Tdk Corporation

Nec Corporation

Tomokazu Ito

Makoto Yoshida

Takeshi Okumura

Tomonaga Nishikawa

Yoshihiro Maeda

Hitoshi Ohkubo

Manabu Ohta

Takashi Kudo

Nobuyuki Okuzawa

Makoto Morita

Hiroshi Kamiyama

Yuuya Kaname

Makoto Otomo

Atsushi Hitomi

Kensaku Asakura

Kyohei Tonoyama

Yasuhiro Hirobe

Toshio Tomonari

Takahiro Kawahara

Sho Nakagomi

Hideto Itoh

Akihiko Sugiyama

Yoshikazu Sato

Toshihiro Kuroshima

Hideharu Moro

Tadashi Watanabe

Yuji Terada

Kouji Kawamura

Takeshi Urano

Masao Asakawa

Yukari Hishimura

Takashi Nakagawa

Akira Sato

Masanori Suzuki

Hiroshi Takeuchi

Fumio Watanabe

Tsuneo Kuwahara

Toshiyuki Anbo

Takuya Takeuchi

Masamichi Tanaka

Manabu Yamatani

Hidenori Tsutsui

Tadashige Konno

Ikuya Kokubo

Yasunari Shida

Tatsuya Karakame

Mitsuhiko Endo

Hironao Suzuki

Disclosed herein is a coil component that includes: a coil part in which a plurality of conductor layers and a plurality of interlayer insulting layers are alternately laminated, the coil part having a mounting surface substantially parallel to the lamination direction and an upper surface substantially parallel to the lamination direction and positioned on an opposite side to the mounting surface; and a direction mark comprising a conductive material that covers a part of the conductor layers exposed on the upper surface.

Coil component and manufacturing methods thereof

Disclosed herein is a coil component that includes a first planar spiral conductor; a second planar spiral conductor laminated on the first planar spiral conductor and wound in an opposite direction to the first planar spiral conductor; a first external terminal electrically connected to an outer peripheral end of the first planar spiral conductor; a second external terminal electrically connected to an outer peripheral end of the second planar spiral conductor; and a third external terminal electrically connected in common to inner peripheral ends of the first and second planar spiral conductors.

Coil component and circuit board in which coil component are embedded

Disclosed herein is a coil component that includes first and second magnetic members; a coil layer arranged between the first and second magnetic members, the coil layer including a plurality of conductor layers and a plurality of non-magnetic insulating layers, the conductor layers and the non-magnetic insulating layers being alternately laminated, the conductor layers being connected to each other via through holes formed in the non-magnetic insulating layers to form a coil pattern; a first external terminal covering one end of the coil pattern exposed to at least one of side surfaces of the coil layer without covering the first and second magnetic members; and a second external terminal covering other end of the coil pattern exposed to at least one of the side surfaces of the coil layer without covering the first and second magnetic members.

Coil component, manufacturing method thereof, and circuit board on which coil component are mounted

In a planar coil element and a method for producing the same, a metal magnetic powder-containing resin containing an oblate or needle-like first metal magnetic powder contains a second metal magnetic powder having an average particle size (1 &#x3bc;m) smaller than that (32 &#x3bc;m) of the first metal magnetic powder, which significantly reduces the viscosity of the metal magnetic powder-containing resin. Therefore, the metal magnetic powder-containing resin is easy to handle when applied to enclose a coil unit, which makes it easy to produce the planar coil element.

Planar coil element and method for producing the same

A laminated composite electronic device has a circuit including a coil and a capacitor within a laminate having a plurality of conductor layers laminated with an insulating layer interposed between the respective ones of the conductor layers. The device includes a coil conductor arranged on a first conductor layer and forming part of the coil, and a pair of capacitor electrodes for forming the capacitor, one of which is arranged on a second conductor layer such that the one capacitor electrode laps over the coil conductor when viewed from a laminating direction of the laminate, wherein the coil conductor forms part of the coil, and simultaneously serves as the other of the pair of capacitor electrode for forming part of the capacitor.

Laminated composite electronic device including coil and capacitor

A coil componentis provided with coil conductorsandand a magnetic metal powder containing resin(and) covering the coil conductorsand. The magnetic metal powder containing resinincludes first metal powder having a first average grain diameter, second metal powder having a second average grain diameter that is smaller than the first average grain diameter, and third metal powder having a third average grain diameter that is smaller than the second average grain diameter. The first average grain diameter is 15 &#x3bc;m or more and 100 &#x3bc;m or less. The third average grain diameter is 2 &#x3bc;m or less. The first metal powder mainly contains Permalloy and the second and third metal powders mainly contain carbonyl iron.

Coil component and magnetic metal powder containing resin used therefor

A coil component includes a substrate, a planar spiral conductor formed on a top surface of the substrate, a lead conductor connected to an outer peripheral end of the planar spiral conductor, a dummy lead conductor formed on the top surface of the substrate between an outermost turn of the planar spiral conductor and an end of the substrate and free from an electrical connection with another conductor within the same plane, external electrodes and arranged in parallel with the top surface of the substrate, and a bump electrode formed on a surface of the lead conductor and connects the lead conductor with the external electrode. The external terminals have a larger area than the bump electrodes for securing a bonding strength.

Coil component

A coil component includes: an insulating resin layer provided between a first planar spiral conductor formed on a back surface of a first substrate and a second planer spiral conductor formed on a back surface of a second substrate; an upper core covering a third second planer spiral conductor formed on a front surface of the first substrate on which the insulating resin layer is formed; and a lower core covering a fourth planer spiral conductor formed on a front surface of the second substrate on which the insulating resin layer is formed. One of the upper and lower cores is formed of a metal-magnetic-powder-containing resin. The coil component includes connecting portions disposed respectively at center and outside portions of each of the first and second substrates so as to physically connect the upper and lower cores.

Coil component and method for producing same

A coil componentincludes a substrate, a planar spiral conductorformed on a top surfaceof the substrate, a lead conductorconnected to an outer peripheral end of the planar spiral conductor, a dummy lead conductorformed on the top surface of the substrateand between an outermost turn of the planar spiral conductorand an endXof the substrateand free from an electrical connection with another conductor within the same plane, external electrodesandarranged in parallel with the top surface of the substrate, and a bump electrodeformed on a surface of the lead conductorand connects the lead conductorwith the external electrode. The external terminalsandhave a larger area than the bump electrodesandfor securing a bonding strength.

In a planar coil element, the quantitative ratio of inclined particles to total particles of a first metal magnetic powder contained in a metal magnetic powder-containing resin provided in a through hole of a coil unit is higher than the quantitative ratio of inclined particles to total particles of the first metal magnetic powder contained in the metal magnetic powder-containing resin provided in other than the through hole, and many of particles of the first metal magnetic powder in the magnetic core are inclined particles whose major axes are inclined with respect to the thickness direction and the planar direction of a substrate. Therefore, the planar coil element has improved strength as compared to a planar coil element shown in FIG.A and has improved magnetic permeability as compared to a planar coil element shown in FIG.B.

Planar coil element

An electronic component is provided with a substrate, a thin-film element layer provided on the substrate, first and second bump electrodes, provided on a surface of the thin-film element layer, and an insulator layer provided between the first bump electrode and the second bump electrode. The thin-film element layer contains a first spiral conductor which is a plane coil pattern. The first bump electrode is connected to an internal peripheral end of the first spiral conductor. The second bump electrode is connected to an external peripheral end of the first spiral conductor. Both of the first and second bump electrodes, have a first exposure surface exposed to a principal surface of the insulator layer and a second exposure surface exposed to an end face of the insulator layer.

Electronic component

Disclosed herein is a coil component that includes an insulating layer formed on a substrate, a coil conductor provided between the substrate and the insulting layer, a first electrode connected to one end of the coil conductor, a second electrode connected to the other end of the coil conductor, and a magnetic layer formed on the insulting layer so as to cover a side surface of each of the first and second electrodes without covering a top surface of each of the first and second electrodes.

Coil component and method of manufacturing the same

A coil componentis provided with a substrate, a thin-film coil layerprovided on the substrate, first and second bump electrodesprovided on a surface of the thin-film coil layer, a first lead conductorprovided on the surface of the thin-film coil layertogether with the first and second bump electrodesand formed integrally with the first bump electrode, and an insulator layerprovided between the first bump electrodeand the second bump electrode. The thin-film coil layercontains a first spiral conductorwhich is a plane coil pattern. The first bump electrodeis connected to an internal peripheral end of the first spiral conductorvia the first lead conductor. The second bump electrodeis connected to an external peripheral end of the first spiral conductor

The present invention is provided with a composite electronic device comprising an inductor element and an ESD protection element formed between two magnetic substrates, wherein the inductor element includes insulation layers made of a resin, and spiral conductors formed on the insulation layers, the ESD protection element includes a base insulation layer, a pair of gap electrodes arranged via gap formed therebetween on the base insulation layer, and an ESD absorbing layer arranged at least between the gap electrodes, and a gap protection layer provided on at least one of the upper side and lower side of the gap, the ESD absorbing layer includes a composite material having an insulation inorganic material and a conductive inorganic material discontinuously dispersed in a matrix of the insulation inorganic material. The gap protection layer is made of resin including magnetic powder and carbon.

Composite electronic device

A coil component is provided with a magnetic substrate made of magnetic ceramic material, a thin-film coil layer containing a coil conductor formed on one principal surface of the magnetic substrate, a plurality of bump electrodes formed on the principal surface of the thin-film coil layer, and an insulating resin layer formed on the principal surface of the thin-film coil layer excluding formation positions of the bump electrodes. Each bump electrode has an exposure surface on a bottom surface and on two side surfaces of a layered product composed of the magnetic substrate, the thin-film coil layer and the insulating resin layer. A corner of the each bump electrode has a notch portion. The insulating resin layer includes a center resin portion provided in a center of the principal surface of the thin-film coil layer and a plurality of corner resin portions provided in the notch portion of each bump electrode.

Growing community of inventors

Tokyo, Japan

Tomokazu Ito