Canon Kabushiki Kaisha

Tomohisa Atsuta

Junichiro Iri

Yusuke Hashimoto

Hiroaki Kusano

Masatomo Ojima

Kyosuke Toda

Yasushi Iijima

Shin Ishimatsu

A liquid cartridge includes a liquid container configured to store a liquid, a lid part configured to cover the liquid container, a liquid holding member stored in the liquid container and configured to hold the liquid, and a projection member connected to the liquid holding member, wherein the liquid holding member has a first surface facing the lid part, wherein the lid part includes an atmosphere communication path that communicates inside and outside of the liquid container, wherein the atmosphere communication path includes an opening that is open to the inside of the liquid container, and wherein the projection member projects from the first surface toward the lid part, and surrounds at least a portion of the opening as viewed from a vertical direction orthogonal to the first surface in which the lid part covers the liquid container.

Liquid cartridge and method for manufacturing the same

A liquid storage container includes a liquid absorber to absorb and hold a liquid, a storage portion storing the liquid absorber, a lid member having ribs, an air communication port provided in the lid member, and a liquid holding path. The storage portion has an opening facing a first surface of the liquid absorber and to be covered by the lid member. The ribs are in contact with the first surface when the lid member covers the opening. The air communication port communicates air to an internal space of the storage portion. The liquid holding path is provided on a rib adjacent to the air communication port and extends toward the lid member from a contact surface of the adjacent rib. The liquid holding path holds a liquid that has oozed from the first surface of the liquid absorber.

Liquid storage container

There is provided an ink container for storing ink inside thereof. A replenishing opening refills the inside with ink. A moving member is disposed in the inside below the replenishing opening in the vertical direction. The moving member moves up and down in the vertical direction with a level of a liquid surface of the ink, stored inside, which moves up and down in the vertical direction.

Ink container and inkjet printer

A liquid ejection head includes a recording element board, a support member that supports the recording element board, and includes a first surface having a plurality of first openings that communicate with a first supply port and a second supply port, a second surface contacting a supply member and having a second opening that communicates with a supply path, and a flow path through which the plurality of first openings and the second opening communicate with each other. The support member includes a beam that is provided between the plurality of first openings and extends from the first surface to middle of the flow path, and in an arrangement direction of the plurality of first openings, a length of the second opening is shorter than a sum of lengths of the plurality of first openings and a length of the beam on the first surface.

Liquid ejection head ejecting liquid, liquid ejection apparatus, and method for manufacturing liquid ejection head

When a filter for example is provided in a liquid supply path in the manufacture of a liquid ejection head, the filter can be prevented from being displaced or deformed. A manufacture method of a liquid ejection head having a liquid ejection unit for ejecting liquid and a liquid supply unit for supplying liquid to the liquid ejection unit has a processing of abutting a filter to a melting unit provided in the liquid supply unit and applying heat to the melting unit via the filter to melt the melting unit to thereby fix the filter to the melting unit, and a processing of burying the melting unit fixed to the filter by molding material.

Liquid ejection head manufacture method and liquid ejection head

A liquid ejection head and a liquid ejection apparatus are configured to suppress degradation in the insulation property of an electrical wiring substrate while preventing an ejection element substrate from being cracked or a wiper from being abraded. As one configuration, a step portion with a step surface having a step between an ejection opening surface and a surface for mounting an electrical wiring substrate thereon in a second support member is provided and a gap between the ejection element substrate and the step portion and a region between the electrical wiring substrate and a stepped surface are sealed by a sealant.

Liquid ejection head and liquid ejection apparatus

A liquid discharge head includes a substrate having discharge energy generating elements generating energy for discharging liquid, a flow path member formed over the substrate and forming a flow path for supplying the liquid, an electric wiring member transmitting a signal for driving the discharge energy generating elements, and an electric connection electrically connecting the substrate to the electric wiring member. The liquid discharge head has a first sealant for sealing under the electric connection, a third sealant for sealing over the electric connection, and a second sealant for sealing side faces where the electric connection is not present, the side faces each being one of side faces of the substrate. An elastic modulus of the third sealant is the largest, that of the first sealant is the second, and that of the second sealant is the smallest. The first and third sealants contain the same type of resin.

Liquid discharge head

A printing head is provided by which, even when the stress is caused by a connecting section between a printing element substrate-side electrode terminal and a lead when the connecting section is heated and is subsequently cooled, the connecting section can be suppressed from having a deteriorated reliability. The printing head is structured so that the electrode pads are connected to the inner leads via stud bumps. The connection between the electrode pad and the stud bump is performed by applying ultrasonic oscillation to the connecting part in the first direction while the electrode pad is having a contact with the stud bump. The connection between the inner lead and the stud bump is performed by applying ultrasonic oscillation to the connecting part in the second direction intersecting with the first direction while the inner lead is having a contact with the stud bump.

Growing community of inventors

Tokyo, Japan

Tomohisa Atsuta