Mitsubishi Electric Corporation

Tomohisa Yamane

Hiroshi Kobayashi

Kozo Harada

Masaru Fuku

Kei Yamamoto

Shinnosuke Soda

Kazuhiro Tada

Noriyuki Besshi

Yo Tanaka

Yuya Muramatsu

Hisayuki Taki

The power module includes: a heat spreader having a plate shape and having heat conducting property; a semiconductor element at least thermally connected to a one-side surface of the heat spreader; a highly-heat-dissipating insulation adhesive sheet having a plate shape and having a one-side surface thermally connected to an other-side surface of the heat spreader; a metal plate having a one-side surface thermally connected to an other-side surface of the highly-heat-dissipating insulation adhesive sheet; and a sealing resin member sealing the semiconductor element, the heat spreader, the highly-heat-dissipating insulation adhesive sheet, and the metal plate in a state where an other-side surface of the metal plate is exposed, wherein the highly-heat-dissipating insulation adhesive sheet is a complex obtained by impregnating, with a resin, a porous ceramic sintered body in which ceramic particles have a gap and have been integrally sintered.

Power module including highly-heat-dissipating insulation adhesive sheet

Provided is a semiconductor device that prevents resin from leaking out from a resin insulating member at a periphery of the resin insulating member and thereby achieves an increase in reliability. The semiconductor device includes a module unit, a resin insulating member bonded to the module unit, a cooling unit coupled to the module unit with the resin insulating member interposed therebetween, and a flow blocking member disposed between the module unit and the cooling unit to surround the resin insulating member, the flow blocking member being more easily compressively deformable than the resin insulating member.

Power semiconductor device including a deformable flow blocking member between a module unit and a cooling unit

A reliable semiconductor module and a reliable power conversion device using the semiconductor module are obtained. A semiconductor module includes a heat dissipation member, a semiconductor device, and a thermally conductive insulating resin sheet. The thermally conductive insulating resin sheet connects the heat dissipation member and the semiconductor device. The semiconductor device includes a semiconductor element and a metal wiring member. The metal wiring member is electrically connected to the semiconductor element. The metal wiring member includes a terminal portion protruding outside the semiconductor device. In a surface portion of the semiconductor device, a concave portion is formed outward of a partial region to which the thermally conductive insulating resin sheet is connected. The concave portion is located in a region closer to the heat dissipation member than the terminal portion.

Semiconductor module and power conversion device

Growing community of inventors

Tokyo, Japan

Tomohisa Yamane