Panasonic Corporation

Matsushita Electric Industrial Co., Ltd.

Tomoko Fukunaka

Kenji Takahashi

Masashi Ishiguro

Masahiro Sato

Kazuhiko Yamashita

Mamoru Watanabe

Ryoji Inutsuka

Toshikazu Yoneda

Michio Sakurai

Shinsuke Kurahashi

Shinsuke Shimabayashi

Manabu Nishihara

A method and device capable of properly selecting light radiating conditions in soldering work where components are soldered onto a board with light radiation applied to a solder joint. The device for selecting the light radiation conditions may contain a) an input device for entering information on; b) a storage for storing at least any one of databases on light radiation power and light radiation time for soldering; c) a calculator for determining light radiating conditions according to the information entered through the input device and the database stored in the storage; and d) an output device for outputting the light radiating conditions determined by the calculator. The input device may further comprise i) a component; ii) a board on which the component is soldered; and iii) solder for soldering the component.

Light radiating conditions selecting method, light radiating conditions selecting device, and soldering device

An optical processing apparatus that is capable of detecting accurately the sticking status of deposits sticking to optical means in a background of same color as deposits, preventing occurrence of defective soldering due to feeding failure of wire solder, and detecting solder failure when the leading end portion of the wire solder does not reach up to the processing area. This optical processing apparatus comprises light energy output means for producing light energy, a first optical path for guiding the light energy into a work, optical means disposed in the first optical path for shaping the light energy, a second optical path sharing part of the first optical path for guiding the light from the work to photo receiving means, and driving means for changing the relative positions of at least the optical means and the work.

Optical processing apparatus

An optical processing apparatus includes an emitter for emitting light, a first light path for directing the light to a position to be processed on a workpiece, and a processing head. The processing head includes an optical system provided in the first light path, for shaping the light, a second light path having a portion shared with the first light path, the second light path directing light reflected from the workpiece, and an optical receiver for receiving the reflected light from the second light path. The optical processing apparatus further includes an actuator for changing a positional relationship between the optical system and the workpiece, a feeder for supplying a solder to the workpiece, a first shifter for moving the processing head in a first direction in parallel to an optical axis of the light emitted from the emitter, a second shifter for positioning the feeder in the first direction away from the processing head when the processing head is moved away from the workpiece by the first shifter, and a third shifter for moving the feeder against the processing head in a second direction perpendicular to the first direction while the processing head is moved by the first shifter. The optical processing apparatus allows the spot of the incident light and the position of soldering to be readily set depending on the configuration of a workpiece and can thus solder the workpiece at higher quality under soldering conditions optimized for the workpiece.

Provided is a light processing apparatus which can judge goodness or badness of small amount and various kind processing, and is useful for small amount and various kind processing, and can realize light processing at an appropriate position in conformity with a state of a substrate, at low cost, and can prevent production of a bad item before it happens, and enables local heating by focusing light energy, and is useful for a processing apparatus such as solder joint or heat processing of resin and a production equipment which used this. A state of an object to be processed enters into an image receiving unit, through a first light path and a second light path. This image and an image which was set up in a storage device in advance are compared, and goodness or badness judgment is carried out. There occurs a change of a point to be irradiated, in an approximately horizontal direction to the first light path, between a case that the object to be processed is in a warp age state, and a case that it is not so. The change is read as a change of an image shooting position of reflected light by the image receiving unit. It is possible to realize error stop of processing, by a level of a change amount, and to prevent processing bad item production before it happens.

Light processing apparatus

The invention presents a optical processing apparatus capable of detecting accurately the sticking status of deposits sticking to optical means in a background of same color as deposits, preventing occurrence of defective soldering due to feeding failure of wire solder, and detecting solder failure when the leading end portion of the wire solder does not reach up to the processing area. This optical processing apparatus comprises light energy output means for producing light energy, a first optical path for guiding the light energy into a work, optical means disposed in the first optical path for shaping the light energy, a second optical path sharing part of the first optical path for guiding the light from the work to photo receiving means, and driving means for changing the relative positions of at least the optical means and the work.

Growing community of inventors

Shiga, Japan

Tomoko Fukunaka