Seiko Epson Corporation

Tomoki Sakashita

Teruyuki Nishimura

Koji Kitahara

Hiroshi Komatsu

Daisuke Saito

An interference filter includes a transmissive first substrate including a first inner surface and a first outer surface facing each other, in which the first inner surface is provided with a first reflection film, a transmissive second substrate including a second inner surface and a second outer surface facing each other, in which the second inner surface is provided with a second reflection film, a first bonding portion configured to bond the first inner surface and the second inner surface to each other, and seal a first inner space between the first substrate and the second substrate, a transmissive third substrate facing the first outer surface, a second bonding portion configured to bond the first outer surface and the third substrate to each other, and seal a second inner space between the first substrate and the third substrate, a transmissive fourth substrate facing the second outer surface, and a third bonding portion configured to bond the second outer surface and the fourth substrate to each other, and seal a third inner space between the second substrate and the fourth substrate, wherein the first inner space, the second inner space, and the third inner space are lower in pressure than atmospheric pressure.

Interference filter, and method of manufacturing interference filter

A wavelength variable interference filter includes a fixed substrate, a movable substrate that faces the fixed substrate, a pair of reflective films, a fixed extraction electrode provided on the fixed substrate, and a movable connection electrode that is provided on the movable substrate and is in contact with the fixed extraction electrode at a connection position, in which the movable substrate includes a first groove that is provided at the connection position in a plan view in which the fixed substrate and the movable substrate are viewed from a substrate thickness direction, and a second groove that has a larger area than an area of the first groove in the plan view and is connected to the first groove.

Interference filter and MEMS element having connected first and second grooves in a moveable substrate having non-uniform thickness

A light filter includes a first substrate, a second substrate, a first bonding film provided in an entire region at the second substrate side of the first substrate, a second bonding film provided in an entire region at the first substrate side of the second substrate, a first optical film provided on the first bonding film of the first substrate, a second optical film provided on the second bonding film of the second substrate, a first electrode provided on the first bonding film of the first substrate, and a second electrode provided on the second bonding film of the second substrate, and the first substrate and the second substrate are fixed by bonding of the first bonding film and the second bonding film, and the first optical film, the second optical film, the first electrode, and the second electrode are formed of the same material.

Light filter, manufacturing method of light filter, and optical device

An optical filter comprising a first substrate, a second substrate having a support portion which supports the first substrate, a first optical film provided on the first substrate, a second optical film provided on the second substrate and arranged to face the first optical film, a first protective film covering at least the first optical film, a second protective film covering at least the second optical film, a first bonding film, a portion of the first bonding film overlapping a surface of the first protective film in a plan view but does not overlapping the first optical film and a second bonding film, a portion of the second bonding film overlapping a surface of the second protective film in the plan view but does not overlapping the second optical film.

Optical filter and method for manufacturing optical filter

A method for manufacturing a nozzle substrate includes forming a first hollow recess in a first surface of a silicon substrate, forming a liquid-resistant protective film on the first surface of the silicon substrate including an inner wall of the first hollow recess, forming a second hollow recess in a first surface of a glass substrate, bonding the first surfaces of the silicon substrate and the glass substrate by anodic bonding, reducing a thickness of the glass substrate from a second surface until an aperture is formed in a bottom surface of the second hollow recess to form a second nozzle hole disposed on a droplet feed side, and reducing a thickness of the silicon substrate from a second surface until an aperture is formed in a bottom surface of the first hollow recess to form a first nozzle hole disposed on a droplet discharge side.

Method for manufacturing nozzle substrate, and method for manufacturing droplet discharge head

A droplet discharging head comprises: a cavity substrate including a discharge chamber having a bottom wall serving as a vibration plate; and an electrode substrate including an individual electrode that faces the vibration plate with a gap and drives the vibration plate, and a driver integrated circuit (IC) that couples with the individual electrode and applies a voltage to the individual electrode. The cavity substrate includes a first opening that penetrates the cavity substrate and serves to house the driver IC, and an insulation film formed on a wall face of the first opening.

Growing community of inventors

Chino, Japan

Tomoki Sakashita