Shin-etsu Chemical Co., Ltd.

Shin-etsu Chemical C O., Ltd.

Tomoki Akiba

Tadashi Araki

Takafumi Sakamoto

Takahiro Yamaguchi

Akira Uta

Kumiko Hayashi

Sawako Shoda

Provided is a room temperature moisture-curable silicone gel composition containing: (A) diorganopolysiloxane, both terminals of which are blocked by silanol groups; (B) hydrolysable organosilicon compound represented by Formula (2) and/or a partial hydrolysate thereof (where Ris a monovalent hydrocarbon group, Ris an alkyl group or a cycloalkyl group, and a is 2 or 3.); (C) a curing catalyst; and (D) a heat-resistant aid containing a homogeneous mixture of (D-a), (D-b), and (D-c) (where (D-a) is organopolysiloxane having a viscosity of 10-10,000 mPa&#xb7;s at 25&#xb0; C., (D-b) is carboxylate of cerium, and (D-c) is a titanium compound and/or a partial hydrolytic condensate thereof). This room temperature moisture-curable silicone gel composition can be a silicone gel cured product which has a small variation rate of low-stress properties evaluated by the index such as penetration even under heat-resistant conditions exceeding 230&#xb0; C. and which has excellent heat-resistance.

Room temperature moisture-curable silicone gel composition, and cured product and article therefrom

Provided is a thermoplastic elastomer comprising a mesogen-silicon compound (co)polymer which is represented by formula (1) below and has a number average molecular weight of 1,000-500,000. The thermoplastic elastomer has transparency and rubber properties (rubber elasticity) and can be (repeatedly) molded thermally and reversibly, and thus can be suitably used in potting materials or various sealing materials. In formula (1), Ar represents a mesogenic group selected from among structures represented by formula (2) below, a represents an integer of 0.5-1, b represents a number of 0-0.5 (a and b respectively represent the ratio of the number of respective repeating units to the sum of all the repeating units in the molecule, and a+b=1), Ris a monovalent hydrocarbon group that does not contain a C1-8 aliphatic unsaturated bond, and Ris a hydrogen atom, &#x2014;Si(CH), &#x2014;Si(CH)(OH), &#x2014;Si(CH)(CH&#x2550;CH) or &#x2014;Si(CH)(CH&#x2014;CH&#x2550;CH). 

Mesogen-silicon compound (co)polymer and thermoplastic elastomer

Provided is a curable organopolysiloxane composition from which highly heat-resistant cured products can be obtained, the curable organopolysiloxane composition comprising: (A) 100 parts by mass of a novel organopolysiloxane represented by formula (1) (Ris an alkyl group or an alkoxy substituted alkyl group having 1 to 6 carbon atoms, Ris a group selected from an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, and a group in which a portion of the hydrogen atoms of those groups is substituted with a halogen atom, Ar is an arylene group having 6 carbon atoms or more, a is 1 to 1,000, b is 1 to 5,000, and n is 1 to 3, the total of n in an unsubstituted or substituted alkoxysilyl group on both ends of the molecular chain being 3 or more); and (B) 0.01 to 10 parts by mass of a curing catalyst. Also provided are electrical and electronic components, a vehicle oil seal, a building sealant, etc. which use the cured product of the composition.

Arylene group-containing organopolysiloxane and curable organopolysiloxane composition using same

Growing community of inventors

Annaka, Japan

Tomoki Akiba