Murata Manufacturing Co., Ltd.

Tomoki Kato

Yasutaka Sugimoto

Yoichi Moriya

Takahiro Hayakawa

Sadaaki Sakamoto

Saneaki Ariumi

Hisao Hayafuji

Tomoshige Furuhi

An antenna module () includes a dielectric substrate () having a multilayer structure, a first radiation electrode (), a second radiation electrode (), and a ground electrode (GND). The second radiation electrode () is arranged between the first radiation electrode () and the ground electrode (GND) in a lamination direction of the dielectric substrate (). In the dielectric substrate (), a hollow portion () is disposed in at least a portion between the first radiation electrode () and the second radiation electrode ().

Antenna module, communication device, and array antenna

A circuit board having an insulating layer containing a low-temperature sintering ceramic material and wiring. The wiring includes a thermal via having an area of 0.0025 mmor more in top view thereof, the thermal via is a stack of layers of tapered conductors, each having tapered end faces, and each end face of the tapered conductors are in direct contact with the insulating layer.

Circuit board and method for producing circuit board

A power module includes a power wiring line provided with a power element, a glass ceramic multilayer substrate provided with a control element to control the power element, and a highly heat-conductive ceramic substrate made of a ceramic material having higher thermal conductivity than a glass ceramic contained in the glass ceramic multilayer substrate. The power wiring line is disposed on the highly heat-conductive ceramic substrate, and the glass ceramic multilayer substrate is disposed directly on the highly heat-conductive ceramic substrate.

Power module and method for manufacturing power module

A composite ceramic multilayer substrate includes a glass ceramic insulating layer including a wiring layer and a highly thermally conductive ceramic insulating layer made of a ceramic material having a higher thermal conductivity than the glass ceramic insulating layer. The glass ceramic insulating layer is provided on at least one main surface of the highly thermally conductive ceramic insulating layer directly and/or with a wiring layer interposed therebetween. When viewed in a direction perpendicular or substantially perpendicular to a main surface of the composite ceramic multilayer substrate, the composite ceramic multilayer substrate includes at least one heat generating element-mounting portion surrounded by the glass ceramic insulating layer and at which a heat generating element-mounting wiring line provide on the main surface of the highly thermally conductive ceramic insulating layer is exposed.

Composite ceramic multilayer substrate, heat generating element-mounting module, and method of producing composite ceramic multilayer substrate

A multilayer ceramic substrate that includes a laminate having stacked ceramic layers formed of a ceramic material containing a main component, containing 48 to 75% by weight of Si, 20 to 40% by weight of Ba, and 10 to 40% by weight of Al, and an auxiliary component containing at least 2.5 to 20 parts by weight of Mn with respect to 100 parts by weight of the main component, and in the laminate, glass ceramic layers in which the entire or a portion of the thickness thereof exists within 100 &#x3bc;m inside of the laminate as measured from opposed principal surfaces are further stacked.

Growing community of inventors

Nagaokakyo, Japan

Tomoki Kato