Kaneka Corporation

Kobe University

Tomokazu Tozawa

Shuhei Ozaki

Takahisa Iwahara

Kazuhiko Hirabayashi

Katsuya Ouchi

Tadashi Kokubo

Hiroshi Okoshi

Takao Manabe

Kazuaki Kanai

Takashi Tachikawa

Hiroshi Ogoshi

Yasushi Kakehashi

Mitsuhiro Hori

Ryoichi Narita

Satoaki Iba

The present invention provides a photodecomposition module and a photodecomposition cell that have a new structure different from a known art and can decompose a decomposition liquid more effectively than those of the known art. The present invention includes a plurality of photodecomposition cells, and a posture holder that holds each of the photodecomposition cells in a predetermined posture, in which each of the photodecomposition cells decomposes a decomposition liquid with light irradiation, and includes an anode electrode part and a cathode electrode part in an accommodating part, the anode electrode part has a photocatalyst supported on a conductive substrate, the anode electrode part and the cathode electrode part are immersed in the decomposition liquid in the accommodating part, and the accommodating part has a cylindrical shape.

Photodecomposition module, photodecomposition cell, decomposition system, living environment sustaining system, and supply amount adjustment system

A molded resin body for surface-mounted light-emitting device has a cured resin body integrally molded with a plurality of leads and a concave portion to which the plurality of leads are exposed at the bottom portion, in which the ten-point average roughness (Rz) of the opening surface of the concave portion is 1 &#x3bc;m to 10 &#x3bc;m, the glass transition temperature of the cured resin body is 10&#xb0; C. or higher and the glass transition temperature is a value measured using a thermomechanical analyzer (TMA) under the conditions of a temperature range of &#x2212;50 to 250&#xb0; C., a temperature elevation rate of 5&#xb0; C./min, and a sample size length of 1 to 5 mm, and the optical reflectance at 460 nm of the opening surface of the concave portion is 80% or more and the optical reflectance retention rate on the opening surface after heating the molded resin body at 180&#xb0; C. for 72 hours is 90% or more.

Molded resin body for surface-mounted light-emitting device, manufacturing method thereof, and surface-mounted light-emitting device

The present invention aims to provide a curable resin composition which gives a cured product having a low linear expansion coefficient. The curable resin composition of the present invention contains, as essential components, (A) an organic compound having at least two carbon-carbon double bonds reactive with SiH groups per molecule, (B) a compound containing at least two SiH groups per molecule, (C) a hydrosilylation catalyst, (D) a silicone compound having at least one carbon-carbon double bond reactive with a SiH group per molecule, and (E) an inorganic filler.

Curable resin composition, curable resin composition tablet, molded body, semiconductor package, semiconductor component and light emitting diode

Growing community of inventors

Settsu, Japan

Tomokazu Tozawa