Adeia Semiconductor Bonding Technologies Inc.

Showa Denko Materials Co., Ltd.

Tessera Interconnect Materials, Inc.

Resonac Corporation

Tomokazu Shimada

Norihito Masuda

Kimitaka Endo

Tomio Fukuda

Minoru Kakitani

Kazutoshi Danjoubara

Shunsuke Tonouchi

A thermosetting resin composition containing: (A) an addition reaction product of a maleimide compound having at least two N-substituted maleimide groups in one molecule (a1) and an amine compound having at least two primary amino groups in one molecule (a2), (B) a thermoplastic elastomer, and (C) a copolymer resin having a structural unit derived from an aromatic vinyl compound and a structural unit derived from a carboxylic acid anhydride.

Thermosetting resin composition, prepreg, laminated board, printed wiring board, and high speed communication-compatible module

A method of fabricating an interconnect element may include fabricating a metal layer that overlies a carrier layer and that includes a plurality of metal traces; providing a dielectric element to overlie the metal layer and the carrier layer; providing a plurality of metal posts; and removing the carrier layer to expose the first major surface of the dielectric element and the outer surfaces of the plurality of metal traces.

Structure and method of making interconnect element, and multilayer wiring board including the interconnect element

An interconnect element is provided which includes a dielectric element having a first major surface, a second major surface remote from the first major surface, and a plurality of recesses extending inwardly from the first major surface. A plurality of metal traces are embedded in the plurality of recesses, the metal traces having outer surfaces substantially co-planar with the first major surface and inner surfaces remote from the outer surfaces. A plurality of posts extend from the inner surfaces of the plurality of metal traces through the dielectric element, the plurality of posts having tops exposed at the second major surface. A multilayer wiring board including a plurality of such interconnect elements is also provided, as well as various methods for making such interconnect elements and multilayer wiring boards.

Growing community of inventors

Tokyo, Japan

Tomokazu Shimada