Hitachi Chemical Company, Ltd.

Hitachi, Ltd.

Other

Hitachi Chemical, Ltd.

Tomohisa Ohta

Akihiko Dobashi

Yasuyuki Seki

Hisashige Kanbara

Isao Tsukagoshi

Itsuo Watanabe

Kazuyoshi Kojima

Osamu Watanabe

Kenzo Takemura

Yukio Maeda

Masato Taya

Takehisa Yoshikawa

Makoto Satoh

Naoyuki Shiozawa

Isao Ishizawa

Kouji Kobayashi

Yasushi Goto

Yukihisa Hirosawa

Hiroshi Matsuoka

Toshiaki Tanaka

Akira Nagai

Nobuyuki Hayashi

Fumio Inoue

Kazunori Yamamoto

Masaaki Yasuda

Toshiaki Ishimaru

Hajime Kakumaru

Yoshiaki Tsubomatsu

Aizou Kaneda

Toshio Yamazaki

Yutaka Yamaguchi

Atsuo Nakajima

Kiyoshi Nakao

Hiroyuki Hagiwara

Hirotsugu Himori

Hideo Sekine

Hiroto Ohata

A component including a part having a concave and convex configuration for one of the enabling one of light convergence, light diffusion and light diffraction, being formed as a reflective film. The outline of the concave and convex configuration viewed from a right angle relative to a horizontal face has a half moon-shape, and a direction of a straight line part of the half moon-shape of each concave and convex configuration matches a direction of the horizontal face, and a plurality of the concave and convex configurations are combined.

Microlens array, a method for making a transfer master pattern for microlens array, a concave and convex pattern obtained from the transfer master pattern, a laminate for transfer, a diffuse reflection plate and a liquid crystal display device

A microlens array having a substrate and microlenses of a substantially circular profile provided on the substrate and each arranged such that a major axis and a minor axis thereof, which pass through a center of the substantially circular profile and intersect at 90 degrees, are substantially equal in length to each other, and sectional forms at faces vertical to an axis parallel to the major axis or the minor axis are, respectively, made of the same curved shape at any position.

MICROLENS ARRAY, A METHOD FOR MAKING A TRANSFER MASTER PATTERN FOR MICROLENS ARRAY, A CONCAVE AND CONVEX PATTERN OBTAINED FROM THE TRANSFER MASTER PATTERN, A LAMINATE FOR TRANSFER, A DIFFUSE REFLECTION PLATE AND A LIQUID CRYSTAL DISPLAY DEVICE

A microlens configuration having a substantially circular form is constituted of a part of one circle or aspheric curve at any section when a section is taken at a face which is vertical to a major axis or a minor axis of the microlens configuration. A laminate for transfer includes a concave and convex pattern having concave and convex forms of a transfer master pattern, in which a number of such configurations as mentioned above are arranged, transferred to a substrate to be transferred, and a thin film layer laminated on the concave and convex surface thereof wherein a surface of the thin film layer opposite to a surface in contact with a provisional support is used as a bonding face to an application substrate. Moreover, a method for making a diffuse reflector plate comprises the steps of holding the laminate for transfer against the application substrate in contact with the bonding face of the thin film layer, separating the provisional support, and forming a reflective film on the concave and convex surface of the thin film layer.

A connection sheet which firmly bonds electrodes that face each other together by interposing the connection sheet between the electrodes. The connection sheet comprises a first adhesive layer containing a first adhesive having an insulating property and a second adhesive layer containing a second adhesive having an insulating property and a conductive material and placed at least on one side of the first adhesive layer. At the same time of electrode connection, the second adhesive molten has a viscosity equal to or lower than that of the first adhesive when molten. When the electrodes are connected with this structure, the conductive material contained in the second adhesive layer is embedded in the first adhesive layer having relatively high melting viscosity, and part of the conductive material is trapped on the electrodes to be connected in contact therewith. Accordingly, the conductive material can be securely held between the electrodes. Further, since the region between adjacent protruding electrodes contains no air bubbles, connection reliability and excellent moisture resistance is ensured.

Connection sheet and electrode connection structure for electrically interconnecting electrodes facing each other, and method using the connection sheet

Method of production of semiconductor device

An isotropically electroconductive resin film material produced by sticking electroconductive particles to a sticking layer formed on a support and fixing therein, and filling a film-forming resin incompatible with the sticking material among the electroconductive particles, has electroconductivity only in the film thickness direction via the electroconductive particles uniformly dispersed in the plane direction, and is suitable for electrically connecting oppositely placed circuits and fine electrodes of a plurality of electronic parts, and for testing electronic parts.

Anisotropically electroconductive resin film

A connection sheet which firmly bonds electrodes that face each other together by interposing the connection sheet between the electrodes. The connection sheet comprises a first adhesive layer containing a first adhesive having an insulating property and a second adhesive layer placed at least on one side of the first adhesive layer and containing a second adhesive having an insulating property and a conductive material, wherein at the time of electrode connection, the second adhesive molten has a viscosity equal to or lower than that of the first adhesive when molten. When the electrodes are connected with this structure, the conductive material contained in the second adhesive layer is embedded in the first adhesive layer having relatively high melting viscosity, and part of the conductive material is trapped on the electrodes to be connected in contact therewith. Accordingly, the conductive material can be securely held between the electrodes. Further, since the region between adjacent protruding electrodes contains no air bubbles, connection reliability and excellent moisture resistance is ensured.

Connection sheet and electrode connection structure for electrically

Circuit connections can be repaired with high accuracy and high reliability by peeling a mutually connected circuit portion to be repaired and placing a porous sheet with predetermined shape on the peeled circuit surface, impregnating the porous sheet with a peeling solution, removing the porous sheet containing unnecessary adhesive dissolved by the peeling solution, while cleaning the circuit surface contacted with the peeling solution, and reconnecting the cleaned circuit surface to a circuit surface to be connected via an adhesive.

Process for repairing circuit connections

A radiation curable pressure sensitive adhesive composition comprising:

Radiation curable pressure sensitive adhesive composition

A radiation curable pressure-sensitive adhesive composition comprising a liquid oligomer having one or more acrylic double bonds in its molecule, a chain transfer agent and an aliphatic polar monomer having a carboxyl group can give an adhesive tape excellent in rubber-like properties, high in cohesive force and good in adhesiveness at low temperatures.

Radiation curable pressure-sensitive adhesive composition

A radiation curable adhesive composition comprising a liquid oligomer, a chain transfer agent, and an N-methyl compound can give a surface protective film which is slightly influenced in adhesive strength with the lapse of time, and excellent in weather resistance and heat resistance.

Radiation curable adhesive composition for surface protective film

A radiation curable pressure-sensitive adhesive composition comprising 100 parts by weight of a liquid oligomer having one or more acrylic unsaturated double bonds in its molecule, 0.2 to 20 parts by weight of a thiol compound and 0.5 to 30 parts by weight of acrylic monomer has high cohesion and is excellent in adhesiveness.

In a process for producing a radiation curable pressure sensitive adhesive tape, when a quaternary ammonium salt is coated on a substrate as an undercoating before the coating of an adhesive composition comprising a liquid oligomer and a thiol compound, the resulting adhesive tape has good adhesive strength and higher cohesion with no unpleasant odor of the thiol compound.

Process for producing radiation curable adhesive tape

A radiation curable coating media can be cured without using a laminating material prepared otherwise by running a continuous belt-like supporter so as to contact a back side of a portion of the substrate with a front side of a portion of the substrate coated with a coating media to form a laminated portion, wherein curing of the coating media is conducted by irradiation with a radiation in the absence of oxygen.

Process for curing radiation curable coating media

A process for producing adhesive film comprising coating on a filmlike substrate a composition comprising (i) a copolymer having a glass transition temperature of -30.degree. C. or lower and obtained from one or more monomers (a) such as alkyl acrylates or methacrylates, or the like, and another monomers (b) containing at least one carboxyl, alcoholic hydroxyl, or glycidyl group, (ii) a crosslinking agent having at least two crosslinkable functional groups which can react with the monomers (b), (iii) one or more monofunctional addition polymerizable monomers having a boiling point of 200.degree. C. or higher, (iv) one or more polyfunctional addition polymerizable monomers having a boiling point of 200.degree. C. or higher, and (v) a photochemical initiator, and irradiating said composition with actinic light, is advantageous in that the amount of solvent to be removed after coating the composition on the substrate can be reduced remarkably without lowering properties of the resulting adhesive film.

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Nogi, Japan

Tomohisa Ohta