Fujitsu Corporation

Fujitsu Limied

Tomokazu Sugiyama

Yoshiaki Yanagida

Koji Sudo

Kazuo Yokoi

Koji Suto

Motoichi Watanuki

Shunsuke Sone

Teruaki Nishioka

Michinao Nomura

Kentaro Suzuki

Mitsuo Takeuchi

Kazuhisa Gonda

Tsutomu Sooda

Disclosed herein is a method including the steps of cutting a wafer to prepare a row block having a plurality of head elements arranged in a matrix, bonding a plate member to one side surface of the row block, bonding a row tool to another side surface of the row block bonded to the plate member opposite to the one side surface, and cutting the row block to prepare a row bar bonded to the row tool and having a row of the head elements. A bonding apparatus for realizing the above bonding steps is also disclosed.

Manufacturing method and apparatus for magnetic head sliders

A pad of an embedding tool is received on a faceplate. The pad is supported on a support member. When the embedding tool is urged against the surface of the faceplate, the pad is allowed to change the attitude relative to the support member in response to undulation generated on the surface of the faceplate. The movement of the flat surface follows the undulation of the faceplate. When a relative movement is induced between the embedding tool and the surface of the faceplate, the surface of the faceplate thus reliably receives the uniform or constant contact of the flat surface. When grains are supplied between the flat surface of the pad and the surface of the faceplate, the grains are uniformly pushed into the surface of the faceplate. In this manner, the grains are uniformly and constantly embedded into the surface of the faceplate.

Embedding tool designed to embed grains into faceplate for lapping apparatus

The method of the present invention is capable of processing a work piece with higher accuracy and providing highly reliable magnetic heads. The method of processing the magnetic head comprises the steps of: providing adhesive wax on a surface of a supporting jig; pressing a work piece onto the surface of the supporting jig so as to adhere the work piece thereon; heating the work piece supported by the supporting jig until the wax is melted so as to release stress in the work piece; and processing the work piece.

Method of processing magnetic head

A lapping method includes a step of moving a substantially bar-shaped workpiece in a radial direction of a surface of a rotary lapping plate while simultaneously oscillating the workpiece pivotally about a central point in a longitudinal direction of the workpiece in a plane parallel to the surface of the rotary lapping plate.

Lapping method and lapping apparatus

A lapping machine comprises a lapping surface plate ( ) rotated by a rotating mechanism, a lapping jig ( ) having a plurality of projections to bottom surfaces of which a work ( ) to be lapped by a lapping surface on the lapping surface plate ( ) is fitted, amount-of-projection adjusting elements ( ) for adjusting the variation of the plurality of projections ( ) to the lapping surface plate ( ) individually, and a control circuit ( ) for outputting variation-of-projection control signals to the variation-of-projection adjusting elements ( ).

Lapping machine, lapping method, and method of manufacturing magnetic head

Disclosed herein is a method of polishing a workpiece having a plurality of resistance elements by operating a plurality of bend mechanisms to push/pull the workpiece with respect to a polishing surface. This method includes the steps of measuring a shape of the workpiece, calculating an operational amount of each bend mechanism according to the shape measured, pressing the workpiece on the polishing surface with the bend mechanisms according to the operational amount calculated, and updating the operational amount according to a working amount of the workpiece. According to this method, magnetic heads included in the workpiece can be stably polished.

Method and apparatus for polishing, and lapping jig

Disclosed is a magnetic head manufacturing method for accurately measuring resistance value whereby magnetic heads are processed while measuring the resistance values of process monitoring element. After forming on a wafer magnetic head elements and monitoring element, in which resistance values change in analog fashion in line with processing, these elements are cut from the wafer. Next, the magnetic heads are processed to a prescribed height while measuring the resistance values of the monitoring element. In the forming process, the difference &Dgr;I between the positions of the magnetic head elements and monitoring element is measured in advance, and this difference &Dgr;I is used to convert the resistance values of the monitoring element to the height of the magnetic head elements. This makes it possible to correct errors in masks. Furthermore, patterns can be formed accurately by setting the position of the monitoring element to the same position as the magnetoresistive film of the magnetic heads.

Manufacturing method for magnetic heads

Disclosed are a lapping apparatus and a lapping method for compensating for warp in a work to be lapped, wherein the warp of the work is compensated for during the lapping process. A warp quantity of the work is detected during the lapping process and compensation is made. Hence, even warp caused during the lapping process can be compensated. It is also feasible to save the task of measuring the warp quantity of the work before lapping. An air pressure mechanism for applying pressure to the work in accordance with an air supply pressure is used as a warp straightening mechanism, whereby a minute warp quantity can be compensated for and controlled to zero. With the air pressure mechanism being adopted, it is possible to prevent excessive pressure from being applied to a lap jig.

Lapping apparatus and lapping method

Disclosed herein is a lapping machine for lapping a row bar having a plurality of head sliders. The lapping machine includes a lap plate for providing a lapping surface, a row tool having a work surface for pressing the row bar against the lapping surface, and a mechanism for operating the row tool so that a given pressure distribution is produced between the row bar and the lapping surface. The row tool has a plurality of holes arranged along the work surface. The mechanism includes a plurality of pivoted links each having a load point where a force having a direction perpendicular to the work surface is applied to the row tool in each of the holes. Each of the pivoted links further has a support point as the fulcrum and an effort point where a force having a direction substantially parallel to the work surface is received. The ratio of a distance between the load point and the support point to a distance between the effort point and the support point is substantially constant. With this configuration, the spacing between any adjacent ones of the holes of the row tool can be easily reduced to thereby improve a working accuracy.

Lapping machine, row tool, and lapping method

A filmed head slider, which is capable of writing data with high density, can be made by uniformly machining film layers formed on a wafer for making the filmed head sliders. The method of machining the wafer comprises the steps of: measuring curvature of the filmed surface of the wafer; selecting a machining plate having a machining face, whose curvature is in accord with that of the filmed surface of the wafer, on the basis of the result of the measuring step; and machining the filmed surface of the wafer with the selected ma chining plate.

Method of machining wafer for making filmed head sliders and device for machining the same

The present invention relates to an automatic lapping method for lapping a work piece and a lapping apparatus using the same. The lapping apparatus laps a work piece by moving the mounting base,relatively to a lapping plate,. On a coarse processing step, the lapping plate,is controlled with high speed as detecting a remaining amount for lapping the work piece. Then, on a fine processing step, said lapping plate,is controlled with low speed by detecting that the remaining amount h for lapping said work piece has reached to a predetermined amount H,. Thereby, it becomes possible to continuously execute the coarse processing and the fine processing in one lapping apparatus.

Automatic lapping method and a lapping apparatus using the same

The present invention relates to an automatic lapping method and a lapping apparatus for lapping a work piece, which is bonded to a row bar, including a thin-film element in order to control the lapping process by accurately measuring height of the work piece. The automatic lapping apparatus may include a lapping plate for lapping a thin-film, which is bonded to a row bar, including a monitoring element having at least an analog resistance value which is analogously varied according to lapping; and a controller for converting the analog resistance value to height of said thin-film element and controlling said lapping plate to stop the lapping process when the height of the thin-film element has reached to a targeted value, wherein said controller employs a previously measured resistance value as a currently measured resistance value when the currently measured resistance value is less than the previously measured resistance value.

Automatic lapping method of a thin film element and a lapping apparatus

A lapping apparatus for uniformly laps work pieces. The lapping apparatus includes a rotary lapping plate, a lapping base including a plurality of pads contacting the lapping plate, an adapter including first and second surfaces for supporting the mounting base contacting the lapping plate, and a supporting mechanism provided on the lapping base for supporting the second surface of the adapter by a supporting point. As the adapter supporting the work piece is supported on two points on the work piece and one supporting point of the lapping plate, the lapping surface of the work piece may follow as the lapping plate. Accordingly, it becomes possible to uniformly lap the work piece regardless of accuracy of the lapping base.

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Kawasaki, Japan

Tomokazu Sugiyama