Showa Denko K.k.

Tomokazu Umezawa

Masato Fukushima

Hiroshi Uchida

Hirofumi Inoue

Tetsuo Wada

Shunsuke Takeyama

Takanori Sakuragi

A laminated body which forms a resin mold by compression molding using a master mold, the laminated body having: a pair of mutually facing base materials, a layer of a liquid or gel-like curable resin material sandwiched between the pair of base materials, and one or more flow suppression bodies, which are composed of a cured product of the curable resin material and are sandwiched between the pair of base materials, wherein the layer of the curable resin material is sealed by the pair of base materials and the flow suppression bodies. Also, a method for manufacturing a resin mold using the laminated body.

Laminated body for manufacturing resin mold, laminated body, resin mold and method for manufacturing magnetic recording medium

The thermosetting resin composition according to the present invention includes a resin (A) containing two or more carboxyl groups and having a polyurethane structure, a strongly basic nitrogen-containing heterocyclic compound having pKa of 10.0 to 14.0 as a curing accelerator (B) and a curing agent (C). A cured product of the thermosetting resin composition is used as an insulating protective film for printed wiring boards, flexible printed wiring boards, chip-on-films, etc. The thermosetting resin composition of the invention has improved low-temperature curability and instantaneous curability, can realize tack-free property, can simultaneously realize low warpage property and electrical insulation property, does not contaminate a curing oven and the like by outgassing during heating, has a sufficient pot life, can form excellent cured products and insulating protective films, and can form solder resists and insulating protective films at low cost with good productivity.

Thermosetting resin composition

The thermosetting resin composition and the solder resist ink according to the present invention are characterized by comprising: a thermosetting resin (A) comprising (A1) a compound containing an acid anhydride group and/or a carboxyl group and (A2) a compound having a functional group which reacts with (A1) described above and an organic filler (B) containing a phosphorus atom, wherein the organic filler (B) containing a phosphorus atom has an average particle diameter of 50 &#xca;m or less. According to the present invention, capable of being provided at a low cost and a good productivity are an excellent thermosetting resin composition and solder resist ink capable of forming a cured material which achieves an adhesion to a substrate, a low warping property, a flexibility, a plating resistance, a solder heat resistance and a long term reliability as well as a flame retardancy, and a cured material and a protective film which are excellent in the above characteristics. Further, electronic parts having a protective film which is excellent in a flame retardancy and which has a high reliability can be provided.

Growing community of inventors

Chiba, Japan

Tomokazu Umezawa