Yazaki Corporation

Tomokatsu Aizawa

Kenichi Hanazaki

Yoshitaka Sugiyama

Kenichi Hanasaki

The present invention is intended to provide an enhanced conductor module capable of reducing a joint area between conductors, and a method for preparing the same. The conductor module has a pair of flattened circuits each of which comprises a rectangular shaped conductors, a pair of sheeted coverings disposed on both sides of the conductor, and at least one hole having a diameter smaller than a width of the conductor, and formed in the coverings so as to expose one surface of the conductor to outside the flattened circuit. The conductor of one flattened circuit is joined to the conductor of the other flattened circuit via the hole by application of electromagnetic welding.

Conductor module and electromagnetic welding method

An electromagnetic welding method includes the steps of piling a metal plate and an electric wire on a coil which generates a magnetic field when a current is applied into the coil, with a core wire portion of a central part of the electric wire being exposed while core wire portions except the exposed core wire portion are coated with a coating member. The coil and the exposed core wire portion are arranged lined up along a diameter direction of the electric wire, and a current is applied into the coil to generate a magnetic field so as to generate an eddy current in both the metal plate and the exposed core wire portion, thereby welding the metal plate to the exposed core wire portion.

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Tokyo, Japan

Tomokatsu Aizawa