Azbil Corporation

Yamatake Corporation

Tomohisa Tokuda

Hirofumi Tojo

Masayuki Yoneda

Nozomi Kida

Yoshiyuki Ishikura

Yuuki Seto

Yuki Seto

Ayumi Tsushima

Tatsuo Tanaka

Rina Ogasawara

Shinsuke Matsunaga

Kouji Yuuki

Ayumi Tushima

Yoshiyuki Nakazaki

Kouichirou Hotta

The present disclosure enables measurement with satisfactory sensitivity in a low pressure range, and thus accurate measurement in a wider pressure range, by providing a pressure sensor that includes a diaphragm layer and a pressure receiving region formed in the diaphragm layer. In addition, the pressure sensor includes a first piezostrictive element, a second piezostrictive element, a third piezostrictive element, and a fourth piezostrictive element. In addition, the pressure sensor includes a first magnetostrictive element, a second magnetostrictive element, a third magnetostrictive element, and a fourth magnetostrictive element.

Pressure sensor

Measurement with satisfactory sensitivity in a low-pressure range, and accurate measurement in a wider pressure range, are realized by a pressure sensor that includes a diaphragm layer and a pressure receiving region formed on the diaphragm layer. The pressure sensor includes a first piezostrictive element, a second piezostrictive element, a third piezostrictive element, and a fourth piezostrictive element. In addition, the pressure sensor includes a first magnetostrictive element, a second magnetostrictive element, a third magnetostrictive element, and a fourth magnetostrictive element. A switching function unit outputs a pressure value calculated by a second calculation function unit until a pressure value calculated by a first calculation function unit exceeds a set threshold value, and outputs the pressure value calculated by the first calculation function unit when the pressure value calculated by the first calculation function unit exceeds the threshold value.

Pressure measurement device having piezostrictive and magnetostrictive measurement units

A sensor element includes a sensor chip and a diaphragm base joined to a surface of the sensor chip. The sensor chip includes a first diaphragm for measuring differential pressure between a first pressure and a second pressure and a second diaphragm for measuring absolute pressure or gage pressure of the second pressure. The diaphragm base includes a third diaphragm to directly receive a fluid that is a measurement target and has the first pressure, and a fourth diaphragm to directly receive a fluid that is a measurement target and having the second pressure. The sensor element has a liquid amount adjustment chamber to make an amount of a first pressure transmission medium filled in a first pressure introduction path and an amount of a second pressure transmission medium filled in a second pressure introduction path to be equal to each other.

Sensor device with multiple simultaneous pressure measurements

A sensor chip of a sensor element includes a diaphragm for measuring a differential pressure between a first pressure and a second pressure, a diaphragm for measuring an absolute pressure or a gauge pressure of the second pressure, a first pressure introduction path that transmits the first pressure to the diaphragm for measuring a differential pressure, and a second pressure introduction path that transmits the second pressure to the diaphragms. When the transmission of the first pressure or the second pressure to the diaphragms is indicated by an equivalent circuit, a path for transmitting the first pressure and a path for transmitting the second pressure are symmetrically formed.

Pressure sensor element for measuring differential pressure and a diaphragm base having a set of diaphragms displaced by receiving pressures where a set of pressure inlet passages respectively transmit different pressures to the set of diaphragms

A differential pressure gauge of the invention contains: a diaphragm layer disposed between first and second parts; and a wall between a first region on a pressure-receiving portion side and a second region on a first through-hole side within a second pressure chamber. The diaphragm layer covers the pressure-receiving portion over a first pressure chamber and has the first through-hole with one end disposed in the second pressure chamber away from the pressure-receiving portion. The wall is disposed with gaps formed from inner walls of the second pressure chamber. The first pressure chamber is formed through the first part, the second pressure chamber has an opening facing the diaphragm layer, the first part has a second through-hole continuing to the first through-hole, and a base has a third through-hole with one end disposed in the first pressure chamber and a fourth through-hole continuing to the second through-hole.

Differential pressure gauge with improved signal-to-noise ratio suppression

A curved recess in a stopper includes a groove-pattern region and a groove-free region. When a sensor diaphragm reaches a bottom of the curved recess in the stopper, a groove-free region is divided into a ring-shaped first region with which a sensor diaphragm is in close contact and a ring-shaped second region disposed between an inner wall surface of a ring-shaped wall and the ring-shaped first region. The first region serves as a sealing region and the second region serves as a confinement region so that a pressure transmitting medium that remains in a space adjacent to the inner wall surface of the ring-shaped wall is confined in the confinement region, and abnormal deformation of the sensor diaphragm is prevented.

Pressure sensor chip

A sensor chip () is joined to an inner wall surface () of a base body (-), with a lower surface () of a first retaining member (-) serving as a joint surface, in such a manner as to allow an enclosing chamber () (including a pressure receiving chamber (-) and a pressure guiding passage (-)) between a pressure receiving diaphragm () and the joint surface () of the sensor chip () to communicate with a pressure guiding hole (-) in the first retaining member (-). In this state, a narrow tube () made of stainless steel is passed through the pressure guiding passage (-) in the base body (-) and inserted and secured in the pressure guiding hole (-) in the first retaining member (-). This reduces the pressure receiving area of a pressure guiding passage that guides a pressure (P) of a measured fluid to a first surface (-) of a sensor diaphragm (-), suppresses force applied in the direction of separating the joint between the sensor chip () and the base body (-), and makes it possible to use a soft adhesive.

A pressure sensor chip includes a first layer including a pressure introduction channel opening on a first main surface and a second main surface; a second layer including a diaphragm covering one end of the channel, a first strain gauge, and a second strain gauge, the second layer being on the second main surface; and a third layer including a third main surface and a concaved portion disposed at the third main surface, the third main surface being on the second layer. The concaved portion faces the channel with the diaphragm interposed therebetween, and is on an inner side of the channel when viewed from a direction perpendicular to the first main surface. The first strain gauge is on an outer side of the concaved portion when viewed from the direction. The second strain gauge is on an inner side of the first strain gauge when viewed from the direction.

Pressure sensor chip and pressure transmitter having a strain gauge arrangement being disposed in a region of the diaphragm

A pressure sensor according to the present invention includes a diaphragm () including a first principal surface (A) and a second principal surface (B) that is opposite thereto, the first principal surface receiving a pressure of a fluid; a semiconductor chip () provided with resistors that constitute a strain gauge; and at least three support members () made of an insulating material, each support member being fixed to the second principal surface at one end thereof and to the semiconductor chip at the other end thereof and extending perpendicularly to the second principal surface so as to support the semiconductor chip. One of the support members () is provided at a center () of the diaphragm in plan view. At least two of the other support members () are provided at positions point-symmetrical about the center of the diaphragm in plan view in a region in which the diaphragm is deformed when a pressure greater than a pressure applied to the second principal surface is applied to the first principal surface.

A pressure sensor chip according to the present invention includes a non-bonding region that is provided in a stopper member and connected to a periphery of a pressure introduction hole. A plurality of protrusions are discretely formed on at least one of a first surface and a second surface that face each other in the non-bonding region. Passages between the protrusions serve as channels between the periphery of the pressure introduction hole and a peripheral edge of the non-bonding region. Accordingly, stress concentration does not occur at a diaphragm edge and the expected withstand pressure can be obtained.

A pressure sensor chip according to the present invention includes two static-pressure diaphragms () formed by dividing an annular diaphragm arranged so as to surround a differential-pressure diaphragm (). A reference pressure is applied to one surface of one static-pressure diaphragm (), and a measurement pressure (Pa) for one surface of the differential-pressure diaphragm () is transmitted to the other surface of the static-pressure diaphragm () along a branched path. A reference pressure is applied to one surface of the other static-pressure diaphragm (), and a measurement pressure (Pb) for the other surface of the differential-pressure diaphragm () is transmitted to the other surface of the static-pressure diaphragm () along a branched path. Accordingly, multiple differential-pressure measurement ranges can be provided.

A pressure sensor chip according to the present invention includes an annular diaphragm that surrounds a periphery of a low-differential-pressure diaphragm () as a high-differential-pressure diaphragm (). A measurement pressure (Pa) for one surface of the low-differential-pressure diaphragm () is transmitted to one surface of the high-differential-pressure diaphragm () along a branched path, and a measurement pressure (Pb) for the other surface of the low-differential-pressure diaphragm () is transmitted to the other surface of the high-differential-pressure diaphragm () along a branched path. Thus, multiple differential-pressure measurement ranges can be provided.

A pressure sensor chip is provided with first and second retaining members. The peripheral edge portions of the first and second retaining members are bonded to face one face and another face of a diaphragm, respectively. An inner edge of the peripheral edge portion of the first retaining member is positioned further to the outside than an inner edge of the peripheral edge portion of the second retaining member.

A pressure sensor chip includes a sensor diaphragm, and first and second retaining members. The first and second retaining members face and are bonded to peripheral edge portions of a first face and another face of the sensor diaphragm, and have pressure guiding holes that guide measurement pressures to the sensor diaphragm. The first retaining member has, in an interior thereof, a non-bonded region that is continuous with a peripheral portion of the pressure guiding hole. The non-bonded region in the interior of the first retaining member is provided at a portion of a plane that is parallel to a pressure bearing surface of the sensor diaphragm. The second retaining member is provided with a recessed portion that prevents excessive dislocation of the sensor diaphragm when an excessively large pressure is applied to the sensor diaphragm.

A pressure sensor chip includes a sensor diaphragm that outputs a signal in accordance with a pressure differential, and first and second holding members that face, on peripheral edge portions thereof, one face and another face of a sensor diaphragm, and are in contact therewith. In the peripheral edge portion of the first holding member, in a region that faces the one face of the sensor diaphragm, a region on an outer peripheral side is a region that is bonded to the one face of the sensor diaphragm, and a region on an inner peripheral side is a region that is not bonded to the one face of the sensor diaphragm.

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Tokyo, Japan

Tomohisa Tokuda