Japan Display Inc.

Tomokazu Saitou

Kouichi Inoue

Satoshi Namiki

In a display device that a terminal of a display panel is connected to bumps of the driver IC via an ACF, the driver IC includes input-side and output-side bump arrays arranged along mutually facing long sides. In configurations of the driver IC, a width A of a short side thereof &#x2267;1.45 mm, a thickness thereof B &#x2266;0.20 mm, a dimension C between input-side and output-side bumps &#x2267;1.10 mm, a length D of each bump &#x2267;98 &#x3bc;m, a minimum dimension F between the bumps &#x2266;15 &#x3bc;m, a number of arrays G of the output-side bump &#x2267;2 (two arrays) and a particle size E of a conductive particle contained in the anisotropic conductive film &#x2266;3.5 &#x3bc;m, not more than six configurations are included.

Display device

A liquid crystal display device in which a liquid crystal layer is sandwiched between a TFT substrate having pixel electrodes and opposed electrodes formed and an opposed substrate, an external conductive film of a transparent electrode is formed on an outer surface of the opposed substrate, and an upper polarizing plate is arranged on the external conductive film. A portion of the external conductive film that is not covered with the upper polarizing plate is electrically connected to a ground potential through a conductive thermocompression bonding tape. The conductive thermocompression bonding tape is configured so that w&#x3c;w&#x3c;wis satisfied, wherein wrepresents a width of the conductive thermocompression bonding tape, wrepresents the width of the conductive thermocompression bonding tape electrically connected to the external conductive film, and wrepresents the width of the conductive thermocompression bonding tape electrically connected to a predetermined portion where the ground potential is provided.

Liquid crystal display device

Provided is a display device making it possible to reduce or prevent occurrence of an inter-bump short circuit and a short circuit between a terminal and a bump even when the number of conductive particles in an ACF is large. The display device includes a display panel and a driver IC connected to the display panel via the ACF. The driver IC includes an input side bump and an output side bump and has a flow acceleration member on the upstream side of the output side bump relative to a flow direction of the ACF conductive particles when heating and pressurizing the ACF.

This disclosure aims to reduce workloads and material costs when a driving circuit and a flexible wiring board are fixed to a first substrate. A display device includes a display panel having the first substrate. The driving circuit is fixed to the first substrate in a portion other than a display portion with an anisotropic conductive film. The flexible wiring board is fixed to the first substrate at an end of the portion other than the display portion with an anisotropic conductive film. The anisotropic conductive film for fixing the driving circuit and the anisotropic film for fixing the flexible wiring board are the same. The anisotropic conductive film is also formed and hardened in a region other than a region having the driving circuit and the flexible wiring board fixed therein within the portion other than the display portion of the first substrate.

Liquid crystal display device and production method thereof

An object of the present invention is to reliably ground an external conductive film formed on an opposed substrate to secure a stable shield effect in an IPS-type liquid crystal display device. An external conductive film formed on an opposed substrate is connected to an earth pad formed on a TFT substrate through a conductive thermocompression bonding tape. The conductive thermocompression bonding tape is connected by a thermocompression bonding head to form a conductive area. The width of the conductive area on the opposed substrate is made larger than the width of the conductive area on the TFT substrate to prevent the conductive thermocompression bonding tape from peeling off from the opposed substrate. Accordingly, the external conductive film of the opposed substrate is reliably grounded.

Liquid crystal display device with relationship of a width of conductive thermocompression bonding tape to a width of a bonding thereof to an external conductive film and to an earth pad

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Tokyo, Japan

Tomokazu Saitou