cured product and composite material

An epoxy resin, comprising an epoxy compound having two or more mesogenic structures, and having a loss tangent of 1 or more at 35° C. before curing.

Epoxy resin, epoxy resin composition, epoxy resin cured product, and composite material

A cured epoxy resin, which is a cured product of an epoxy compound having a mesogenic structure and a curing agent having a molecular chain or a flexible backbone with a molecular weight of 100 or more, the cured epoxy resin having a smectic structure; a cured epoxy resin, which is a cured product of an epoxy compound having a mesogenic structure and a curing agent having a molecular chain or a flexible backbone with a molecular weight of 100 or more, the cured epoxy resin not having a smectic structure; an epoxy resin composition, comprising an epoxy compound having a mesogenic structure and a curing agent having a molecular chain with a molecular weight of 100 or more; and an epoxy resin composition, comprising an epoxy compound having a mesogenic structure and a curing agent having a flexible backbone with a molecular weight of 100 or more.

Cured epoxy resin material, epoxy resin composition, molded article, and composite material

An epoxy resin includes a reaction product between an epoxy compound and a compound having a naphthalene structure and a functional group that is reactive with an epoxy group.

An epoxy resin, comprising an epoxy compound A that has at least two mesogenic structures and at least one phenylene group, and an epoxy compound B that has at least two mesogenic structures and at least one divalent biphenyl group.

Provided is an epoxy polymer which has a mesogen skeleton and a structural unit represented by Formula (A). In Formula (A), each Rindependently represents an alkyl group having from 1 to 8 carbon atoms, and n represents an integer of 0 to 3. 

Epoxy polymer, epoxy resin, epoxy resin composition, resin sheet, b-stage sheet, cured product, c-stage sheet, metal foil with resin, metal substrate and method for manufacturing

An epoxy resin, comprising an epoxy compound having a mesogenic structure, the epoxy compound comprising a first epoxy compound having one biphenyl structure in a molecule and a second epoxy compound that is different from the first epoxy compound, at a mass ratio of the first epoxy compound to the second epoxy compound (first epoxy compound:second epoxy compound) of from 10:100 to 50:100.

An epoxy resin, comprising an epoxy compound having at least two mesogenic structures and at least one divalent biphenyl group.

An epoxy resin, comprising an epoxy compound having a mesogenic structure, and having a value of &#x3b7;'2/&#x3b7;&#x2032;1 equal to 3 or less, wherein &#x3b7;&#x2032;1 is an initial dynamic shear viscosity (Pa&#xb7;s) and &#x3b7;&#x2032;2 is a maximum value of dynamic shear viscosity (Pa&#xb7;s), in a measurement of dynamic shear viscosity.

An epoxy resin, comprising an epoxy compound, the epoxy compound comprising two or more structures represented by the following Formula (I) and at least one divalent biphenyl group: 

An epoxy resin, comprising a first epoxy compound having a mesogenic structure and a second epoxy compound having two or more mesogenic structures that are the same as the mesogenic structure of the first epoxy compound,

The present invention provides a separation material that comprises porous polymer particles comprising a styrene-based monomer as a monomer unit; and a coating layer comprising a macromolecule having hydroxyl groups, which covers at least a portion of the surface of the porous polymer particles, and the separation material has a 5% compressive deformation modulus of 100 to 1,000 MPa, and has a mode diameter in the pore size distribution of 0.1 to 0.5 &#x3bc;m.

Separation material

An epoxy resin, comprising an epoxy compound having a mesogen structure,

The present invention provides a separation material comprising porous polymer particles that comprise a styrene-based monomer as a monomer unit; and a coating layer that comprises a macromolecule having hydroxyl groups and covers at least a portion of the surface of the porous polymer particles, wherein the rupture strength is 10 mN or higher.

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Tokyo, Japan

Tomoko Higashiuchi