Murata Manufacturing Co., Ltd.

Shizuki Electric Company, Inc.

Tomoki Inakura

Tomomichi Ichikawa

Shinichi Kobayashi

Norihiro Yoshikawa

Yasunori Hioki

Ichiro Nakaso

Kazuto Yamazaki

Ichiro Nakamura

Satoru Jogan

Kimiaki Kikuchi

Satoshi Kamei

Kyosuke Yoshida

Shiyunsuke Akiba

Atsushi Kawabata

Akira Okumura

A film capacitor that includes: a wound body in which a dielectric film and a metal layer are wound, the dielectric film including a cured product of a first organic material having a hydroxy group and a second organic material that is an aromatic compound having an isocyanate group, the dielectric film including a first main surface and a second main surface opposed to each other in a thickness direction, the metal layer being disposed at least on the first main surface of the dielectric film. The first main surface of the dielectric film includes a plurality of protrusions having the second organic material. In an area range of 100 μm by 140 μm of the first main surface of the dielectric film, a skewness of the first main surface of the dielectric film is 0.782 to 14.3.

Film capacitor, film, and metallized film

A film capacitor that includes a capacitor element having a laminate where a first metal layer is connected to a first external electrode, a second metal layer is connected to a second external electrode, a first dielectric film protrudes toward the first external electrode with respect to a second dielectric film, and a second dielectric film protrudes toward the second external electrode with respect to the first dielectric film. At an outer peripheral portion of the laminate in a thickness direction, a first protruding width of the first dielectric film increases toward an outermost periphery of the laminate in the thickness direction, and a second protruding width of the second dielectric film increases toward the outermost periphery of the laminate in the thickness direction.

Film capacitor

A film capacitor that includes a wound body having a dielectric film and a metal layer. When a film face positioned at an average height in the thickness direction is defined in an area range of 100 μm by 140 μm of the first main surface of the dielectric film, an area ratio of a region having a height higher than the film face by 0.05 μm or more and less than 0.20 μm is 6.04% or less, an area ratio of a region having a height higher than the film face by 0.20 μm or more and less than 2.50 μm is 0.0998% to 1.13%, and an area ratio of a region having a height higher than the film face by 2.50 μm or more is 0.100% or less.

A film capacitor that includes a dielectric resin film having a first surface and a second surface facing each other in a thickness direction of the dielectric resin film, wherein the first surface of the dielectric resin film includes 25 to 125 of first recesses each having a long diameter of 30 nm to 800 nm per an area of 5 μm×5 μm; and a metal layer on the first surface of the dielectric resin film.

Film capacitor and film for film capacitor

A film capacitor that includes a wound body having a dielectric film and a metal layer, the dielectric film including a cured product of a first organic material having a hydroxy group and a second organic material that is an aromatic compound having an isocyanate group, the metal layer being disposed at least on a first main surface of the dielectric film. The first main surface of the dielectric film includes a plurality of protrusions having the second organic material. In an area range of 100 μm by 140 μm of the first main surface of the dielectric film, the plurality of the protrusions have an average diameter of 0.58 μm to 5.98 μm and an average height of 0.11 μm to 2.54 μm, and a number of the plurality of the protrusions ranges from 50 to 450.

A film capacitor that includes a dielectric resin film containing a cured product of a first organic material and a second organic material; and a metal layer on at least one surface of the dielectric resin film. The first organic material contains an organic polymer having a hydroxy group and a benzene ring in a repeating unit; the second organic material contains 4,4′-diphenylmethane diisocyanate, a modified product of 4,4′-diphenylmethane diisocyanate, or a mixture thereof; and 400 ppm to 700 ppm of chlorine ions and 300 ppm to 500 ppm of phosphorus ions are present inside the dielectric resin film.

Film capacitor, and film for film capacitors

A film capacitor that includes a dielectric resin film having a glass transition temperature of 160° C. or higher and a density at 25° C. of 1.22 g/cmto 1.26 g/cm; and a metal layer on at least one surface of the dielectric resin film.

A film capacitor that includes a resin layer which has a first surface and a second surface and in which there are particles on at least one of the first surface and the second surface; and a metal layer on the first surface of the resin layer, wherein there are more particles in number on the at least one of the first surface and the second surface of the resin layer than inside the resin layer.

Film capacitor, film-capacitor film, and method for manufacturing film-capacitor film

A film capacitor that includes a metallized film having a metal layer on one surface of a dielectric resin film, in which, when a thermal expansion coefficient of the metallized film is &#x3b1;and a thermal expansion coefficient of the metal layer is &#x3b1;, a value of &#x3b1;/&#x3b1;is 5.1 or less.

Film capacitor and metallized film

A film capacitor that includes a laminate having a first resin film including a first metal layer on a surface thereof alternately laminated with a second resin film including a second metal layer on a surface thereof, the laminate having opposed first and second ends, a first external electrode on the first end of the laminate, and a second external electrode on the second end of the laminate, wherein the first resin film protrudes more than the second resin film by a first protruding length of 0.5 mm to 3 mm on the first end of the laminate, and the first resin film has a Young's modulus at 150&#xb0; C. of 0.6 GPa or more in a direction perpendicular to a lamination direction of the laminate and parallel to a direction from the first end to the second end of the laminate.

A film capacitor that includes a dielectric resin film and a metal layer on one surface of the dielectric resin film. The dielectric resin film has a crosslink density at 225&#xb0; C. of 2700 mol/mor more, or the dielectric resin film has a storage elastic modulus at 125&#xb0; C. of 1.1 GPa or more.

Film capacitor having a delectric resin with a specific crosslink density and film for film capacitor

A film capacitor that includes a dielectric resin film having a first surface and a second surface opposite to the first surface, the second surface having a silicone resin-containing layer; a first metal layer opposite to the first surface of the dielectric resin film; and a second metal layer opposed to the second surface of the dielectric resin film.

Film capacitor, method of producing film capacitor, dielectric resin film, and method of producing dielectric resin film

A film capacitor that includes a resin layer having a linear protrusion on a first surface thereof and a linear recess on a second surface thereof opposite the first surface, and a metal layer on the first surface of the resin layer. A total length of the linear recess per 1 cmis 3 m or less, and an average depth of the linear recess is 0.01 &#x3bc;m to 1.3 &#x3bc;m.

Film capacitor, film for film capacitor, method of producing film for film capacitor, and method of producing film capacitor

A dielectric resin composition for a film capacitor is a mixture containing an organic material A and an organic material B. The organic material A includes at least two kinds of organic material components A, A, . . . having reactive groups (for example, OH, NCO) that cross-link each other. The organic material B does not have a reactive site capable of reacting with the organic material A and has a dielectric loss tan &#x3b4; of 0.3% or less at a temperature of 125&#xb0; C. The mixture has a glass transition temperature of 130&#xb0; C. or higher and preferably 280&#xb0; C. or lower.

Dielectric resin composition for film capacitor and film capacitor

To increase the heat resistance of a film capacitor, a cured article obtained by curing a mixed solution of a polyvinyl acetal having a hydroxyl group content of 10% to 38% by weight, the number of backbone carbon atoms of the polyvinyl acetal being 100 or more, and a polyisocyanate having an isocyanate content of 1% to 50% by weight is used as a dielectric resin films material arranged between first and second counter electrodes facing each other. At least the polyvinyl acetal is subjected to high-pressure homogenization in which a shearing force is applied such that a pressure applied to the polyvinyl acetal is 50 MPa or more when the material is passed through a path having a diameter of 0.125 mm and a length of 5 mm, so that the solubility is increased to allow a curing reaction to proceed uniformly. The cured article has a glass transition temperature of 130&#xb0; C. or higher and a breakdown voltage of 350 V/&#x3bc;m or more.

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Nagaokakyo, Japan

Tomoki Inakura