Fuji Xerox Co., Ltd.

Ricoh Company, Ltd.

Fanuc Corporation

Tomoki Umezawa

Kenji Yamazaki

Koji Ikegami

Junichi Takami

Masaki Kataoka

Kazuyuki Oda

Takayuki Takeuchi

Koichi Saitoh

Ichiro Tomikawa

Toshinobu Hamazaki

Yoshihisa Ueda

Kohzo Hara

Norikuni Funatsu

Takafumi Horio

Kunihito Satou

Michiaki Murata

Hideaki Ozawa

Takeshi Minamiru

Yasunobu Shirata

Hirokazu Matsuzaki

Satoru Goto

Yohsuke Muramoto

Brian Ormond

Saori Nishizaki

Yu Teshima

Shuichi Ohsawa

Tatsumi Inomoto

Eitoku Sonoda

A determination apparatus includes circuitry to receive operation information corresponding to an action being performed by a machine to be diagnosed and a detection signal of a physical quantity that changes according to the action of the machine; take out, from the detection signal, an operation detection signal indicating that the machine is operating, based on the operation information; extract feature information of the operation detection signal; select, from the feature information, particular feature information to be compared with a plurality of reference feature information; and determine a machining section of the machine in the feature information, based on the plurality of reference feature information and the particular feature information.

Determination apparatus, determination system, determination method, and recording medium

A device includes: a first acquiring unit to acquire context information corresponding to running operation among pieces of context information; a second acquiring unit to acquire detection information output from a detecting unit detecting a physical quantity of a target device; an extracting unit to extract, from the detection information, feature information indicating a feature of the detection information in an interval including a specific operation interval of the target device; a selecting unit to select reference feature information used as reference based on the feature information, and sequentially select pieces of target feature information; a calculating unit to calculate a likelihood of a process interval based on a comparison between the reference feature information and each piece of target feature information; a determining unit to determine whether the target feature information corresponding to the likelihood is included in the process interval based on the likelihood; and an estimating unit to estimate the process interval based on a determination result.

Diagnosis device, diagnosis system, diagnosis method, and computer-readable medium

Provided is a semiconductor manufacturing device including an expanding unit that expands a holding member having an adhesive layer on which a substrate in a state of being diced into plural semiconductor chips is held, a detection unit that detects an adhesive state between one of the semiconductor chips and the holding member, in a state in which the holding member is expanded, and a pickup unit that picks up the semiconductor chip by changing an operation relevant to pickup of the semiconductor chip based on the detected adhesive state.

Semiconductor manufacturing device and method of manufacturing semiconductor chip

An optical module comprises: an optical element array comprising plural optical elements that emits or receives light; and an optical waveguide comprising a clad and plural cores respectively with optical path changing portions, the cores being disposed in the clad with an interval. The optical path changing portions are optically connected to the optical elements. The optical path changing portions are arranged in a first direction having an angle with respect to a formation direction of the cores, the first direction being corresponding to an arrangement direction of said plurality of optical elements.

Optical module

An arrangement device including: a photography section, which photographs a first mark and a second mark in a state in which a semiconductor integrated circuit to which the first mark is applied and a member to which the second mark is applied, which member is to be used in combination with the semiconductor integrated circuit, overlap; and a movement section, which relatively moves at least one of the semiconductor integrated circuit and the member with respect to the other thereof on the basis of positions of the first mark and the second mark which have been photographed by the photography section.

Semiconductor integrated circuit arrangement device and method

A multichannel optical communication module includes: a board, and a signal-converting element having optical-action points aligned with a first pitch to emit and receive signal light. The element performs conversion between an optical signal and an electric signal at each of the optical-action points. The module further includes an optical waveguide that includes optical waveguide cores each having a first and a second optical-signal ends that are opposed to each other. The first optical-signal ends are aligned with the first pitch and optically connected to the respective optical-action points, while the second optical-signal ends are aligned with a second pitch longer than the first pitch. The module further includes a coupling component fixed on the board and coupling, to the module, an optical connector that holds ends of optical fibers aligned with a pitch equal to the second pitch, thereby optically connecting the second optical-signal ends to the optical fibers.

Multichannel opticalcommunication module and method of producing multichannel opticalcommunication module

A manufacturing method of an optical member for optical path conversion to be connected to an optical waveguide provided in a substrate includes forming plural inclined surfaces on a wafer by etching, forming openings corresponding to the inclined surfaces in a plate-like member, forming a combined body, in which the inclined surfaces and the openings correspond to each other, by bonding the wafer and the plate-like member, and dividing the combined body into small pieces each of which includes the inclined surface and the opening.

Optical member, manufacturing method of the optical member, waveguide substrate, and photo-electric integrated substrate

An optical connector includes: a board having a first signal-light propagation medium with a first optical signal end; and a chassis disposed on the board. The chassis includes: an insertion-and-removal section having an insertion-hole forming wall that defines an insertion hole, into which a second optical signal end of a second signal-light propagation medium is removably inserted. The wall has: a support surface. supporting a side face portion of the second signal end; and an abutting surface on which abuts a front-end portion of the second signal end. The chassis further includes an optical connection section provided with a through-hole forming wall defining a through hole optically connecting the first signal end with the inserted second signal. The optical connector further includes a biasing member that positions the second signal end inserted into the insertion-and-removal section by biasing the second signal end to both the abutting and support surfaces.

Optical connector

An optical module mounting method for mounting an optical module including a plurality of light emitting points onto a substrate including an optical waveguide is provided. The method includes mounting the optical module on the substrate such that a surface of the optical module including the plurality of light emitting points faces one end of the optical waveguide; measuring optical coupling efficiency between each of the light emitting points and the optical waveguide; and selecting a light emitting point to be used based on the optical coupling efficiency measurements.

Optical module, mounting method of the same and optical system having optical module mounted on substrate

The present invention provides an inkjet recording head cartridge and an inkjet recording apparatus that have a simple structure and high reliability. Since individual flow passages in which ink emission orifices are formed are communicated directly with a rectangular ink supply chamber, it is prevented that a bubble of such a size as to cause printing defects rises through an ink supply chamber and blocks the individual flow passages. Also, since ink heated within the ink supply chamber is moved upward to the ink tank chamber by convection and grows an air lump sealed beforehand, it is prevented that a bubble will grow in the ink supply chamber. Furthermore, by allocating a large cross-sectional area to the ink supply chamber, it is prevented that meniscus oscillation of the ink emission orifices is amplified by pressure oscillation caused by ink emission and causes a printing defect. Therefore, reliable printing can be performed with a simple construction.

Inkjet recording head cartridge and inkjet recording apparatus

The present invention provides an ink jet recording head and an ink jet recording device respectively simply and precisely formed, the ink jet recording head and the ink jet recording device are characterized as follows. For the ink jet recording head, an elastic member is inserted between a head chip and an ink supply member and is pressed upon them by a bolt. As a result, a convex portion of the ink supply member comes into contact with a holding member to which the head chip is fastened and the distance between the head chip and the ink supply member is fixed. Therefore, the compressed amount of the elastic member is fixed, the sealing performance of a connection of an ink supply port of the head chip and a supply passage of the ink supply member is secured and it becomes possible to prevent excessive force from acting upon the head chip and damaging the head chip. Therefore, the ink jet recording head can be provided by a precise and simple method.

Ink jet recording head and ink jet recording device

The present invention provides a liquid jet printing head, a method of manufacturing the same, and a liquid jet printing apparatus, which allow stable, high speed, and continuous printing. A liquid jet printing head provides an inflow of liquid from an inlet to a common chamber, then along with the surface of heating elements of a heating element substrate and with a wall of a housing to separate channels. Liquid drops will be ejected by heating the heating elements. Since liquid may flow linearly from the inlet to the separate channels in accordance with the present invention, smooth flow promotes evacuation of bubbles through a nozzle, while cooling the heating element substrate with liquid flowing along with the substrate. The present invention provides thereby stable printing with high speed, continuous ejection (printing) of liquid drops.

Growing community of inventors

Kanagawa, Japan

Tomoki Umezawa