Mitsubishi Electric Corporation

Tomohito Taniuchi

Motoyoshi Koyanagi

Daisuke Ikeda

Tetsuya Kitagawa

Kazuhiro Sasano

Yuji Kobayashi

Masayuki Kubota

A plurality of electrodes () are provided on tip ends of a plurality of blocks () respectively. The plurality of lead terminals () are sandwiched by the plurality of blocks () and the plurality of wires () to correct positions of the plurality of lead terminals (). The plurality of electrodes () are brought into contact with the plurality of lead terminals () to inspect an electrical characteristic of the optical semiconductor device ().

Inspection device for optical semiconductor device configured to correct positions of the plurality of lead terminals

A semiconductor inspection jig includes: a jig body having a recessed part provided on a top surface of the jig body; a printed circuit board provided on the top surface of the jig body; a GND block provided in the recessed part and having first and second side faces opposite to each other; first and second blocks provided in the recessed part and sandwiching the GND block; a push-up part pushing up the GND block from a bottom surface of the recessed part; a first press part pressing the first block against the first side face of the GND block; and a second press part pressing the second block against the second side face of the GND block.

Semiconductor inspection jig

A semiconductor inspection jig includes: a base on which a semiconductor device is placed; and a substrate provided on the base and including a conductive pattern, wherein the conductive pattern intersects with a lead of the semiconductor device placed on the base from a direction other than a horizontal direction with respect to the lead, and is in contact with an intermediate part of the lead without being in contact with a leading end of the lead.

Growing community of inventors

Nagasaki, Japan

Tomohito Taniuchi