Nichia Corporation

Tomokazu Taji

Tadayuki Kitajima

A light emitting device includes: a base including a first wiring, a second wiring, and a third wiring; a first semiconductor laser element electrically connected to the first wiring and the second wiring, at an upper surface side of the base; and a second semiconductor laser element electrically connected to the second wiring and the third wiring, at the upper surface side of the base. The base includes a frame surrounding the first semiconductor laser element and the second semiconductor laser element in a top view. The light emitting device further includes a base cap fixed to the frame such that the first semiconductor laser element and the second semiconductor laser element are enclosed in a space defined by the base and the base cap. The first semiconductor laser element and the second semiconductor laser element are connected in series.

Light emitting device including base and base cap

A light emitting device includes a semiconductor laser element, a base member, and a cover. The base member includes a first alignment mark, a second alignment mark, a third alignment mark, and a fourth alignment mark. The base member has a disposition surface on which the semiconductor laser element is disposed. The cover is bonded to the base member to define a closed space in which the semiconductor laser element is arranged. The first alignment mark and the second alignment mark are arranged outside the closed space. The third alignment mark and the fourth alignment mark are arranged inside the closed space. A straight line connecting the first alignment mark and the second alignment mark is parallel to a straight line connecting the third alignment mark and the fourth alignment mark.

Light emitting device

A light emitting device includes: a base comprising a first wiring, a second wiring, and a third wiring; a first semiconductor laser element electrically connected to the first wiring and the second wiring, at an upper surface side of the base; a second semiconductor laser element electrically connected to the second wiring and the third wiring, at the upper surface side of the base; and a base cap fixed to the base such that the first semiconductor laser element and the second semiconductor laser element are enclosed in a space defined by the base and the base cap. The first semiconductor laser element and the second semiconductor laser element are connected in series. A portion of each of the first, second, and third wirings is exposed at the upper surface of the base at locations outside of the space defined by the base and the base cap.

A light emitting device includes one or more electrical components and a base member. The electrical components include a first semiconductor laser element, which has a light emission end surface. The base member has a first surface on which the first semiconductor laser element is disposed. The base member includes a plurality of metal films including a first metal film and a second metal film. The first metal film is electrically connected to at least one of the electrical components, and defines a first alignment mark for aligning the first semiconductor laser element. The second metal film is electrically connected to at least one of the electrical components, and defines a second alignment mark for aligning the first semiconductor laser element. A straight line connecting the first alignment mark and the second alignment mark extends parallel to the light emission end surface of the first semiconductor laser element.

A method of manufacturing a light emitting device, the method including: disposing a first semiconductor laser element on a disposition surface of a base member such that a light emission end surface of the first semiconductor laser element is parallel to a first line passing through a pair of alignment marks provided on the base member; and disposing a first light-reflective member on the disposition surface such that a reference line for the first light-reflective member, which serves as an alignment reference in disposing the first light-reflective member, is parallel to a second line that is oblique to the first line at a predetermined angle.

Method of manufacturing light emitting device, light emitting device, and base member

A method of manufacturing a light emitting device includes: providing a light emitting device in which a first and second semiconductor laser elements are connected in series; performing a first measurement that includes supplying current to the first semiconductor laser element to measure at least one property of the first semiconductor laser element, and supplying current to the second semiconductor laser element to measure at least one property of the second semiconductor laser element; supplying current to the first and second semiconductor laser elements for a length of time; performing a second measurement that includes supplying current to the first semiconductor laser element to measure the at least one property of the first semiconductor laser element, and supplying current to the second semiconductor laser element to measure the at least one property of the second semiconductor laser element, and evaluating the first and second semiconductor laser elements.

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Anan, Japan

Tomokazu Taji